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NXP Semiconductors MC9S08SH4MTJ
- Part No.:
- MC9S08SH4MTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08SH4MTJ.pdf
- Description:
- MICROCONTROLLER, 8-BIT, HC08/S08
- Quantity:
- Payment:
- Shipping:
Inventory:13,795
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Product details
Overview
MC9S08SH4MTJ from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, 12-channel 10-bit ADC, internal 40 MHz clock source (ICS with FLL), and 17 GPIO in a 20-pin TSSOP package rated for -40°C to +125°C. It serves as a low-pin-count, 5V-tolerant embedded controller for fire alarms, personal care devices, and wireless sensor nodes using SMAC.
For engineers reviewing the MC9S08SH4MTJ datasheet, MC9S08SH4MTJ pinout, MC9S08SH4MTJ application, or MC9S08SH4MTJ equivalent, key selection criteria include its integrated temperature sensor, ganged I/O capability on PTB/PTC, COP watchdog with dedicated 1 kHz clock, STOP3-mode ADC trigger via RTI, and flash endurance of 100,000 write/erase cycles with 100-year data retention.
Technical Context
The MC9S08SH4MTJ implements the HCS08 CPU core with 20 MHz bus frequency (40 MHz core), HC08 instruction set compatibility, and support for up to 32 interrupt/reset sources. Its internal clock source (ICS) integrates a frequency-locked loop (FLL) with trimmable internal reference (31.25–39.065 kHz), enabling precise bus clock generation for UART baud rate accuracy and timer intervals.
It features three timer modules: two 16-bit TPMs supporting input capture, output compare, and edge/center-aligned PWM; plus an 8-bit modulo timer (MTIM) with prescaler for periodic software loops. The analog subsystem includes a temperature sensor, bandgap reference channel, and hardware-triggerable ADC with asynchronous clocking in STOP3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40 MHz core / 20 MHz bus - enables 50 ns minimum instruction time at 5V operation |
| Memory | 4 KB on-chip flash (in-application reprogrammable), 256 B RAM - supports field updates without external programming voltage or pins |
| ADC | 12-channel, 10-bit SAR ADC with asynchronous clock source - operates during STOP3 mode using RTI trigger for ultra-low-power sensing |
| Temperature Sensor | Integrated silicon diode-based sensor - delivers calibrated temperature readings without external components, freeing one ADC channel |
| I/O Drive | 17 bidirectional GPIO + 1 output-only line; 10 mA per pin, 60 mA total package limit - drives LEDs directly, eliminating external drivers |
| Clock System | ICS with FLL + trimmable internal reference (±0.5% to –1% over temp/voltage) - replaces external crystal for cost-sensitive 5V systems |
| Watchdog | COP with selectable 1 kHz internal clock or bus clock - provides fail-safe reset independent of main clock integrity |
Pinout & Package
MC9S08SH4MTJ is housed in a 20-pin TSSOP (Thin Shrink Small Outline Package) with 0.65 mm pitch, JEDEC MO-153 compliant, body size 6.5 × 4.4 mm, and thermal pad option not included. Pinout validated per Freescale document MC9S08SH84FS REV 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5V supply pins with decoupling requirement - ensures stable operation across full -40°C to +125°C range |
| XTAL, EXTAL | External crystal/resonator interface | Supports 31.25 kHz–16 MHz crystals or ceramic resonators - optional external timing source when higher precision than ICS is required |
| PTA0–PTA7 | Port A bidirectional I/O | 8-bit port with software-selectable pull-ups and slew rate control - reduces EMI and eliminates external bias resistors |
| PTB0–PTB5 | Port B bidirectional I/O | 6-bit port including ganged output capability (PTB5:2) - single register write toggles up to four pins simultaneously |
| PTC0–PTC3 | Port C bidirectional I/O | 4-bit port with ganged output (PTC3:0) - enables synchronized control of multiple loads (e.g., LED banks, relay drivers) |
| IRQ | Interrupt request input | Edge-sensitive active-low interrupt pin with internal pull-up - supports wake-from-STOP on external event without external pull-up resistor |
| RESET | Active-low reset input | Asynchronous reset with internal POR circuitry - prevents brownout-induced code runaway |
| DBG | Background debug pin | Single-wire debug interface - enables in-circuit emulation and flash programming without JTAG header |
Key Features
| Feature | Design Value |
|---|---|
| Ganged I/O on PTB and PTC | Single register write controls up to eight pins across two ports - simplifies firmware for multi-LED indicators or parallel actuator control |
| STOP3-mode ADC trigger | RTI counter initiates ADC conversion autonomously while CPU is halted - enables sub-1 µA sleep current with periodic sensor sampling |
| On-chip temperature sensor | Calibrated silicon junction sensor with ±3°C accuracy - replaces external thermistor in battery-free or sealed enclosures |
| Flash EEPROM emulation | 100,000 write/erase cycles with 100-year data retention - allows wear-leveling algorithms to emulate nonvolatile parameter storage without external EEPROM |
| Hardware COP with 1 kHz clock | Dedicated oscillator maintains watchdog timing even if bus clock fails - critical for fire alarm and security system reliability |
Applications
| Fire Alarm Control Unit | Personal Care Device MCU |
|---|---|
Use Scenario: Standalone smoke/heat detector with local siren, self-test, and battery backup monitoring. IC Role / Device Role / Timing Role: Primary system controller executing sensor polling, alarm logic, and low-power wake-on-event sequencing. Use Value: Integrated COP with independent 1 kHz clock ensures fail-safe reset during power brownout; temperature sensor enables ambient compensation without added BOM cost. | Use Scenario: Rechargeable electric toothbrush with pressure sensing, brushing timer, and LED status feedback. IC Role / Device Role / Timing Role: Main MCU managing motor PWM, capacitive touch inputs, and battery charge state via ADC. Use Value: Ganged I/O drives multi-color LED array with single register write; 10 mA per pin eliminates discrete LED drivers, reducing PCB area and BoM count. |
| Wireless Sensor Node (SMAC) | Secure Boot Coprocessor |
Use Scenario: Battery-powered environmental monitor transmitting temperature/humidity via low-duty-cycle RF link. IC Role / Device Role / Timing Role: Sensor interface and scheduler controlling ADC sampling, data formatting, and radio wake-up timing. Use Value: STOP3-mode ADC triggered by RTI achieves <1 µA average current; internal bandgap reference ensures consistent ADC accuracy across voltage drop. | Use Scenario: Trusted execution companion for a host MCU, verifying firmware signature before boot and guarding secure keys. IC Role / Device Role / Timing Role: Dedicated security coprocessor performing hash verification and flash block protection during boot sequence. Use Value: Flash block protection and illegal opcode detection prevent unauthorized code injection; 4 KB flash stores verified bootloader with tamper-resistant configuration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SH8MTJ | 8 KB flash, 512 B RAM, identical pinout and peripherals - double flash capacity with no layout change | Required where firmware exceeds 4 KB or EEPROM emulation needs larger wear-leveling pool | Select when future firmware growth or enhanced logging capability is anticipated |
| MC9S08AW60CFUE | 48-pin LQFP, 60 KB flash, CAN 2.0B interface, 16-channel ADC - significantly larger package and feature set | Suitable for automotive body control modules requiring CAN communication and higher I/O count | Choose only if CAN bus integration or >20 GPIO are mandatory; not pin-compatible |
Compared with MC9S08SH8MTJ, the MC9S08SH4MTJ trades flash capacity for lower cost and smaller footprint in space-constrained consumer devices; versus MC9S08AW60CFUE, it offers minimal BOM cost and thermal profile but lacks CAN and requires external interface bridging for networked systems.
Availability
MC9S08SH4MTJ is available at Aetrix Electronics and suitable for fire alarms, personal care devices, wireless sensor nodes, and secure boot coprocessor designs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S08SH4MTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S08SH4MTJ belongs to the S08SH family - designed specifically for cost-sensitive, low-pin-count 5V embedded control in consumer and industrial applications where robust analog integration, ultra-low-power sleep modes, and field-programmable flash are essential.
FAQ
What is the maximum operating voltage for the MC9S08SH4MTJ?
The MC9S08SH4MTJ supports a supply voltage range of 2.7 V to 5.5 V, with full specification compliance up to 5 V. Its I/O structure and internal regulators are optimized for 5 V operation, making it suitable for legacy AC-powered consumer goods and industrial sensors that lack dedicated 3.3 V regulation. This 5 V tolerance eliminates level-shifting requirements when interfacing with standard TTL or CMOS peripherals.
Does the MC9S08SH4MTJ support in-system programming without external hardware?
Yes, the MC9S08SH4MTJ supports in-application reprogramming of its 4 KB flash memory using a single 5 V supply - no additional programming voltage or dedicated pins are required. The on-chip background debug (DBG) interface enables flash updates via a single-wire connection, compatible with USBMULTILINKBDM and DEMO9S08SH8 tools. This capability allows field firmware upgrades and eliminates the need for socketed programming in production.
How does the ganged I/O feature work on the MC9S08SH4MTJ?
The MC9S08SH4MTJ provides ganged output capability on PTB5:2 and PTC3:0 - writing to a single register bit simultaneously toggles all associated pins in that group. This function is implemented in hardware and remains active even during low-power STOP modes. It is commonly used to drive multi-segment LEDs or parallel-connected MOSFET gates without software bit-banging overhead or risk of partial-state transitions during interrupt latency.
Can the MC9S08SH4MTJ operate its ADC while in STOP3 low-power mode?
Yes, the MC9S08SH4MTJ's ADC can be triggered autonomously in STOP3 mode using the real-time interrupt (RTI) counter. The ADC clock is derived from an asynchronous source, allowing conversions to occur without waking the CPU. When combined with the automatic compare function, the MCU can remain in STOP3 until a sensor reading crosses a defined threshold - enabling ultra-low-power wake-on-event behavior ideal for battery-operated wireless sensors.
What debug interfaces are supported by the MC9S08SH4MTJ?
The MC9S08SH4MTJ integrates a single-wire background debug (BDM) interface accessible via the DBG pin. It supports full in-circuit debugging, flash programming, and real-time bus capture without requiring JTAG headers or external emulators. Compatible tools include USBMULTILINKBDM, M68CYCLONEPRO, and the DEMO9S08SH8 evaluation board - all leveraging the same on-chip ICE module documented in Freescale's MC9S08SH84FS fact sheet.
MC9S08SH4MTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 17
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08SH4MTJ FAQ
1.How can I place an order for MC9S08SH4MTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08SH4MTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08SH4MTJ reliable?
The price and inventory of MC9S08SH4MTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH4MTJ is usually 5 days.
3.What payment methods are accepted for MC9S08SH4MTJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH4MTJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08SH4MTJ?
MC9S08SH4MTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08SH4MTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08SH4MTJ?
For technical support, including MC9S08SH4MTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH4MTJ requirements.
6.How does Aetrix verify that MC9S08SH4MTJ is sourced from the original manufacturer or authorized distributors?
All MC9S08SH4MTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH4MTJ meets industry standards.
7.What is the process for return or replacement of MC9S08SH4MTJ?
All MC9S08SH4MTJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH4MTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08SH4MTJ part is unused and in its original packaging.
Return procedure for MC9S08SH4MTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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