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NXP Semiconductors MC9S08SH8MTGR
- Part No.:
- MC9S08SH8MTGR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08SH8MTGR.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 16TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,423
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Product details
Overview
MC9S08SH8MTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB Flash, 512 B RAM, and a 40-MHz CPU core. It integrates ADC (12-channel, 10-bit), dual TPM modules, SCI, SPI, I²C, RTC, ACMP, and low-power stop3 mode operation. Designed for cost-sensitive embedded control in automotive body electronics and industrial sensors.
For engineers reviewing the MC9S08SH8MTGR datasheet, MC9S08SH8MTGR pinout, MC9S08SH8MTGR application, or MC9S08SH8MTGR equivalent, key selection criteria include QFN-24 package compatibility, internal clock source (ICS) with FLL and ±2% accuracy over voltage/temperature, 17 GPIOs with configurable slew rate and pull-ups, and single-wire background debug support.
Technical Context
The MC9S08SH8MTGR implements the HCS08 CPU core with HC08 instruction set extension including BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference enabling bus frequencies from 2 MHz to 20 MHz at ±2% deviation across -40°C to 125°C.
Peripherals operate in multiple power modes: ADC and ACMP remain functional in stop3 mode; RTC runs on a free-running 1-kHz low-power oscillator; SCI supports LIN master break generation and wake-up on active edge. The device includes FLASH block protection, COP watchdog with selectable clock source, and low-voltage detect with reset/interrupt options.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core, 40-MHz max operation - enables deterministic real-time control with low latency interrupt response. |
| Memory | 8 KB on-chip FLASH (read/program/erase over full VDD/temp), 512 B RAM - supports field firmware updates without external memory. |
| ADC | 12-channel, 10-bit resolution, 2.5 µs conversion time, internal bandgap reference - suitable for precision sensor interfacing with temperature compensation. |
| Power Modes | Stop3, Stop2, Wait, Run - stop3 retains RTC, ADC, ACMP, and 1-kHz LPO operation for ultra-low-power wake-up timing. |
| Clock Sources | External crystal (1–16 MHz or 31.25–38.4 kHz), internal ICS with FLL - eliminates need for external oscillator in many applications. |
| I/O | 17 general-purpose I/O pins + 1 output-only pin, all with hysteresis, configurable pull-ups, slew rate, and drive strength - simplifies PCB layout and noise immunity design. |
| Debug | Single-wire background debug interface with breakpoint capability - enables in-circuit debugging without dedicated JTAG pins or trace headers. |
Pinout & Package
MC9S08SH8MTGR is housed in a 24-pin QFN (Quad Flat No-lead) package with 4×4 mm body and 0.5 mm pitch, featuring an exposed thermal pad (EP) for enhanced thermal dissipation. Pin numbering follows standard QFN convention with pin 1 marked by dot or notch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDAD | Supply voltage inputs | VDD powers digital logic; VDDAD supplies analog peripherals - separation reduces noise coupling into ADC/ACMP. |
| VSS, VSSAD | Ground returns | VSS for digital ground; VSSAD for analog ground - independent return paths preserve signal integrity for precision analog functions. |
| XTAL, EXTAL | Crystal oscillator terminals | Supports Pierce oscillator configuration with crystals from 1 MHz to 16 MHz or 31.25–38.4 kHz - enables accurate timing for communication or RTC. |
| BKGD/MS | Background debug / mode select | Single-wire debug interface pin; also selects boot mode during reset - eliminates need for separate programming header in production designs. |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with interrupt capability, configurable pull-ups/slew rate - used for button sensing, LED control, or peripheral signaling. |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port; PTB[5:2] support ganged output - allows atomic multi-pin state changes for synchronized actuator control. |
| PTC0–PTC3 | Port C general-purpose I/O | 4-bit port; PTC[3:0] support ganged output - ideal for driving segmented displays or grouped status indicators. |
Key Features
| Feature | Design Value |
|---|---|
| Internal Clock Source (ICS) | FLL-controlled with ±2% accuracy over -40°C to 125°C and full VDD range - eliminates external crystal for cost-sensitive timing-critical applications. |
| Real-Time Counter (RTC) | 8-bit modulus counter with binary/decimal prescaler and free-running 1-kHz LPO - enables cyclic wake-up from stop3 without external components. |
| Analog Comparator (ACMP) | Configurable interrupt on rising/falling/both edges; output routable to TPM - supports zero-crossing detection and hardware-triggered PWM modulation. |
| FLASH Block Protection | Programmable protection of FLASH sectors - prevents accidental overwrite of bootloader or calibration data during field updates. |
| Low-Voltage Detect (LVD) | Selectable trip points with reset or interrupt option - ensures reliable operation during brown-out conditions in automotive or battery-powered systems. |
Applications
| Automotive Door Module | Industrial Temperature Sensor Node |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller executing motor sequencing, LIN communication with body control module, and real-time fault monitoring. Use Value: Integrated LIN-capable SCI, 17 GPIOs with ganged output, and stop3-mode RTC enable deterministic low-power sleep/wake cycles between commands. |
Use Scenario: Battery-powered wireless node measuring ambient temperature and transmitting via UART-to-RF bridge. IC Role / Device Role / Timing Role: Sensor interface MCU managing ADC sampling, temperature compensation using internal sensor, and periodic wake-up via RTC. Use Value: On-chip 10-bit ADC with internal bandgap reference and temperature sensor eliminates external components; stop3 mode draws <1 µA while maintaining RTC accuracy. |
| Smart Appliance Control Panel | LED Lighting Dimming Controller |
Use Scenario: User interface and motor control for washing machine or dishwasher control board. IC Role / Device Role / Timing Role: Real-time coordinator of display driver, keypad scan, water valve actuation, and pump timing via TPM PWM outputs. Use Value: Dual TPM modules provide four independent PWM channels with center-aligned mode for smooth motor commutation and reduced EMI. |
Use Scenario: Constant-current dimming control for architectural LED strips using analog and digital brightness adjustment. IC Role / Device Role / Timing Role: Precision PWM generator with ACMP-based current feedback loop and ADC-based ambient light sensing. Use Value: ACMP output routed to TPM enables hardware-synchronized current regulation; 12-channel ADC supports multi-zone light sensing and thermal derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC16CFGE | 16 KB FLASH, 1 KB RAM, same HCS08 core and peripheral set but in 48-QFN package - larger memory and more I/O, no ganged output on PTB/PTC. | Targeted at higher-complexity control tasks requiring extended code space and additional timers or communication interfaces. | Select when firmware size exceeds 8 KB or when >17 GPIOs and extra TPM/SCI channels are required. |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, 48-MHz operation - higher performance, modern toolchain, but larger footprint and higher power in active mode. | Used in next-generation designs where scalability, USB, or CAN support is anticipated; not drop-in compatible. | Choose for new designs needing future-proof architecture, though migration requires full software rework and PCB redesign. |
Compared with MC9S08SH8MTGR, MC9S08AC16CFGE offers expanded memory and I/O in a larger QFN, while S9KEAZ128AMLH provides ARM-based performance and peripheral richness at the cost of compatibility and power efficiency in low-duty-cycle applications.
Availability
MC9S08SH8MTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control panels, and LED lighting dimming controllers requiring stable component supply and long-term lifecycle support.
Supply support for MC9S08SH8MTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S08SH8MTGR belongs to the legacy HCS08 microcontroller family, designed for cost-optimized, low-power embedded control in automotive body electronics and industrial automation where deterministic real-time response and minimal BOM count are critical.
FAQ
What is the operating temperature range for the MC9S08SH8MTGR?
The MC9S08SH8MTGR is rated for operation from -40°C to 125°C, meeting automotive-grade requirements. This range is validated across all electrical characteristics including internal clock source accuracy (±2% over voltage and temperature), ADC performance, and FLASH endurance. The MC9S08SH8MTGR maintains full functionality in stop3 mode within this range, supporting under-hood and industrial environments.
Does the MC9S08SH8MTGR support LIN communication?
Yes, the MC9S08SH8MTGR supports LIN communication through its SCI module, which includes LIN master extended break generation and LIN slave extended break detection. The SCI operates in non-return-to-zero (NRZ) format and enables wake-up on active edge, allowing the MC9S08SH8MTGR to serve as a LIN node in automotive body networks without external transceivers beyond level-shifting.
What debug interface does the MC9S08SH8MTGR use?
The MC9S08SH8MTGR uses a single-wire background debug interface (BDM) accessible via the BKGD/MS pin. This interface supports in-circuit debugging, flash programming, and breakpoint setting with minimal pin overhead. The MC9S08SH8MTGR includes an on-chip debug module with two comparators and nine trigger modes, enabling advanced trace and event capture during development.
Can the MC9S08SH8MTGR operate without an external crystal?
Yes, the MC9S08SH8MTGR can operate without an external crystal using its internal clock source (ICS) with frequency-locked loop (FLL). The ICS provides bus frequencies from 2 MHz to 20 MHz with ±2% accuracy over -40°C to 125°C and full VDD range. The MC9S08SH8MTGR also includes a 1-kHz low-power oscillator for RTC operation in stop3 mode, eliminating external timing components in many applications.
What packaging and RoHS status applies to the MC9S08SH8MTGR?
The MC9S08SH8MTGR is supplied in a 24-pin QFN package (4×4 mm, 0.5 mm pitch) with exposed thermal pad, per package document 98ASA00474D. It is RoHS-compliant and lead-free, consistent with NXP's environmental compliance program. The MC9S08SH8MTGR uses copper wire bonding per Freescale's QFN migration addendum, replacing gold wire to improve reliability and reduce cost.
MC9S08SH8MTGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 13
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08SH8MTGR FAQ
1.How can I place an order for MC9S08SH8MTGR through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08SH8MTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08SH8MTGR reliable?
The price and inventory of MC9S08SH8MTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH8MTGR is usually 5 days.
3.What payment methods are accepted for MC9S08SH8MTGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH8MTGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08SH8MTGR?
MC9S08SH8MTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08SH8MTGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08SH8MTGR?
For technical support, including MC9S08SH8MTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH8MTGR requirements.
6.How does Aetrix verify that MC9S08SH8MTGR is sourced from the original manufacturer or authorized distributors?
All MC9S08SH8MTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH8MTGR meets industry standards.
7.What is the process for return or replacement of MC9S08SH8MTGR?
All MC9S08SH8MTGR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH8MTGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08SH8MTGR part is unused and in its original packaging.
Return procedure for MC9S08SH8MTGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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