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NXP Semiconductors MC9S08SH8MWJR

Part No.:
MC9S08SH8MWJR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixMC9S08SH8MWJR.pdf
Description:
IC MCU 8BIT 8KB FLASH 20SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,281

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Product details

Overview

MC9S08SH8MWJR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB Flash, 512 B RAM, and a 40-MHz CPU core. It integrates ADC (12-channel, 10-bit), ACMP, SCI, SPI, I²C, two TPM modules, RTC, and low-power stop/wait modes. Designed for cost-sensitive industrial control and sensor interface applications requiring embedded real-time operation.

For engineers reviewing the MC9S08SH8MWJR datasheet, MC9S08SH8MWJR pinout, MC9S08SH8MWJR application, or MC9S08SH8MWJR equivalent, key selection criteria include its 24-QFN package, internal clock source (ICS) with FLL supporting 2–20 MHz bus frequency, 17 GPIOs + 1 output-only pin, and support for Stop3 mode with ADC/ACMP/RTC active - critical for battery-powered sensing nodes.

Technical Context

The MC9S08SH8MWJR implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Internal Clock Source (ICS) uses a frequency-locked loop (FLL) trimmed for ±2% deviation over voltage and temperature, enabling stable bus frequencies from 2 MHz to 20 MHz without external crystal.

Peripherals operate across power modes: ADC and ACMP remain functional in Stop3 mode using the on-chip 1-kHz low-power oscillator; RTC runs continuously via external clock or internal 1-kHz oscillator; SCI supports LIN master/slave extended break handling and wake-up on active edge.

Key Specifications

Parameter Value and Actual Design Meaning
Core HCS08 8-bit CPU, 40-MHz max operation - enables deterministic real-time control at sub-25 ns instruction cycle time.
Memory 8 KB on-chip Flash (read/program/erase over full VDD/temp), 512 B RAM - sufficient for compact firmware with data logging buffers.
ADC 12-channel, 10-bit SAR ADC with 2.5 µs conversion time and internal bandgap reference - supports precision analog monitoring without external references.
Power Modes Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode; RTC and ACMP active in Stop3 - extends battery life in intermittent-sensing applications.
Clock Sources External crystal/ceramic (31.25 kHz–16 MHz) + internal ICS with FLL (2–20 MHz bus) - eliminates need for external oscillator in many designs.
I/O 17 general-purpose I/O pins + 1 output-only pin; configurable pull-ups, slew rate, drive strength, and ganged output on PTB[5:2]/PTC[3:0] - simplifies PCB routing and reduces external components.
Package 24-pin QFN (4 × 4 mm, 0.5 mm pitch), exposed pad - provides thermal efficiency and compact footprint for space-constrained industrial modules.

Pinout & Package

MC9S08SH8MWJR is housed in a 24-pin QFN package (case outline 98ASA00474D) with 4 mm × 4 mm body, 0.5 mm lead pitch, and thermally enhanced exposed pad. The package supports copper-wire bonding per Freescale QFN migration addendum Rev. 0 (2014).

Pin/Terminal Circuit Role Design Meaning
VDD Supply voltage (2.7–5.5 V) Primary power rail for core and I/O; requires local decoupling near pin 1.
VSS Ground reference Digital ground return; must be connected to exposed pad for thermal and noise performance.
XTAL Crystal oscillator input Accepts 31.25 kHz–16 MHz crystal/resonator; used with EXTAL for Pierce oscillator configuration.
EXTAL Crystal oscillator output Drives external crystal; paired with XTAL for high-precision timing source.
BKGD/MS Single-wire background debug / mode select Enables in-circuit debugging and programming; pulled high internally during reset.
RESET Active-low reset input Asynchronous reset assertion; internal pull-up ensures reliable startup without external resistor.
PTA0–PTA1 Port A general-purpose I/O Configurable as GPIO or peripheral function (e.g., SCI TX/RX); supports interrupt on edge.
PTB0–PTB7 Port B general-purpose I/O Includes ganged output capability on PTB[5:2]; supports analog comparator inputs and TPM channels.
PTC0–PTC3 Port C general-purpose I/O Ganged output supported on PTC[3:0]; usable as ADC inputs, I²C lines, or timer capture/compare signals.

Key Features

Feature Design Value
Single-wire background debug interface Enables full in-circuit emulation with breakpoint support using only one pin - reduces debug footprint and preserves I/O count.
On-chip RTC with 1-kHz internal oscillator Provides autonomous timekeeping and cyclic wake-up in all power modes without external components - ideal for periodic sensor sampling.
ADC with temperature sensor channel Integrated die-temperature measurement enables thermal compensation of analog readings or system-level thermal monitoring.
SCI with LIN-compliant break generation/detection Supports automotive and industrial LIN bus communication without external transceiver - reduces BOM cost and board area.
FLASH block protection and security features Prevents unauthorized read-out or reprogramming of firmware - essential for IP protection in deployed embedded systems.

Applications

Industrial Sensor Node Smart HVAC Actuator

Use Scenario: Battery-powered temperature/humidity sensor node collecting data every 30 seconds and transmitting via UART or SPI to gateway.

IC Role / Device Role / Timing Role: Main controller executing sensor polling, ADC conversion, data formatting, and low-power scheduling via RTC wake-up.

Use Value: Stop3 mode with active ADC and RTC enables 10+ year battery life; integrated bandgap reference ensures consistent measurement accuracy across supply voltage drift.

Use Scenario: Compact actuator module controlling damper position in commercial HVAC systems using PWM-driven motor and feedback potentiometer.

IC Role / Device Role / Timing Role: Real-time motion controller managing TPM-generated PWM, reading analog feedback, and communicating status via SCI.

Use Value: Ganged I/O on PTB/PTC simplifies motor driver enable/control logic; dual TPM modules provide independent PWM and capture channels for precise closed-loop control.

Programmable Power Monitor Embedded LIN Slave Node

Use Scenario: DIN-rail mounted device measuring AC line voltage/current via isolated analog front-end and reporting anomalies over RS-485.

IC Role / Device Role / Timing Role: Signal conditioner and protocol handler converting analog inputs to digital values and packaging them into Modbus frames.

Use Value: ACMP with internal bandgap reference detects overvoltage/undervoltage thresholds without external comparators; 512 B RAM accommodates protocol stack and transient data buffers.

Use Scenario: Door lock module in automotive body electronics receiving commands and status updates over LIN bus from central gateway.

IC Role / Device Role / Timing Role: LIN slave node implementing physical layer timing, checksum validation, and application-layer response handling.

Use Value: SCI's LIN master/slave extended break detection/generation meets ISO 17987-4 timing requirements; single-wire debug allows field firmware updates without dedicated JTAG header.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08AC16CFGE 16 KB Flash, 1 KB RAM, same HCS08 core and peripheral set but in 48-QFN package - larger memory and I/O count. Targeted at more complex control tasks requiring larger firmware or additional analog/digital interfaces. Select when firmware size exceeds 8 KB or >17 GPIOs are needed; not pin-compatible due to 48-pin vs. 24-pin QFN.
S9KEAZ128AMLH Kinetis E-series ARM Cortex-M0+, 128 KB Flash, 16 KB RAM, 48-MHz core - higher performance, modern toolchain, but different architecture. Suitable for next-generation designs where code scalability, USB, or CAN are required beyond HCS08 capabilities. Choose for new designs needing future-proofing or mixed-signal integration; migration requires full firmware rewrite and layout change.

Compared with MC9S08SH8MWJR, MC9S08AC16CFGE offers expanded memory and I/O in a physically larger package, while S9KEAZ128AMLH delivers ARM-based performance and peripherals at the cost of architectural discontinuity and increased design effort.

Availability

MC9S08SH8MWJR is available at Aetrix Electronics and suitable for industrial sensor nodes, smart HVAC actuators, programmable power monitors, and embedded LIN slave nodes requiring stable component supply and long-term manufacturability.

Supply support for MC9S08SH8MWJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontrollers from its acquisition of Freescale.

The MC9S08SH8MWJR belongs to the legacy HCS08 MCU family, designed specifically for cost-optimized, low-power embedded control in industrial automation, building systems, and appliance applications where deterministic 8-bit performance suffices.

FAQ

What is the maximum operating frequency of the MC9S08SH8MWJR CPU core?

The MC9S08SH8MWJR features an HCS08 CPU core rated for up to 40 MHz operation. This corresponds to a 25 ns instruction cycle time under optimal conditions, enabling deterministic real-time response for time-critical control loops. The actual bus frequency is governed by the Internal Clock Source (ICS) configuration, which supports 2–20 MHz using its FLL - the 40-MHz core speed is achieved via internal prescaling and pipeline optimization, not direct bus clocking.

Does the MC9S08SH8MWJR support debugging without dedicated JTAG pins?

Yes, the MC9S08SH8MWJR implements a single-wire background debug interface on the BKGD/MS pin, allowing full in-circuit debugging, flash programming, and breakpoint setting using only that one signal. This eliminates the need for a 6-pin JTAG header, conserving PCB space and I/O resources - a key advantage for compact industrial modules where board area is constrained.

Can the MC9S08SH8MWJR operate in ultra-low-power modes with analog peripherals active?

Yes, the MC9S08SH8MWJR supports Stop3 mode, where the 1-kHz internal low-power oscillator remains active and powers the RTC, ADC, and ACMP modules. This enables periodic wake-up for sensor sampling or threshold monitoring without external clock sources - verified in the datasheet Addendum Rev. 1 (2012), which confirms ADC and ACMP functionality in Stop3 with 700 µs minimum internal oscillator period at 5 V and −40°C to 125°C.

What package type and dimensions does the MC9S08SH8MWJR use?

The MC9S08SH8MWJR is packaged in a 24-pin QFN (quad flat no-lead) with 4 mm × 4 mm body size, 0.5 mm lead pitch, and an exposed thermal pad. Its case outline number is 98ASA00474D, reflecting Freescale's copper-wire bonding migration per QFN Addendum Rev. 0 (2014). This package provides superior thermal dissipation and compact footprint versus older SOIC or PDIP alternatives.

Is the MC9S08SH8MWJR compatible with LIN 2.x physical layer timing requirements?

Yes, the MC9S08SH8MWJR's SCI module supports LIN master extended break generation and LIN slave extended break detection per ISO 17987-4, enabling compliance with LIN 2.x timing specifications. Its internal baud rate generator and flexible clock sourcing allow precise break field duration control - confirmed in the MC9S08SH8 Datasheet Rev. 3 (2008), Section 14, and validated in application note AN3782.

MC9S08SH8MWJR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-SOIC (0.295", 7.50mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08SH8MWJR FAQ

1.How can I place an order for MC9S08SH8MWJR through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08SH8MWJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08SH8MWJR reliable?

The price and inventory of MC9S08SH8MWJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH8MWJR is usually 5 days.

3.What payment methods are accepted for MC9S08SH8MWJR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH8MWJR transactions.

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MC9S08SH8MWJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08SH8MWJR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08SH8MWJR?

For technical support, including MC9S08SH8MWJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH8MWJR requirements.

6.How does Aetrix verify that MC9S08SH8MWJR is sourced from the original manufacturer or authorized distributors?

All MC9S08SH8MWJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH8MWJR meets industry standards.

7.What is the process for return or replacement of MC9S08SH8MWJR?

All MC9S08SH8MWJR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH8MWJR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08SH8MWJR part is unused and in its original packaging.

Return procedure for MC9S08SH8MWJR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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