NXP Semiconductors MC9S08SH8CTGR
- Part No.:
- MC9S08SH8CTGR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08SH8CTGR.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08SH8CTGR from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 8 KB flash memory, and 512 B RAM. It integrates ADC (12-channel, 10-bit), dual TPM modules, SCI, SPI, I²C, RTC, and analog comparator - all operating in Stop3 mode. Designed for cost-sensitive embedded control in automotive body electronics and industrial sensors.
For engineers reviewing the MC9S08SH8CTGR datasheet, MC9S08SH8CTGR pinout, MC9S08SH8CTGR application, or MC9S08SH8CTGR equivalent, key selection criteria include QFN-24 package compatibility, internal clock source (ICS) with FLL supporting 2–20 MHz bus frequency, low-voltage detection with interrupt/reset, and single-wire background debug interface for in-circuit development.
Technical Context
The MC9S08SH8CTGR implements the HCS08 CPU core with HC08 instruction set extension including BGND, supporting up to 32 interrupt/reset sources. Its Internal Clock Source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (0.2% resolution, ±2% deviation over voltage/temperature) to generate stable bus clocks from 2 MHz to 20 MHz.
Peripherals operate across power modes: ADC and ACMP remain functional in Stop3 mode using the on-chip 1-kHz low-power oscillator; RTC runs free-running on the same oscillator for cyclic wake-up without external components; SCI supports LIN master break generation and slave break detection, enabling automotive sub-network communication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core, 40-MHz max operation - enables deterministic real-time control with low latency interrupt response. |
| Flash Memory | 8 KB on-chip flash with read/program/erase over full voltage/temperature range - supports field firmware updates without external programming hardware. |
| RAM | 512 bytes of on-chip RAM - sufficient for stack, variables, and small buffers in sensor node or actuator control applications. |
| ADC | 12-channel, 10-bit SAR ADC with 2.5 µs conversion time and internal temperature sensor - enables local thermal monitoring and analog signal acquisition without external ICs. |
| RTC | 8-bit real-time counter with binary/decimal prescaler and free-running 1-kHz internal oscillator - provides time-of-day or periodic wake-up in all MCU modes, including Stop3. |
| Debug Interface | Single-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module - allows non-intrusive debugging in space-constrained PCB layouts. |
| Package | 24-pin QFN (98ASA00474D), 4×4 mm, 0.5 mm pitch, exposed thermal pad - optimized for compact automotive and industrial modules requiring thermal efficiency. |
Pinout & Package
MC9S08SH8CTGR is housed in a 24-pin QFN package (case outline 98ASA00474D) with 4×4 mm footprint, 0.5 mm lead pitch, and exposed thermal pad for enhanced thermal dissipation in thermally constrained environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDAD, VREFH | Power supply inputs | Separate digital (VDD), analog (VDDAD), and reference (VREFH) rails reduce noise coupling into ADC and analog peripherals. |
| VSS, VSSAD, VREFL | Ground returns | Dedicated analog ground (VSSAD) and reference low (VREFL) improve ADC accuracy and comparator stability. |
| XTAL, EXTAL | Crystal oscillator terminals | Supports 31.25 kHz–16 MHz crystals/resonators for precise timing or external clock injection. |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface for programming and debugging; also selects boot mode at reset. |
| PTA0–PTA7 | Port A GPIOs | 8-bit general-purpose port with configurable pull-ups, slew rate, drive strength, and interrupt capability on all pins. |
| PTB0–PTB7 | Port B GPIOs | 8-bit port with ganged output option on PTB[5:2] - enables synchronized control of multiple outputs (e.g., LED banks or relay drivers). |
| PTC0–PTC3 | Port C GPIOs | 4-bit port with ganged output on PTC[3:0]; supports peripheral multiplexing including SCI, SPI, I²C, TPM, and ADC channel inputs. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signals or watchdog timeout assertion. |
Key Features
| Feature | Design Value |
|---|---|
| Internal Clock Source (ICS) with FLL | Generates 2–20 MHz bus clock from internal reference, eliminating need for external crystal in cost-sensitive designs while maintaining ±2% accuracy over temp/voltage. |
| Stop3 Low-Power Mode | Retains RAM, RTC, ADC, and ACMP functionality while drawing <2 µA - enables battery-powered wake-on-event sensing without external supervisors. |
| On-Chip Analog Comparator (ACMP) | Configurable edge-triggered interrupt, selectable internal bandgap reference, and output routable to TPM - supports zero-crossing detection and analog threshold monitoring without CPU intervention. |
| LIN-Compatible SCI Module | Supports LIN master extended break generation and slave extended break detection per LIN 2.0 spec - enables direct integration into automotive body control networks. |
| FLASH Block Protection | Hardware-enforced write/erase protection for bootloader and critical configuration sectors - prevents accidental corruption during field firmware updates. |
Applications
| Automotive Door Module | Industrial Temperature Sensor Node |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller executing motor sequencing, LIN communication with body ECU, and analog monitoring of switch states and thermistors. Use Value: Integrated ADC, LIN-capable SCI, and Stop3 mode enable single-chip implementation with <2 µA sleep current and robust in-vehicle communication. | Use Scenario: Wireless-capable environmental monitor deployed in HVAC ducts or factory machinery enclosures. IC Role / Device Role / Timing Role: Signal conditioner and scheduler - acquires thermistor/RTD data via ADC, computes compensated readings, and triggers RF transmission at scheduled intervals using RTC. Use Value: On-chip temperature sensor, 1-kHz RTC oscillator, and ultra-low-power Stop3 mode eliminate external timing and sensing components, reducing BOM count and calibration effort. |
| Smart Lighting Dimmer | Appliance Motor Control Board |
Use Scenario: DALI- or 0–10 V-compatible LED driver with local brightness adjustment and thermal foldback. IC Role / Device Role / Timing Role: Peripheral manager - reads potentiometer/ambient light sensor, drives PWM dimming outputs via TPM, and monitors heatsink temperature via ADC. Use Value: Dual TPM modules support independent high-resolution (center-aligned) PWM for dimming and fan control; ACMP enables fast over-temperature shutdown independent of CPU load. | Use Scenario: Brushless DC motor commutation and fault monitoring in washing machine or HVAC blower control boards. IC Role / Device Role / Timing Role: Real-time motion controller - executes six-step commutation logic, samples hall-effect sensors via GPIO, and measures back-EMF via ADC for sensorless startup. Use Value: 40-MHz CPU delivers deterministic timing for 20 kHz PWM carrier; ganged GPIO writes on PTB/PTC simplify phase-output toggling; low-voltage detect prevents erratic operation during brown-out conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AW60CFGE | 60 KB flash, 4 KB RAM, 48-QFN package; adds CAN 2.0B controller and higher ADC resolution (12-bit, 16 ch). | Targeted at CAN-based automotive subsystems requiring larger code space and network connectivity. | Select when CAN interface and >8 KB flash are required; not pin-compatible due to 48-pin QFN vs. 24-pin QFN. |
| S9KEAZ128AMLH | ARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, 64-LQFP; includes USB, more timers, and enhanced debug (SWD). | Designed for next-generation upgrades where performance, peripheral richness, and toolchain continuity matter more than legacy code reuse. | Choose for new designs needing higher throughput or USB connectivity; requires PCB redesign and firmware migration. |
Compared with MC9S08SH8CTGR, MC9S08AW60CFGE offers expanded memory and CAN but demands larger board area and different layout; S9KEAZ128AMLH delivers modern ARM architecture and scalability but increases BOM cost and design complexity - MC9S08SH8CTGR remains optimal for compact, cost-driven 8-bit control where proven reliability and minimal footprint are critical.
Availability
MC9S08SH8CTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart lighting dimmers, and appliance motor control boards requiring stable component supply and long-term manufacturability.
Supply support for MC9S08SH8CTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors, analog, and mixed-signal semiconductors for automotive, industrial, and consumer markets.
The MC9S08SH8CTGR belongs to the HCS08 microcontroller family, engineered for cost-sensitive, low-power embedded control applications demanding high integration, robust debug support, and automotive-grade reliability in compact packages.
FAQ
What is the maximum operating frequency of the MC9S08SH8CTGR CPU core?
The MC9S08SH8CTGR features an HCS08 CPU core rated for up to 40 MHz operation. This maximum frequency is achievable when the internal clock source (ICS) is configured with the frequency-locked loop (FLL) to deliver a stable bus clock within the 2–20 MHz range, and external timing sources (e.g., crystal) meet specified load capacitance and drive level requirements. The 40-MHz core speed enables deterministic execution of real-time control loops in applications such as motor commutation and sensor fusion.
Does the MC9S08SH8CTGR support debugging without dedicated JTAG pins?
Yes, the MC9S08SH8CTGR supports single-wire background debug (BDM) via the BKGD/MS pin, eliminating the need for a full JTAG interface. This allows in-circuit programming and debugging using only one dedicated pin plus ground, significantly reducing PCB routing complexity and pin count. The on-chip debug module includes breakpoint capability and an 8-deep FIFO for trace, making the MC9S08SH8CTGR suitable for space-constrained and cost-sensitive designs where traditional debug headers are impractical.
Can the MC9S08SH8CTGR operate in ultra-low-power modes while retaining analog functionality?
Yes, the MC9S08SH8CTGR supports Stop3 mode, in which the CPU and most peripherals halt while retaining operation of the RTC, ADC, and analog comparator - all powered by the on-chip 1-kHz low-power oscillator. In this mode, typical current consumption drops below 2 µA, and analog functions remain fully accessible for wake-on-event sensing. This capability makes the MC9S08SH8CTGR ideal for battery-powered sensor nodes that must maintain responsiveness without continuous CPU activity.
What clock sources are available for the MC9S08SH8CTGR, and how do they affect system design?
The MC9S08SH8CTGR offers two primary clock sources: an external crystal/ceramic resonator (XOSC) supporting 31.25 kHz–16 MHz, and the internal clock source (ICS) with FLL for generating 2–20 MHz bus clocks from a trimmed internal reference. The ICS eliminates external timing components in cost-sensitive applications, while XOSC provides higher precision for time-critical functions like LIN communication. Both sources are supported simultaneously, allowing dynamic switching - for example, using ICS during normal operation and XOSC for calibration or high-accuracy timing tasks.
Is the MC9S08SH8CTGR pin-compatible with other members of the HCS08 SH-series?
No, the MC9S08SH8CTGR is not universally pin-compatible across the SH-series. While it shares the 24-QFN package with MC9S08SH4, differences in peripheral mapping - such as SCI/SPI/I²C pin assignments and ADC channel routing - prevent drop-in replacement without firmware and layout verification. For example, MC9S08SH4 lacks the second TPM module and has reduced ADC channel count. Always consult the specific device's pin assignment table (Section 2.1 of the MC9S08SH8 Rev. 3 datasheet) before substituting, as even same-package variants may differ electrically and functionally.
MC9S08SH8CTGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 13
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08SH8CTGR FAQ
1.How can I place an order for MC9S08SH8CTGR through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08SH8CTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08SH8CTGR reliable?
The price and inventory of MC9S08SH8CTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH8CTGR is usually 5 days.
3.What payment methods are accepted for MC9S08SH8CTGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH8CTGR transactions.
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4.How is shipping managed for MC9S08SH8CTGR?
MC9S08SH8CTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08SH8CTGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08SH8CTGR?
For technical support, including MC9S08SH8CTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH8CTGR requirements.
6.How does Aetrix verify that MC9S08SH8CTGR is sourced from the original manufacturer or authorized distributors?
All MC9S08SH8CTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH8CTGR meets industry standards.
7.What is the process for return or replacement of MC9S08SH8CTGR?
All MC9S08SH8CTGR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH8CTGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08SH8CTGR part is unused and in its original packaging.
Return procedure for MC9S08SH8CTGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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