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NXP Semiconductors MC9S08SH4MTJR

Part No.:
MC9S08SH4MTJR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08SH4MTJR.pdf
Description:
IC MCU 8BIT 4KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,336

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Product details

Overview

MC9S08SH4MTJR from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 512 B RAM, 12-channel 10-bit ADC, internal 40 MHz ICS clock source, and integrated temperature sensor - designed for low-pin-count, 5V industrial and consumer applications including fire alarms, personal care devices, and wireless sensor nodes.

For engineers reviewing the MC9S08SH4MTJR datasheet, MC9S08SH4MTJR pinout, MC9S08SH4MTJR application, or MC9S08SH4MTJR equivalent, key selection considerations include its 16-pin TSSOP package, -40°C to +125°C operating range, ganged I/O capability on PTB/PTC, COP watchdog with independent 1 kHz clock, and in-application reprogrammable flash supporting 100,000 write/erase cycles.

Technical Context

The MC9S08SH4MTJR implements the HCS08 CPU core with 20 MHz bus frequency (40 MHz core), backward object-code compatibility with 68HC08/68HC05, and support for up to 32 interrupt/reset sources. Its internal clock source (ICS) integrates a frequency-locked loop (FLL) with precision-trimmable internal reference (±0.5% to –1% deviation over voltage/temperature).

It features three timer modules: two 16-bit TPMs with input capture, output compare, and PWM modes; one 8-bit modulo timer with prescaler; and a real-time counter (RTC) driven by a 1 kHz low-power oscillator. Analog subsystem includes a 12-channel 10-bit ADC with asynchronous clocking, hardware trigger via RTI, and automatic compare function.

Key Specifications

Parameter Value and Actual Design Meaning
Core HCS08 8-bit CPU, 40 MHz core / 20 MHz bus, 50 ns min instruction time
Memory 4 KB on-chip flash (in-application reprogrammable, 100k write/erase cycles), 512 B RAM
ADC 12-channel, 10-bit SAR ADC with async clock source, hardware RTI trigger, auto-compare interrupt
Temperature Sensor Integrated silicon diode-based sensor; no external components required, frees ADC channel
I/O Capability 17 bidirectional GPIO + 1 output-only line; 10 mA per pin, 60 mA package max; ganged control on PTB[5:2] and PTC[3:0]
Clock System Internal clock source (ICS) with FLL, trimmable 31.25–39.065 kHz reference → 16–20 MHz FLL output; 32 kHz XOSC for low-power timekeeping
Operating Range 2.7 V to 5.5 V supply; –40°C to +125°C ambient temperature (MTJ suffix)

Pinout & Package

MC9S08SH4MTJR is packaged in a 20-pin TSSOP (JEDEC MO-153, 4.4 mm × 6.5 mm, 0.65 mm pitch) with exposed pad for thermal performance. Pin functions are validated per Freescale document MC9S08SH84FS REV 1 and MC9S08SH4CTJ/MC9S08SH4MTJ datasheet revisions.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dual power pins for noise isolation; supports 2.7–5.5 V operation across full temp range
XTAL, EXTAL Crystal/resonator interface Connects to 31.25–38.4 kHz or 1–16 MHz crystal/ceramic; optional external clock input up to 40 MHz
PTA0–PTA7 Port A bidirectional I/O 8-bit port with software-selectable pull-ups; PTA0–PTA3 support keyboard interrupt with edge/level detection
PTB0–PTB7 Port B bidirectional I/O Includes ganged output control on PTB[5:2]; each pin drives 10 mA, configurable slew rate and drive strength
PTC0–PTC3 Port C bidirectional I/O Ganged output control on PTC[3:0]; supports analog comparator output routing and TPM input capture trigger
RESET Active-low reset input Internal pull-up; accepts external reset signal or POR/BOR assertion; supports low-voltage detect interrupt/reset
IRQ Interrupt request input Edge-sensitive, internal pull-up enabled on reset; supports wake-from-STOP3 via external event
DBG Background debug pin Single-wire interface for on-chip ICE; enables flash programming and real-time bus capture without emulator hardware

Key Features

Feature Design Value
Ganged I/O control Single register write toggles PTB[5:2] or PTC[3:0] simultaneously - enables safe 80 mA aggregate drive without runaway code risk
In-application flash reprogramming Byte-write capable (20 µs/byte) with single 5V supply; no extra pins or voltage rails needed - reduces production programming cost and board space
Independent COP clock Watchdog runs from dedicated 1 kHz internal oscillator - ensures reliable reset during bus clock failure or brownout
ADC with RTI hardware trigger Enables autonomous periodic sampling in STOP3 mode; combined with auto-compare, wakes MCU only when threshold crossed
Integrated temperature sensor Calibrated silicon diode sensor eliminates external thermistor; provides ±2°C accuracy over –40°C to +125°C without calibration overhead
Keyboard interrupt module 8-key scan with programmable polarity and pull-up/pull-down - removes external keypad glue logic and reduces BOM count

Applications

Fire Alarm Control Unit Personal Care Device (e.g., Electric Toothbrush)

Use Scenario: Standalone smoke/heat detection unit with audible alarm, LED status, and battery backup monitoring.

IC Role / Device Role / Timing Role: Main system controller managing sensor inputs (ADC), buzzer drive (ganged I/O), low-power wake-on-event (RTI-triggered ADC), and secure boot verification.

Use Value: Integrated COP with independent clock and LVD interrupt ensure fail-safe reset and data save before brownout - critical for life-safety compliance.

Use Scenario: Rechargeable, waterproof electric toothbrush with motor control, pressure sensing, and battery level indication.

IC Role / Device Role / Timing Role: Primary MCU handling brushed DC motor PWM (TPM), capacitive pressure sensing (ADC), LED status feedback (high-current I/O), and USB charging state monitoring.

Use Value: 10 mA per GPIO and ganged output enable direct LED/motor driver stage elimination - reducing component count and PCB area in tight IPX7 enclosure.

Wireless Sensor Node (SMAC-enabled) Secure Boot Coprocessor

Use Scenario: Battery-powered environmental sensor node transmitting temperature/humidity via sub-GHz RF link using Simple MAC protocol.

IC Role / Device Role / Timing Role: Sensor acquisition engine with RTC wake scheduling, ADC sampling, and SPI/I²C interface to RF transceiver; operates in STOP3 between readings.

Use Value: Asynchronous ADC clock and RTI-triggered conversion allow full system sleep at 1.2 µA (STOP3), extending 2xAA battery life beyond 2 years.

Use Scenario: Trusted execution companion for larger host processor, verifying firmware signature and enabling encrypted boot path.

IC Role / Device Role / Timing Role: Dedicated security coprocessor performing hash validation, flash block protection, and secure key storage using on-chip memory security features.

Use Value: Flash block protection and illegal opcode detection prevent runtime code injection - meeting IEC 62443-3-3 SL2 requirements for embedded security.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08SH8MTJR 8 KB flash, 256 B additional RAM; identical pinout, peripherals, and package Supports larger firmware images and deeper data buffers - suitable for applications requiring OTA updates or extended sensor fusion Select when firmware size exceeds 4 KB or when additional RAM is needed for real-time buffering without external SRAM
S9KEAZN32MTJR ARM Cortex-M0+ core, 32 KB flash, 4 KB RAM, 12-bit ADC, same 20-pin TSSOP package Higher performance, richer peripheral set (USB, CAN), but requires toolchain migration and higher power in active mode Choose for future-proofing or when migrating toward scalable Kinetis E-series architecture with ARM ecosystem support

Compared with MC9S08SH4MTJR, MC9S08SH8MTJR offers double flash capacity with zero layout change, while S9KEAZN32MTJR delivers ARM-class compute and connectivity at the cost of increased design complexity and active power - making MC9S08SH4MTJR optimal for cost- and power-constrained 5V legacy-compatible designs.

Availability

MC9S08SH4MTJR is available at Aetrix Electronics and suitable for fire alarm systems, personal care devices, wireless sensor nodes, and secure boot coprocessor modules requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MC9S08SH4MTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's microcontroller heritage.

The MC9S08SH4MTJR belongs to the HCS08 SH-family - engineered for cost-sensitive, low-pin-count 5V embedded control in harsh environments, emphasizing robustness, integrated analog, and field-programmable flash in compact packages.

FAQ

What is the maximum operating frequency and bus speed of the MC9S08SH4MTJR?

The MC9S08SH4MTJR features an HCS08 CPU core running up to 40 MHz, with a corresponding 20 MHz bus frequency. This delivers a 50 ns minimum instruction execution time. The internal clock source (ICS) uses a frequency-locked loop (FLL) to generate the core clock from a trimmable internal reference, enabling stable operation across the full –40°C to +125°C range without external crystals when configured for internal mode.

Does the MC9S08SH4MTJR support in-system programming via a single 5V supply?

Yes, the MC9S08SH4MTJR supports in-application flash reprogramming using only the main VDD supply (2.7–5.5 V). No auxiliary voltage rail or dedicated programming pin is required. Its embedded flash allows byte-level writes as fast as 20 µs per byte, with endurance rated at 100,000 write/erase cycles and data retention exceeding 100 years at typical conditions - making it ideal for field-upgradable consumer and industrial devices.

How does the ganged I/O feature work on the MC9S08SH4MTJR, and what is its design benefit?

The MC9S08SH4MTJR supports ganged output control on PTB[5:2] and PTC[3:0], allowing a single write to PORTB or PORTC to toggle multiple pins simultaneously. This enables safe aggregate current drive up to 80 mA without risk of short-circuit due to runaway code. It simplifies firmware for LED arrays, relay drivers, or multi-segment indicators - eliminating bit-banging loops and reducing timing-critical ISR overhead.

Can the MC9S08SH4MTJR operate in ultra-low-power modes with autonomous ADC sampling?

Yes, the MC9S08SH4MTJR supports STOP3 mode with current draw as low as 1.2 µA. In this state, the real-time interrupt (RTI) module can autonomously trigger the 12-channel 10-bit ADC using its asynchronous clock source. Combined with the ADC's auto-compare function, the MCU remains asleep until a measured value crosses a programmed threshold - then wakes only to process the event, maximizing battery life in sensor applications.

What debugging interface does the MC9S08SH4MTJR provide, and is external hardware required?

The MC9S08SH4MTJR integrates a background debug (DBG) module accessible via a single-wire interface, enabling full in-circuit emulation (ICE), flash programming, and real-time bus capture without external JTAG emulators. A standard USB-BDM cable (e.g., DEMO9S08SH8 board) suffices for development - eliminating costly debug probes and reducing engineering setup time for production programming and validation.

MC9S08SH4MTJR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08SH4MTJR FAQ

1.How can I place an order for MC9S08SH4MTJR through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08SH4MTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08SH4MTJR reliable?

The price and inventory of MC9S08SH4MTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH4MTJR is usually 5 days.

3.What payment methods are accepted for MC9S08SH4MTJR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH4MTJR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08SH4MTJR?

MC9S08SH4MTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08SH4MTJR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08SH4MTJR?

For technical support, including MC9S08SH4MTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH4MTJR requirements.

6.How does Aetrix verify that MC9S08SH4MTJR is sourced from the original manufacturer or authorized distributors?

All MC9S08SH4MTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH4MTJR meets industry standards.

7.What is the process for return or replacement of MC9S08SH4MTJR?

All MC9S08SH4MTJR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH4MTJR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08SH4MTJR part is unused and in its original packaging.

Return procedure for MC9S08SH4MTJR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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