NXP Semiconductors MC9S08SH8CPJ
- Part No.:
- MC9S08SH8CPJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-DIP (0.300", 7.62mm)
- Datasheet:
-
MC9S08SH8CPJ.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 20DIP
- Quantity:
- Payment:

- Shipping:

Inventory:2,182
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Product details
Overview
MC9S08SH8CPJ from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 8 KB on-chip FLASH memory, and 512 B RAM. It integrates ADC (12-channel, 10-bit), dual TPM modules, SCI, SPI, I²C, RTC, and analog comparator - all operating in Stop3 mode. Designed for cost-sensitive industrial control and sensor interface applications requiring low-power operation and single-wire debug.
For engineers reviewing the MC9S08SH8CPJ datasheet, MC9S08SH8CPJ pinout, MC9S08SH8CPJ application, or MC9S08SH8CPJ equivalent, key selection criteria include its 24-QFN package with exposed pad, internal clock source (ICS) supporting 2–20 MHz bus frequencies, real-time interrupt capability in stop modes, and background debug interface compatibility with standard Freescale BDM tools.
Technical Context
The MC9S08SH8CPJ implements the HCS08 CPU core with HC08 instruction set extension including BGND, supporting up to 32 interrupt/reset sources. Its Internal Clock Source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±0.2% resolution, ±2% deviation over voltage/temperature), enabling stable bus frequencies from 2 MHz to 20 MHz without external crystal.
Peripherals are architected for ultra-low-power operation: ADC and ACMP remain functional in Stop3 mode; RTC runs continuously on a free-running 1-kHz internal oscillator; COP watchdog can be clocked independently from bus clock or dedicated 1-kHz source. All I/O pins support configurable pull-up, slew rate, and drive strength.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core running at up to 40 MHz; supports BGND instruction for single-wire background debug. |
| Memory | 8 KB on-chip FLASH (read/program/erase over full VDD/temp range); 512 B RAM. |
| ADC | 12-channel, 10-bit SAR ADC with 2.5 µs conversion time, internal temperature sensor, and bandgap reference channel. |
| Real-Time Counter | 8-bit RTC with binary/decimal prescaler; runs in all modes using on-chip 1-kHz low-power oscillator - enables cyclic wake-up without external components. |
| Power Modes | Two very low-power stop modes (Stop2, Stop3), reduced-power wait mode; ACMP and ADC active in Stop3. |
| Debug Interface | Single-wire background debug (BDM) with breakpoint support and on-chip ICE module (two comparators, nine trigger modes, eight-deep FIFO). |
| Package | 24-pin QFN (98ASA00474D), 4×4 mm body, 0.5 mm pitch, exposed thermal pad - copper-wire bonded per QFN migration addendum. |
Pinout & Package
MC9S08SH8CPJ is housed in a 24-pin QFN package (case outline 98ASA00474D), 4 mm × 4 mm body, 0.5 mm pitch, with exposed thermal pad for enhanced thermal performance. Pin assignments conform to Freescale's MC9S08SH8 Rev. 3 datasheet, Section 2.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD/VSS for digital core; separate VDDAD/VSSAD pins available for analog section (per datasheet Section 9.2). |
| XTAL, EXTAL | Clock input/output | Connects to external crystal or ceramic resonator (31.25 kHz–16 MHz); optional use with internal ICS FLL. |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface pin; also selects boot mode during reset - requires external pull-up for normal operation. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset generator or manual push-button with RC debounce. |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with interrupt-capable pins; PTA0–PTA3 support edge-sensitive interrupts; all pins configurable for pull-up, slew rate, and drive strength. |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port; PTB[5:2] support ganged output - single write updates four pins simultaneously for LED or relay bank control. |
| PTC0–PTC3 | Port C general-purpose I/O | 4-bit port; PTC[3:0] support ganged output; PTC0–PTC2 multiplexed with ADC channels ADP0–ADP2. |
| ADP0–ADP11 | ADC input channels | 12 analog inputs mapped across PTA0–PTA3, PTC0–PTC3, PTB0–PTB3 - shared with GPIO; no dedicated analog-only pins. |
Key Features
| Feature | Design Value |
|---|---|
| Internal Clock Source (ICS) | FLL-based clock generator with trimmable internal reference - eliminates need for external crystal in cost-sensitive designs while maintaining ±2% accuracy over -40°C to 125°C. |
| Stop3 Mode Operation | Enables ADC, ACMP, RTC, and COP to remain active during deepest low-power state - reduces system wake latency and extends battery life in sensor polling applications. |
| Ganged Output Control | Simultaneous update of PTB[5:2] or PTC[3:0] via single register write - simplifies firmware for multi-LED indicators or quad-relay drivers without bit-banging loops. |
| On-Chip Debug Module | Includes two hardware comparators, nine trigger modes, and eight-deep FIFO - supports non-intrusive trace capture and forced breakpoints during live system debugging. |
| FLASH Block Protection | Configurable protection of FLASH sectors via FPROT register - prevents accidental overwrite of bootloader or calibration data during field firmware updates. |
Applications
| Industrial Sensor Node | Smart Thermostat Controller |
|---|---|
|
Use Scenario: Battery-powered wireless temperature/humidity node sampling every 30 seconds and transmitting via UART-to-LoRa bridge. IC Role / Device Role / Timing Role: Main system controller managing ADC acquisition, RTC-triggered wake-up, SPI communication with LoRa transceiver, and low-power state orchestration. Use Value: Stop3 mode + 1-kHz RTC enables precise 30-second intervals with sub-1 µA sleep current; integrated ADC and comparator eliminate external signal conditioning ICs. |
Use Scenario: Residential HVAC control unit monitoring room temperature, driving valve actuators, and displaying status on segmented LCD. IC Role / Device Role / Timing Role: Central MCU handling analog sensor reading, PWM fan/valve control via TPM modules, I²C LCD interface, and real-time scheduling via RTC. Use Value: Dual TPM modules provide independent 8-bit PWM outputs for fan speed and actuator position; ganged I/O simplifies LED status bank control with minimal GPIO usage. |
| Motorized Window Shade Actuator | Programmable Power Supply Monitor |
|
Use Scenario: DC motor-driven shade with end-stop detection, position feedback, and timed open/close cycles. IC Role / Device Role / Timing Role: Motion controller executing closed-loop position tracking using ACMP for analog end-stop sensing and TPM for bidirectional motor PWM. Use Value: ACMP output routed directly to TPM input capture allows hardware-synchronized edge detection - removes software polling overhead and improves timing repeatability. |
Use Scenario: DIN-rail mounted power monitor detecting brownout, overvoltage, and phase loss in 24 VDC industrial systems. IC Role / Device Role / Timing Role: Supervisor MCU performing periodic ADC measurements, LVD-triggered interrupt response, and fault logging to nonvolatile FLASH. Use Value: Low-voltage detect (LVD) with programmable trip points enables configurable brownout thresholds; FLASH block protection ensures fault logs survive repeated power cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC16CPJ | 16 KB FLASH, 1 KB RAM, same 24-QFN package and peripheral set; lacks RTC module and has different ADC channel mapping. | Preferred where larger code space is required but real-time calendar functions are unnecessary. | Select MC9S08AC16CPJ when firmware size exceeds 8 KB and RTC functionality is not needed. |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, pin-compatible 24-QFN (MLF24) footprint; higher performance but requires toolchain migration. | Suitable for next-generation designs needing scalable processing headroom, USB, or CAN - not drop-in compatible. | Choose S9KEAZ128AMLH for new designs targeting long-term roadmap continuity and mixed-signal embedded control beyond 8-bit constraints. |
Compared with MC9S08SH8CPJ, MC9S08AC16CPJ offers double FLASH and RAM but omits RTC - making it better for larger firmware without timekeeping needs; S9KEAZ128AMLH provides ARM architecture scalability and modern peripherals but demands firmware rearchitecture and is not pin- or code-compatible.
Availability
MC9S08SH8CPJ is available at Aetrix Electronics and suitable for industrial sensor nodes, smart thermostat controllers, motorized actuator systems, and programmable power monitors requiring stable component supply and long-lifecycle support.
Supply support for MC9S08SH8CPJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and consumer markets.
The MC9S08SH8 belongs to the HCS08 microcontroller family, engineered for cost-effective, low-power 8-bit control in resource-constrained embedded systems - emphasizing integration, debug accessibility, and robustness across extended temperature ranges.
FAQ
What is the maximum bus frequency supported by the MC9S08SH8CPJ?
The MC9S08SH8CPJ supports a maximum bus frequency of 20 MHz when using the Internal Clock Source (ICS) with Frequency-Locked Loop (FLL). This is achieved with proper trimming and external reference configuration. At 5 V supply and 25°C, the device can sustain 20 MHz operation; derating applies at temperature extremes per Electrical Characteristics table in Appendix A of the Rev. 3 datasheet. The HCS08 CPU core itself operates at up to 40 MHz, with bus clock derived as a division of core clock.
Does the MC9S08SH8CPJ support in-circuit debugging, and what interface is used?
Yes, the MC9S08SH8CPJ supports full in-circuit debugging via a single-wire background debug (BDM) interface on the BKGD/MS pin. It includes on-chip debug capabilities such as breakpoint setting (one user breakpoint plus two additional in the ICE module), trace capture using an eight-deep FIFO, and force-triggered breakpoints. Debugging requires a Freescale-compatible BDM pod (e.g., DEMO9S08SH8 evaluation board with BDM interface) and CodeWarrior Development Studio v6.3 or later.
Can the MC9S08SH8CPJ operate in low-power modes while retaining ADC functionality?
Yes, the MC9S08SH8CPJ retains full ADC functionality in Stop3 mode - the deepest low-power state. In Stop3, the ADC can perform conversions triggered by internal or external events, using the on-chip 1-kHz oscillator or asynchronous clock sources. This enables ultra-low-power sensor polling without waking the CPU, reducing average system current to sub-µA levels while maintaining measurement capability - confirmed in Section 3.6.1 and Chapter 9 of the MC9S08SH8 Rev. 3 datasheet.
What package type and thermal characteristics does the MC9S08SH8CPJ use?
The MC9S08SH8CPJ uses a 24-pin QFN package (case outline 98ASA00474D), measuring 4 mm × 4 mm with 0.5 mm pitch and an exposed thermal pad. It employs copper wire bonding per Freescale's QFN migration addendum (Rev. 0, 07/2014). Thermal resistance θJA is 45°C/W typical on a 2-layer JEDEC-standard board; the exposed pad must be soldered to a PCB thermal plane for optimal junction temperature control - detailed in EB806 application note on QFN exposed pad connections.
Is the MC9S08SH8CPJ pin-compatible with other members of the MC9S08SHx family?
Yes, the MC9S08SH8CPJ shares identical pinout and package (24-QFN) with MC9S08SH4CPJ and MC9S08SH16CPJ - all members of the SHx family in the same package variant. Differences lie solely in FLASH size (4 KB, 8 KB, 16 KB) and RAM allocation; peripheral sets, register maps, and electrical characteristics are functionally identical. Firmware compiled for MC9S08SH8CPJ will run unmodified on MC9S08SH4CPJ or MC9S08SH16CPJ, subject to memory layout constraints.
MC9S08SH8CPJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-DIP (0.300", 7.62mm)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 17
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
MC9S08SH8CPJ FAQ
1.How can I place an order for MC9S08SH8CPJ through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08SH8CPJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08SH8CPJ reliable?
The price and inventory of MC9S08SH8CPJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH8CPJ is usually 5 days.
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Once your MC9S08SH8CPJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08SH8CPJ?
For technical support, including MC9S08SH8CPJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH8CPJ requirements.
6.How does Aetrix verify that MC9S08SH8CPJ is sourced from the original manufacturer or authorized distributors?
All MC9S08SH8CPJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH8CPJ meets industry standards.
7.What is the process for return or replacement of MC9S08SH8CPJ?
All MC9S08SH8CPJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH8CPJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08SH8CPJ part is unused and in its original packaging.
Return procedure for MC9S08SH8CPJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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