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NXP Semiconductors MC9S08SH8MTJR

Part No.:
MC9S08SH8MTJR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08SH8MTJR.pdf
Description:
IC MCU 8BIT 8KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,827

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Product details

Overview

MC9S08SH8MTJR from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 8 KB on-chip FLASH memory, and 512 B RAM. It integrates ADC (12-channel, 10-bit), analog comparator, RTC, dual TPM modules, SCI, SPI, and I²C interfaces. Designed for embedded control in space-constrained industrial sensors and low-power metering systems.

For engineers reviewing the MC9S08SH8MTJR datasheet, MC9S08SH8MTJR pinout, MC9S08SH8MTJR application, or MC9S08SH8MTJR equivalent, key selection criteria include its 24-QFN package with exposed pad, internal clock source (ICS) supporting 2–20 MHz bus frequencies, stop3 mode operation with ADC/ACMP active, and single-wire background debug interface.

Technical Context

The MC9S08SH8MTJR implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±2% deviation over voltage/temperature) and selectable external crystal input (1–16 MHz or 31.25–38.4 kHz).

Peripherals operate across power modes: ADC and ACMP remain functional in stop3 mode; RTC runs continuously using a free-running 1-kHz low-power oscillator; SCI supports LIN master break generation and slave wake-up detection; TPM modules provide edge- or center-aligned PWM with input capture and output compare.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreHCS08 8-bit core with 40-MHz max bus frequency and BGND instruction support
Memory8 KB FLASH (read/program/erase over full VDD/temp range) + 512 B RAM
ADC12-channel, 10-bit resolution, 2.5 µs conversion time, internal bandgap reference, temperature sensor channel
Real-Time Counter8-bit modulus counter with binary/decimal prescaler; runs in all MCU modes using on-chip 1-kHz LP oscillator
Power ModesRun, Wait, Stop2, Stop3 - Stop3 enables ADC, ACMP, RTC, and SCI wake-up while drawing ultra-low current
Clock SourcesExternal crystal (1–16 MHz or 31.25–38.4 kHz) + internal ICS with FLL and ±0.2% trimming resolution
Debug InterfaceSingle-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module (two comparators, nine trigger modes)

Pinout & Package

The MC9S08SH8MTJR is housed in a 24-pin QFN package (98ASA00474D) with 4×4 mm body, 0.5 mm pitch, and exposed thermal pad. Pinout conforms to Freescale's standard 24-QFN mapping for SH-series MCUs.

Pin/Terminal Circuit Role Design Meaning
VDD, VSSPower supply and groundDual-supply pins for core/analog domains; VDDAD/VSSAD not separate - shared VDD/VSS used for ADC reference and analog inputs
XTAL, EXTALCrystal oscillator terminalsSupports Pierce oscillator configuration with crystals from 31.25 kHz to 16 MHz; optional external clock input on EXTAL
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external reset signal or watchdog timeout assertion
BKGD/MSBackground debug / mode selectSingle-wire BDM communication and chip entry into active background mode; pulled high internally
PTA0–PTA7Port A general-purpose I/O8-bit bidirectional port with configurable pull-up, slew rate, drive strength, and interrupt-on-change capability
PTB0–PTB7Port B general-purpose I/O8-bit port; PTB[5:2] support ganged output for synchronized multi-pin control
PTC0–PTC3Port C general-purpose I/O4-bit port; PTC[3:0] support ganged output; all pins support hysteresis and interrupt-on-edge
TPM1CH0–TPM1CH1Timer PWM channel outputsDedicated pins for TPM1 channels; support input capture, output compare, and PWM generation
TPM2CH0–TPM2CH1Timer PWM channel outputsDedicated pins for TPM2 channels; independent prescaler and modulus control from TPM1
SCI1TX, SCI1RXSerial communication interfaceFull-duplex NRZ UART with LIN break generation/detection and wake-up on active edge
SPI_MOSI, SPI_MISO, SPI_SCK, SPI_SSSerial peripheral interfaceFull-duplex or single-wire bidirectional SPI; double-buffered TX/RX; master/slave configurable
IIC_SDA, IIC_SCLInter-integrated circuit interfaceStandard-mode I²C (≤100 kbps); supports multi-master, broadcast, and 10-bit addressing

Key Features

Feature Design Value
Stop3 Mode OperationEnables ADC conversions, analog comparator decisions, and RTC counting while consuming sub-µA current - ideal for battery-powered wake-on-event systems
Internal Clock Source (ICS)Eliminates need for external crystal in cost-sensitive designs; FLL achieves stable 2–20 MHz bus clocks with <±2% variation across -40°C to 125°C
On-Chip Debug (ICE)Two hardware comparators and nine trigger modes enable precise flow tracing without external logic analyzers; 8-deep FIFO stores program counter changes
Ganged Output ControlSingle write to PTB[5:2] or PTC[3:0] updates four pins simultaneously - simplifies LED array or relay bank control without bit-banging loops
Integrated Temperature SensorCalibrated on-die sensor feeds ADC Channel 14; provides system-level thermal monitoring without external components or calibration overhead

Applications

Smart Energy Metering Industrial Sensor Node

Use Scenario: Sub-metering unit measuring voltage, current, and power factor in HVAC or lighting control panels.

IC Role / Device Role / Timing Role: Central controller executing real-time sampling, RMS calculation, and Modbus RTU communication via SCI.

Use Value: Stop3 mode allows periodic ADC-triggered wake-up every 100 ms while maintaining <2 µA sleep current - extending battery life to >5 years on coin cell.

Use Scenario: Wireless vibration sensor node mounted on motor bearings, transmitting FFT-derived fault indicators via SPI-connected transceiver.

IC Role / Device Role / Timing Role: Signal acquisition engine running ADC at 10 kSPS, triggering TPM-based timer interrupts for data windowing and FFT prep.

Use Value: On-chip temperature sensor validates ambient operating range before initiating measurement sequences - preventing erroneous readings during thermal stress events.

Automotive Body Control Module Home Appliance Timer Controller

Use Scenario: Door lock actuator controller receiving LIN commands and driving H-bridge motor drivers.

IC Role / Device Role / Timing Role: LIN slave node interpreting extended break frames and generating precise PWM for motor direction/speed control via TPM outputs.

Use Value: Single-wire BDM enables in-vehicle firmware updates without disassembly; BKGD/MS pin doubles as LIN wakeup line - reducing connector count.

Use Scenario: Microwave oven control board managing keypad scan, display backlight PWM, and cooking cycle timing.

IC Role / Device Role / Timing Role: Real-time scheduler using RTC and MTIM to coordinate 100-ms UI refresh, 1-s buzzer alerts, and 10-ms heater duty-cycle modulation.

Use Value: Ganged output on PTC[3:0] drives four-digit 7-segment display anodes synchronously - eliminating flicker and reducing CPU load by 60% vs. software multiplexing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08AW60CFUE60 KB FLASH, 4 KB RAM, 48-QFN; adds CAN 2.0B controller and enhanced ADC (16 ch, 12-bit)Targeted at automotive body networks requiring CAN connectivity and higher code footprintSelect when CAN bus integration and larger memory are required; not drop-in due to pin count and peripheral differences
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+, 128 KB FLASH, 16 KB RAM, 64-LQFP; includes USB, DMA, and higher-precision ADCDesigned for next-generation platforms needing USB HID, deterministic interrupt latency, or field-upgradable firmwareChoose for migration path beyond 8-bit constraints; requires PCB redesign and toolchain change

Compared with MC9S08SH8MTJR, MC9S08AW60CFUE offers greater memory and CAN but demands more board area and power; S9KEAZ128AMLH delivers modern architecture and peripherals but increases BOM cost and design complexity - making MC9S08SH8MTJR optimal for cost-sensitive, low-power, fixed-function embedded controllers.

Availability

MC9S08SH8MTJR is available at Aetrix Electronics and suitable for smart energy metering, industrial sensor nodes, automotive body control modules, and home appliance timer controllers requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08SH8MTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in embedded processing solutions, specializing in microcontrollers, analog, and connectivity products for automotive, industrial, and consumer markets.

The MC9S08SH8MTJR belongs to the HCS08 family - designed specifically for cost-optimized, low-power embedded control applications where small footprint, robust debug capability, and mixed-signal integration are critical.

FAQ

What is the maximum operating frequency of the MC9S08SH8MTJR?

The MC9S08SH8MTJR supports a maximum bus frequency of 20 MHz when using the internal clock source (ICS) with FLL enabled, or up to 40 MHz when driven by an external crystal oscillator. The HCS08 CPU executes instructions at two bus cycles per instruction, yielding effective throughput up to 20 MIPS. All timing specifications in the MC9S08SH8MTJR datasheet are validated across -40°C to 125°C and full VDD range.

Does the MC9S08SH8MTJR support in-circuit debugging without additional hardware?

Yes, the MC9S08SH8MTJR includes a single-wire background debug (BDM) interface accessible via the BKGD/MS pin, enabling full in-circuit debugging without dedicated JTAG headers. The on-chip ICE module provides two hardware breakpoints, event-triggered trace capture, and 8-deep FIFO storage - allowing developers to debug the MC9S08SH8MTJR directly on target hardware using standard Freescale-compatible debug probes.

Can the MC9S08SH8MTJR operate in ultra-low-power modes with analog peripherals active?

Yes, the MC9S08SH8MTJR supports Stop3 mode, where the ADC, analog comparator, RTC, and SCI remain fully operational while the CPU and most clocks are halted. In this mode, the MC9S08SH8MTJR draws less than 2 µA typical current, enabling battery-powered applications like wireless sensors to achieve multi-year operation. Wake-up can be triggered by ADC completion, comparator output, RTC overflow, or SCI start bit detection.

What package type and thermal characteristics does the MC9S08SH8MTJR use?

The MC9S08SH8MTJR is packaged in a 24-pin QFN (98ASA00474D) with 4×4 mm body, 0.5 mm pitch, and exposed thermal pad. This copper-wire QFN variant replaces earlier gold-wire versions and improves thermal resistance (θJA ≈ 52°C/W on 2-layer board). The exposed pad must be soldered to a solid ground plane for optimal thermal performance and EMI suppression in the MC9S08SH8MTJR design.

Is there an integrated temperature sensor in the MC9S08SH8MTJR, and how is it accessed?

Yes, the MC9S08SH8MTJR includes a factory-calibrated on-die temperature sensor connected to ADC channel 14. It requires no external components and delivers ±3°C accuracy across -40°C to 125°C. To read temperature, configure the ADC for single-ended mode on channel 14, enable the temperature sensor bias, and convert using internal bandgap reference - results are accessible via the MC9S08SH8MTJR's ADC result register (ADR1) after conversion completes.

MC9S08SH8MTJR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08SH8MTJR FAQ

1.How can I place an order for MC9S08SH8MTJR through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08SH8MTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08SH8MTJR reliable?

The price and inventory of MC9S08SH8MTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH8MTJR is usually 5 days.

3.What payment methods are accepted for MC9S08SH8MTJR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH8MTJR transactions.

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4.How is shipping managed for MC9S08SH8MTJR?

MC9S08SH8MTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08SH8MTJR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08SH8MTJR?

For technical support, including MC9S08SH8MTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH8MTJR requirements.

6.How does Aetrix verify that MC9S08SH8MTJR is sourced from the original manufacturer or authorized distributors?

All MC9S08SH8MTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH8MTJR meets industry standards.

7.What is the process for return or replacement of MC9S08SH8MTJR?

All MC9S08SH8MTJR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH8MTJR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08SH8MTJR part is unused and in its original packaging.

Return procedure for MC9S08SH8MTJR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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