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NXP Semiconductors MC9S08SH8MWJ

Part No.:
MC9S08SH8MWJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixMC9S08SH8MWJ.pdf
Description:
IC MCU 8BIT 8KB FLASH 20SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,866

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Product details

Overview

MC9S08SH8MWJ from Freescale Semiconductor is an 8-bit HCS08 microcontroller with 8 KB Flash, 512 B RAM, and a 40-MHz CPU core. It integrates ADC (12-channel, 10-bit), ACMP, SCI, SPI, I²C, two TPM modules, RTC, and supports stop3 mode for ultra-low-power operation. Designed for embedded control in automotive body electronics and industrial sensors.

For engineers reviewing the MC9S08SH8MWJ datasheet, MC9S08SH8MWJ pinout, MC9S08SH8MWJ application, or MC9S08SH8MWJ equivalent, key selection criteria include its 24-QFN package, internal clock source with FLL (2–20 MHz bus frequency), 17 GPIOs + 1 output-only pin, real-time interrupt capability in all power modes, and single-wire background debug interface.

Technical Context

The MC9S08SH8MWJ implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Internal Clock Source (ICS) module uses a frequency-locked loop (FLL) with precision-trimmed internal reference (0.2% resolution, ±2% deviation over voltage/temperature), enabling stable bus frequencies from 2 MHz to 20 MHz without external crystal.

Peripherals operate across power modes: ADC and ACMP remain functional in stop3 mode; RTC runs on free-running 1-kHz low-power oscillator; SCI supports LIN master/slave extended break; TPM modules offer edge- or center-aligned PWM with input capture and output compare. All I/O pins support configurable pull-up, slew rate, and drive strength.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core, 40-MHz max operation - enables deterministic real-time control with low latency interrupt response.
Flash Memory8 KB on-chip Flash - supports read/program/erase over full operating voltage (2.7–5.5 V) and temperature (−40°C to 125°C).
RAM512 bytes - sufficient for stack, variables, and small buffers in resource-constrained embedded applications.
ADC12-channel, 10-bit, 2.5 µs conversion - includes internal bandgap reference and temperature sensor; operates in stop3 mode.
Power ModesRun, Wait, Stop2, Stop3 - Stop3 draws <1 µA typical with RTC active, enabling battery-powered long-duration wake-up scheduling.
Debug InterfaceSingle-wire background debug (BDM) - allows non-intrusive in-circuit debugging with one breakpoint plus ICE module with two comparators and eight-deep FIFO.
Package24-pin QFN (4 × 4 mm, 0.5 mm pitch, exposed pad) - compact footprint with thermal performance suitable for space-limited automotive modules.

Pinout & Package

MC9S08SH8MWJ is housed in a 24-pin QFN package (case outline 98ASA00474D), measuring 4 mm × 4 mm with 0.5 mm pitch and an exposed thermal pad. The package uses copper wire bonding per Freescale's QFN migration addendum (Rev. 0, 07/2014).

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltage (2.7–5.5 V)Primary power rail for digital and analog domains; requires local decoupling near pin.
VSSDigital groundReference return path for digital logic; tied to PCB ground plane under exposed pad.
VDDADAnalog supplySeparate 2.7–5.5 V rail for ADC/ACMP; improves noise immunity when isolated from digital VDD.
VSSADAnalog groundDedicated analog return; must be connected to VSS at single point to avoid ground loops.
XTALOscillator inputAccepts 31.25 kHz–16 MHz crystal or ceramic resonator; used with XOSC module for precise timing.
EXTALOscillator outputDrives crystal/resonator; forms Pierce oscillator with XTAL; not usable as general-purpose output.
BKGD/MSBackground debug / Mode selectSingle-wire BDM interface pin; also selects boot mode during reset; requires pull-up for normal operation.
RESETActive-low reset inputAsynchronous reset assertion clears CPU registers and initiates boot sequence; internal pull-up enabled by default.
PTA0–PTA1GPIO / SCI RX/TXProgrammable I/O with alternate SCI functionality; supports LIN-compliant wake-up on active edge.
PTB0–PTB7GPIO / TPM/ADC/I²CMultiplexed functions including TPM channels, ADC inputs, and I²C SCL/SDA; ganged write supported on PTB[5:2].
PTC0–PTC3GPIO / SPI/RTCSupport SPI MOSI/MISO/SCK, RTC alarm output, and general-purpose use; ganged write supported on PTC[3:0].
PTD0–PTD3GPIO / ACMP/TPMIncludes ACMP inputs and TPM channel outputs; configurable hysteresis and drive strength per pin.

Key Features

FeatureDesign Value
Internal Clock Source (ICS) with FLLEnables crystal-free operation at 2–20 MHz bus frequency using trimmed internal reference - reduces BOM cost and board space.
Stop3 Low-Power ModeSub-µA current draw with RTC running on dedicated 1-kHz oscillator - supports years of battery life in periodic-sensing applications.
ADC with Temperature SensorOn-die temperature measurement channel eliminates need for external sensor in thermal monitoring systems.
SCI with LIN SupportHardware LIN master break generation and slave break detection - simplifies implementation of automotive body network nodes.
Ganged Output ControlSingle register write updates PTB[5:2] or PTC[3:0] simultaneously - accelerates LED array or relay bank control in real-time sequences.

Applications

Automotive Door ModuleIndustrial Temperature Monitor

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Main system controller executing CAN/LIN gateway logic, motor driver sequencing, and fault diagnostics.

Use Value: Integrated ADC monitors motor current and thermistor feedback; stop3 mode enables low-current sleep between user interactions.

Use Scenario: Standalone environmental sensor node logging ambient temperature in HVAC ducts or factory equipment enclosures.

IC Role / Device Role / Timing Role: Autonomous data acquisition unit with RTC-based sampling schedule and SPI-connected EEPROM storage.

Use Value: On-chip temperature sensor eliminates external component; 8 KB Flash stores firmware and calibration tables; 24-QFN fits tight mechanical envelopes.

Smart Lighting ControllerAppliance Motor Drive Interface

Use Scenario: Dimmable LED driver in commercial fixtures with occupancy sensing and daylight harvesting.

IC Role / Device Role / Timing Role: Real-time PWM generator for LED current regulation and analog sensor signal conditioning.

Use Value: Two TPM modules provide independent center-aligned PWM outputs; ACMP compares ambient light level against threshold for automatic dimming.

Use Scenario: Brushless DC motor commutation interface in white goods (e.g., washing machine drum drive).

IC Role / Device Role / Timing Role: Timing-critical peripheral coordinator managing hall-effect sensor inputs and gate driver enable signals.

Use Value: Input capture on TPM channels precisely measures rotor position; 40-MHz CPU ensures sub-microsecond interrupt latency for phase switching.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08AW60CFGE60 KB Flash, 4 KB RAM, 48-QFN package - larger memory and I/O count but same HCS08 core and peripheral set.Suitable for more complex control algorithms requiring larger code/data space; not pin-compatible due to 48-pin footprint.Select when firmware size exceeds 8 KB or >17 I/Os are needed; requires PCB redesign.
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+ core, 128 KB Flash, 16 KB RAM, 64-QFP - higher performance, modern toolchain, but different architecture and debug interface.Targets next-generation designs needing scalable performance, USB, or CAN FD; lacks native LIN hardware support.Choose for new designs prioritizing long-term roadmap and ecosystem; not drop-in replacement.

Compared with MC9S08SH8MWJ, MC9S08AW60CFGE offers expanded memory and I/O in a larger package for feature-rich implementations, while S9KEAZ128AMLH provides ARM-based scalability at the cost of architectural discontinuity and loss of LIN-specific hardware acceleration.

Availability

MC9S08SH8MWJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart lighting controllers, and appliance motor interfaces requiring stable component supply and long lifecycle support.

Supply support for MC9S08SH8MWJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and consumer markets.

The MC9S08SH8MWJ belongs to the HCS08 microcontroller family, engineered for cost-sensitive, low-power embedded control applications where reliability, small footprint, and integrated analog peripherals are critical.

FAQ

What is the maximum operating frequency of the MC9S08SH8MWJ CPU core?

The MC9S08SH8MWJ CPU core operates at a maximum frequency of 40 MHz. This speed is achievable when the Internal Clock Source (ICS) module configures the bus frequency up to 20 MHz and the core executes instructions at double the bus clock rate. The actual sustained frequency depends on supply voltage (2.7–5.5 V) and temperature (−40°C to 125°C), with electrical characteristics validated across this full range per the Rev. 3 datasheet.

Does the MC9S08SH8MWJ support LIN communication natively?

Yes, the MC9S08SH8MWJ supports LIN communication natively through its SCI module, which includes hardware features for both LIN master and slave operation. Specifically, it provides LIN master extended break generation and LIN slave extended break detection, enabling compliant node implementation without external transceivers or software bit-banging. The MC9S08SH8MWJ also supports wake-up on active edge, essential for low-power LIN network participation.

What power-saving modes does the MC9S08SH8MWJ offer, and which peripherals remain active in stop3 mode?

The MC9S08SH8MWJ offers Run, Wait, Stop2, and Stop3 modes. In Stop3 mode - its deepest low-power state - current consumption drops below 1 µA typical while retaining RTC operation on the dedicated 1-kHz internal oscillator. Additionally, the ADC and ACMP modules remain functional and can trigger wake-up events, enabling sensor polling without full MCU restart. The MC9S08SH8MWJ maintains register contents and I/O states across Stop3 entry/exit.

Is the MC9S08SH8MWJ pin-compatible with other members of the MC9S08SHx family?

No, the MC9S08SH8MWJ is not universally pin-compatible across the MC9S08SHx family. While it shares the 24-QFN package with MC9S08SH4, differences in peripheral mapping and pin function allocation exist - for example, PTD pins on MC9S08SH8MWJ support ACMP inputs not present on lower-pin-count variants. Always verify pin assignments against the specific device's "Pins and Connections" chapter in the MC9S08SH8 datasheet before assuming compatibility.

What debug interface does the MC9S08SH8MWJ use, and what capabilities does it provide?

The MC9S08SH8MWJ uses a single-wire background debug (BDM) interface via the BKGD/MS pin. This interface supports non-intrusive in-circuit debugging, including breakpoint setting, memory/register inspection, and flash programming. The on-chip debug module adds two hardware comparators, nine trigger modes, and an eight-deep FIFO for change-of-flow tracing. The MC9S08SH8MWJ also supports the BGND instruction for software-initiated debug entry without external hardware.

MC9S08SH8MWJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-SOIC (0.295", 7.50mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08SH8MWJ FAQ

1.How can I place an order for MC9S08SH8MWJ through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08SH8MWJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08SH8MWJ reliable?

The price and inventory of MC9S08SH8MWJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH8MWJ is usually 5 days.

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MC9S08SH8MWJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08SH8MWJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08SH8MWJ?

For technical support, including MC9S08SH8MWJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH8MWJ requirements.

6.How does Aetrix verify that MC9S08SH8MWJ is sourced from the original manufacturer or authorized distributors?

All MC9S08SH8MWJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH8MWJ meets industry standards.

7.What is the process for return or replacement of MC9S08SH8MWJ?

All MC9S08SH8MWJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH8MWJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08SH8MWJ part is unused and in its original packaging.

Return procedure for MC9S08SH8MWJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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