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NXP Semiconductors MC9S08SH8CTJR

Part No.:
MC9S08SH8CTJR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08SH8CTJR.pdf
Description:
IC MCU 8BIT 8KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,754

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Product details

Overview

MC9S08SH8CTJR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 8 KB on-chip FLASH, 512 B RAM, and integrated peripherals including 10-bit ADC, analog comparator, SCI, SPI, I²C, two TPM modules, RTC, and low-power stop/wait modes. It operates across -40°C to 105°C and supports internal clock source (ICS) with FLL for bus frequencies up to 20 MHz - used in automotive body electronics, industrial sensor nodes, and appliance control.

For engineers reviewing the MC9S08SH8CTJR datasheet, MC9S08SH8CTJR pinout, MC9S08SH8CTJR application, or MC9S08SH8CTJR equivalent, key selection criteria include its 24-QFN package with exposed thermal pad, single-wire background debug interface, stop3 mode operation with ADC/ACMP active, and compatibility with legacy HCS08 toolchains and development ecosystems.

Technical Context

The MC9S08SH8CTJR implements the S08CPUV2 core with HC08 instruction set extension (BGND), supporting up to 32 interrupt/reset sources and full in-circuit debugging via single-wire BDM. Its ICS module integrates a frequency-locked loop (FLL) with precision-trimmed internal reference (±2% over voltage/temperature), enabling stable bus clocks without external crystal in cost-sensitive designs.

Peripherals are optimized for low-power embedded control: ADC runs in stop3 mode with 2.5 µs conversion time and temperature sensor channel; ACMP supports edge-triggered interrupts and routing to TPM for windowed monitoring; RTC uses a free-running 1-kHz on-chip oscillator for cyclic wake-up without external components.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 8-bit CPU running at up to 40 MHz - delivers deterministic real-time control with minimal code footprint.
Memory 8 KB FLASH (read/program/erase over full VDD/temp range) + 512 B RAM - enables field firmware updates and data logging in resource-constrained systems.
ADC 12-channel, 10-bit resolution, 2.5 µs conversion time, internal bandgap reference - supports fast sampling of sensors and supply rails with built-in temperature sensing.
Power Modes Two very low-power stop modes (stop2/stop3), reduced-power wait mode, and real-time interrupt wake-up - extends battery life in intermittent-sensing applications.
Package 24-pin QFN (98ASA00474D), 4 × 4 mm, 0.5 mm pitch, exposed thermal pad - provides compact footprint and enhanced thermal performance for dense PCB layouts.
Clock Sources Internal ICS (FLL + trimmed RC) and external crystal/ceramic resonator (31.25 kHz–16 MHz) - eliminates need for external oscillator in many cost-sensitive designs.
Debug Interface Single-wire background debug (BDM) with breakpoint support - enables in-system programming and real-time debugging without dedicated JTAG pins.

Pinout & Package

MC9S08SH8CTJR is housed in a 24-pin QFN package (case outline 98ASA00474D) with 4 mm × 4 mm body, 0.5 mm lead pitch, and exposed thermal pad for improved heat dissipation. The package is RoHS-compliant and designed for reflow soldering per IPC/JEDEC J-STD-020.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dual power domains: VDD powers digital logic and I/O; VSS is common digital ground - requires local decoupling near pins for noise immunity.
VDDAD, VSSAD Analog power and ground Separate analog supply domain for ADC/ACMP - isolation prevents digital switching noise from degrading analog measurement accuracy.
XTAL, EXTAL Crystal/resonator connection Supports Pierce oscillator configuration for external timing reference - optional when using internal ICS for lower BOM cost.
BKGD/MS Background debug / mode select Single-wire BDM interface pin - enables programming, debugging, and reset control using standard Freescale BDM tools.
PTA0–PTA7 Port A general-purpose I/O 8-bit bidirectional port with configurable pull-ups, slew rate, and drive strength - supports ganged output and pin-interrupt capability.
PTB0–PTB7 Port B general-purpose I/O 8-bit bidirectional port; PTB[5:2] supports ganged output - simplifies control of multi-segment displays or LED arrays.
PTC0–PTC3 Port C general-purpose I/O 4-bit bidirectional port; PTC[3:0] supports ganged output - ideal for parallel control of small peripheral groups.
RESET Active-low reset input Asynchronous reset pin with internal pull-up - ensures reliable initialization during power-up or brownout conditions.

Key Features

Feature Design Value
FLASH Block Protection Hardware-enforced write/erase protection for secure bootloader or calibration data storage - prevents accidental corruption during field updates.
Stop3 Mode Operation ADC and ACMP remain functional while CPU and most peripherals are halted - enables ultra-low-power sensor polling without external wake-up circuitry.
Real-Time Counter (RTC) 8-bit modulus counter with binary/decimal prescaler and free-running 1-kHz internal oscillator - provides precise time-of-day or task scheduling without external crystal.
SCI with LIN Support Full-duplex NRZ UART with LIN master break generation and slave break detection - simplifies integration into automotive body networks compliant with LIN 2.x.
TPM Modules Two independent 2-channel timer/PWM modules (TPM1, TPM2) with input capture, output compare, and edge-/center-aligned PWM - supports motor control, lighting dimming, and encoder interfacing.

Applications

Automotive Door Module Industrial Temperature Sensor Node

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Main system controller managing I/O expansion, LIN communication with body control module, and PWM-driven mirror actuators.

Use Value: Integrated LIN PHY support and stop3-mode ADC enable responsive actuation and periodic cabin temperature monitoring with <10 µA standby current.

Use Scenario: Battery-powered wireless node measuring ambient temperature and reporting via SPI-connected transceiver.

IC Role / Device Role / Timing Role: Sensor hub executing ADC conversions, applying linearization, and triggering SPI transfers only upon threshold breach.

Use Value: On-chip temperature sensor + 10-bit ADC eliminates external sensor BOM; RTC-driven wake-up ensures precise 10-second sampling intervals without external timing components.

Smart Appliance Control Panel LED Lighting Dimmer Module

Use Scenario: User interface and motor control subsystem in washing machines or HVAC units with touch keys and display backlight.

IC Role / Device Role / Timing Role: System manager handling capacitive touch sensing (via ACMP), display PWM brightness control, and serial communication with main MCU.

Use Value: Ganged I/O on PTB/PTC allows simultaneous update of 8-segment display drivers; ACMP-based touch detection reduces component count vs. dedicated ICs.

Use Scenario: Constant-current LED driver for architectural or signage lighting requiring smooth 0–100% dimming.

IC Role / Device Role / Timing Role: PWM generator and fault monitor using TPM outputs and ACMP for overvoltage/overcurrent protection.

Use Value: Edge-aligned PWM with 16-bit effective resolution enables flicker-free dimming; ACMP output routed to TPM enables hardware-triggered shutdown on fault detection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08AC16CFGE 16 KB FLASH, 1 KB RAM, 48-QFN package, no RTC, same HCS08 core and peripheral set - larger memory but physically incompatible footprint. Targeted at more complex control tasks requiring larger code space; lacks RTC for time-stamped events. Select when firmware size exceeds 8 KB and board layout accommodates 48-pin QFN.
S9KEAZ128AMLH Kinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, 64-LQFP, includes USB and CAN - higher performance, different architecture and toolchain. Designed for next-generation platforms needing USB connectivity or CAN bus integration; not drop-in compatible. Choose for new designs requiring scalable performance, modern peripherals, or long-term roadmap alignment beyond HCS08.

Compared with MC9S08SH8CTJR, MC9S08AC16CFGE offers expanded memory in a larger package but identical peripheral functionality, while S9KEAZ128AMLH shifts to ARM architecture with richer interfaces at the cost of software migration effort and higher BOM complexity.

Availability

MC9S08SH8CTJR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control panels, and LED lighting dimmer modules requiring stable component supply, long-lifecycle support, and qualified sourcing for production programs.

Supply support for MC9S08SH8CTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now headquartered in Eindhoven, Netherlands, delivering secure, connected, and intelligent solutions for automotive, industrial, IoT, and mobile markets.

The MC9S08SH8CTJR belongs to the HCS08 microcontroller family, designed specifically for cost-sensitive, low-power embedded control applications in automotive and industrial environments where reliability, debuggability, and peripheral integration are critical.

FAQ

What is the operating temperature range for the MC9S08SH8CTJR?

The MC9S08SH8CTJR is rated for operation from -40°C to +105°C, meeting extended temperature requirements for under-hood automotive and industrial control applications. This range is validated across all electrical specifications including FLASH endurance, ADC accuracy, and ICS stability - ensuring consistent behavior in thermally demanding environments where the MC9S08SH8CTJR serves as primary system controller.

Does the MC9S08SH8CTJR support in-system programming via its debug interface?

Yes, the MC9S08SH8CTJR supports full in-system programming and debugging through its single-wire background debug (BDM) interface on the BKGD/MS pin. Using standard Freescale/NXP BDM tools, users can erase, program, and verify FLASH memory, set breakpoints, and inspect registers without removing the MC9S08SH8CTJR from the target board - essential for iterative development and field firmware updates.

Can the MC9S08SH8CTJR operate without an external crystal?

Yes, the MC9S08SH8CTJR can operate entirely from its internal clock source (ICS) module, which includes a frequency-locked loop (FLL) driven by a precision-trimmed internal RC oscillator. This allows the MC9S08SH8CTJR to achieve bus frequencies up to 20 MHz without any external timing components - reducing BOM cost and board space in applications like appliance control or sensor nodes where absolute timing accuracy is secondary to cost and simplicity.

What peripheral modules remain active in stop3 mode on the MC9S08SH8CTJR?

In stop3 mode, the MC9S08SH8CTJR maintains operation of the ADC, analog comparator (ACMP), real-time counter (RTC), and internal 1-kHz low-power oscillator - enabling autonomous sensor sampling, threshold monitoring, and timed wake-up without CPU intervention. This capability makes the MC9S08SH8CTJR especially valuable in battery-powered systems where minimizing active current draw is critical to extending operational life.

Is the MC9S08SH8CTJR pin-compatible with other members of the HCS08 SH-series?

No, the MC9S08SH8CTJR in 24-QFN package is not pin-compatible with other SH-series variants such as the 20-TSSOP or 20-SOIC versions due to differing pin counts and assignments. While functional compatibility exists across the SH family (same register map and peripheral set), physical replacement requires PCB redesign - confirming that the MC9S08SH8CTJR must be selected and laid out specifically for its 24-QFN footprint and signal mapping.

MC9S08SH8CTJR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08SH8CTJR FAQ

1.How can I place an order for MC9S08SH8CTJR through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08SH8CTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08SH8CTJR reliable?

The price and inventory of MC9S08SH8CTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH8CTJR is usually 5 days.

3.What payment methods are accepted for MC9S08SH8CTJR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH8CTJR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08SH8CTJR?

MC9S08SH8CTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08SH8CTJR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08SH8CTJR?

For technical support, including MC9S08SH8CTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH8CTJR requirements.

6.How does Aetrix verify that MC9S08SH8CTJR is sourced from the original manufacturer or authorized distributors?

All MC9S08SH8CTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH8CTJR meets industry standards.

7.What is the process for return or replacement of MC9S08SH8CTJR?

All MC9S08SH8CTJR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH8CTJR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08SH8CTJR part is unused and in its original packaging.

Return procedure for MC9S08SH8CTJR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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