NXP Semiconductors MC9S08SH8MTJ
- Part No.:
- MC9S08SH8MTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08SH8MTJ.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08SH8MTJ from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 8 KB on-chip FLASH memory, and 512 bytes RAM. It integrates ADC (12-channel, 10-bit), dual TPM modules, SCI, SPI, I²C, RTC, ACMP, and low-power stop3 mode operation. Designed for embedded control in cost-sensitive industrial and automotive subsystems, it supports real-time interrupt wake-up from stop3 using its internal 1-kHz oscillator.
For engineers reviewing the MC9S08SH8MTJ datasheet, MC9S08SH8MTJ pinout, MC9S08SH8MTJ application, or MC9S08SH8MTJ equivalent, key selection criteria include QFN-24 package compatibility, 20 MHz maximum bus frequency via ICS FLL, 2.5 µs ADC conversion time, and single-wire background debug interface support for in-circuit development.
Technical Context
The MC9S08SH8MTJ implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and full debugging via single-wire BDM. Its Internal Clock Source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±2% over voltage/temperature) to generate bus frequencies from 2 MHz to 20 MHz.
Peripherals operate across power modes: ADC and ACMP remain functional in stop3 mode; RTC runs continuously using either external clock or internal 1-kHz low-power oscillator; SCI supports LIN master break generation and slave break detection; TPM modules provide edge- or center-aligned PWM with input capture and output compare.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with 40-MHz max instruction rate and BGND debug instruction |
| FLASH Memory | 8 KB on-chip FLASH with read/program/erase over full operating voltage and temperature range |
| RAM | 512 bytes of on-chip RAM accessible in all operating modes |
| ADC | 12-channel, 10-bit resolution ADC with 2.5 µs conversion time and integrated temperature sensor |
| Bus Frequency | Up to 20 MHz via ICS FLL with internal reference trimmed to ±0.2% resolution |
| Low-Power Modes | Stop3 mode with RTC and ADC active; internal 1-kHz oscillator enables cyclic wake-up without external components |
| Debug Interface | Single-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module (two comparators, nine trigger modes) |
Pinout & Package
MC9S08SH8MTJ is housed in a 24-pin QFN package (98ASA00474D) with exposed thermal pad, copper-wire interconnect, and 0.4 mm pitch. The package supports automated optical inspection and provides enhanced thermal performance over legacy gold-wire variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual-supply pins for digital core (VDD/VSS); separate analog supply not required (shared VDDAD/VSSAD) |
| XTAL, EXTAL | Clock input/output | Connects to 31.25 kHz–16 MHz crystal or ceramic resonator for XOSC oscillator circuit |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and reset-triggered mode selection during startup |
| RESET | Active-low reset input | Asynchronous reset assertion; internal pull-up ensures reliable release after power-up |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit bidirectional port with configurable pull-up, slew rate, and drive strength; PTA0 supports IRQ |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit bidirectional port; PTB[5:2] supports ganged output for synchronized state change |
| PTC0–PTC3 | Port C general-purpose I/O | 4-bit bidirectional port; PTC[3:0] supports ganged output; PTC0–PTC2 support pin interrupt |
Key Features
| Feature | Design Value |
|---|---|
| Internal Clock Source (ICS) | FLL-based clock generator with ±0.2% trimming resolution enables stable 2–20 MHz bus frequencies without external crystal |
| Stop3 Mode Operation | Ultra-low-power state where RTC, ADC, and ACMP remain active-enables battery-powered wake-on-event sensing |
| Integrated Temperature Sensor | On-die sensor calibrated against bandgap reference allows system-level thermal monitoring without external components |
| Ganged Output Control | Simultaneous write to PTB[5:2] or PTC[3:0] changes all four pins' states atomically-critical for synchronized actuator control |
| LIN-Compatible SCI | SCI module supports LIN 2.0 master break generation and slave break detection-enables direct integration into automotive body networks |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
|
Use Scenario: Centralized control of door locks, window lifts, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Main MCU executing LIN-slave protocol over SCI, managing GPIO-driven relays and reading potentiometer/switch inputs. Use Value: Stop3 mode + internal 1-kHz RTC enables periodic wake-up to monitor switch events while drawing <1 µA-extending battery life in always-on modules. |
Use Scenario: Wireless-capable environmental sensor node measuring temperature, humidity, and ambient light. IC Role / Device Role / Timing Role: System controller interfacing ADC channels to analog sensors, managing SPI-connected transceiver, and scheduling data transmission via RTC. Use Value: Integrated temperature sensor and 10-bit ADC eliminate need for external signal conditioning-reducing BOM count and PCB area. |
| Home Appliance Motor Controller | Medical Diagnostic Handheld |
|
Use Scenario: Speed and direction control of BLDC motors in washing machines and HVAC blowers. IC Role / Device Role / Timing Role: PWM generator via TPM modules, current sensing via ADC, and fault detection using ACMP with bandgap reference. Use Value: Dual TPM modules support complementary center-aligned PWM outputs-enabling efficient 3-phase motor commutation without external gate drivers. |
Use Scenario: Portable blood glucose or pulse oximeter requiring low-power operation and analog signal acquisition. IC Role / Device Role / Timing Role: Signal acquisition MCU sampling biosensor analog outputs, performing basic calibration, and communicating via I²C to display controller. Use Value: ADC automatic compare function triggers interrupt on threshold crossing-allowing immediate response to critical physiological events without CPU polling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC16CFGE | 16 KB FLASH, 1 KB RAM, same HCS08 core and peripheral set but in 48-QFN package | Higher memory capacity suits firmware-over-the-air updates and larger protocol stacks | Select when code size exceeds 8 KB or additional GPIOs (34 vs. 18) are needed |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, pin-compatible 24-QFN footprint | Native USB, higher compute throughput, and enhanced analog features (16-bit ADC, DAC) | Choose for migration path requiring scalability beyond 8-bit performance while retaining board layout |
Compared with MC9S08SH8MTJ, MC9S08AC16CFGE offers double memory and more I/O in a larger package, while S9KEAZ128AMLH delivers ARM-class processing in identical 24-QFN form factor-making it suitable for long-term design continuity where future feature expansion is anticipated.
Availability
MC9S08SH8MTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, home appliance motor controllers, and portable medical diagnostics requiring stable component supply and long-lifecycle support.
Supply support for MC9S08SH8MTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in microcontrollers, analog, and connectivity solutions for automotive, industrial, and consumer markets.
The MC9S08SH8MTJ belongs to the HCS08 family-designed for cost-optimized, low-power embedded control applications where deterministic real-time response and debuggability are essential.
FAQ
What is the maximum bus frequency supported by the MC9S08SH8MTJ?
The MC9S08SH8MTJ supports a maximum bus frequency of 20 MHz, achieved through its Internal Clock Source (ICS) module's frequency-locked loop (FLL) operating with a precision-trimmed internal reference. This value is validated across the full industrial temperature range (−40°C to +105°C) and supply voltage (2.7–5.5 V). The MC9S08SH8MTJ achieves this without requiring an external crystal when using the internal reference, simplifying board design while maintaining timing accuracy.
Does the MC9S08SH8MTJ support LIN communication natively?
Yes, the MC9S08SH8MTJ's SCI module includes native LIN 2.0 support: it can generate extended-break fields as a LIN master and detect them as a LIN slave. This capability is implemented in hardware and requires no CPU overhead during break transmission or recognition. The MC9S08SH8MTJ uses the same SCI peripheral for both standard UART and LIN functions-enabling seamless integration into automotive body networks without additional protocol ICs.
Can the MC9S08SH8MTJ operate in ultra-low-power modes with analog peripherals active?
Yes, the MC9S08SH8MTJ supports Stop3 mode, where the ADC, ACMP, and RTC remain fully operational while the CPU and most clocks are halted. In this mode, current consumption drops below 1 µA (typical), and wake-up can occur via RTC overflow, ADC conversion completion, or comparator output transition. The MC9S08SH8MTJ maintains full analog functionality-including temperature sensor readings and bandgap-referenced comparisons-without external components.
What debug interface does the MC9S08SH8MTJ provide, and is external hardware required?
The MC9S08SH8MTJ features a single-wire background debug (BDM) interface accessible via the BKGD/MS pin, eliminating the need for dedicated JTAG headers or multi-pin debug connectors. A standard BDM pod (e.g., OSBDM or compatible) connects directly to this pin and VDD/VSS for full in-circuit debugging-including breakpoints, register inspection, and flash programming. No external debug silicon is required, and the MC9S08SH8MTJ's on-chip ICE module supports trace capture and forced breakpoints without host intervention.
Is the MC9S08SH8MTJ pin-compatible with other members of the HCS08 SH-series?
No-MC9S08SH8MTJ uses a 24-QFN package (98ASA00474D), while other SH-series devices like MC9S08SH16 or MC9S08SH32 are offered in 20-TSSOP, 20-SOIC, or 24-QFN variants with differing pinouts. Although electrical characteristics and peripheral sets overlap significantly, the MC9S08SH8MTJ's 24-QFN pin assignment is unique to its memory configuration and I/O count. Board designs must verify pin mapping per device variant; the MC9S08SH8MTJ cannot be substituted without layout verification.
MC9S08SH8MTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 17
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08SH8MTJ FAQ
1.How can I place an order for MC9S08SH8MTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08SH8MTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08SH8MTJ reliable?
The price and inventory of MC9S08SH8MTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH8MTJ is usually 5 days.
3.What payment methods are accepted for MC9S08SH8MTJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH8MTJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08SH8MTJ?
MC9S08SH8MTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08SH8MTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08SH8MTJ?
For technical support, including MC9S08SH8MTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH8MTJ requirements.
6.How does Aetrix verify that MC9S08SH8MTJ is sourced from the original manufacturer or authorized distributors?
All MC9S08SH8MTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH8MTJ meets industry standards.
7.What is the process for return or replacement of MC9S08SH8MTJ?
All MC9S08SH8MTJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH8MTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08SH8MTJ part is unused and in its original packaging.
Return procedure for MC9S08SH8MTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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