Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MC9S12A256CPVE

Part No.:
MC9S12A256CPVE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-LQFP
Datasheet:
AetrixMC9S12A256CPVE.pdf
Description:
IC MCU 16BIT 256KB FLASH 112LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:281

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MC9S12A256CPVE from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12 microcontroller with 256 KB on-chip Flash, 12 KB RAM, 4 KB EEPROM, dual 8-channel 10-bit ADCs, and five CAN 2.0 A/B modules - deployed in automotive electronic control units requiring deterministic real-time communication and robust embedded control.

For engineers reviewing the MC9S12A256CPVE datasheet, MC9S12A256CPVE pinout, MC9S12A256CPVE application, or MC9S12A256CPVE equivalent, key selection criteria include CAN bus count, Flash endurance for field updates, integrated voltage regulator (5 V to 2.5 V), 16-key wake-up capability, and compatibility with HCS12 BDM debug infrastructure.

Technical Context

The MC9S12A256CPVE implements the HCS12 CPU core with 25 MHz bus operation at 5 V, delivering 40 ns minimum instruction cycle time and full opcode compatibility with 68HC11/68HC12. It integrates a PLL-based clock generation module with 1024 programmable frequency options and a dedicated on-chip background debug (BDM) interface supporting real-time register/memory access during full-speed execution.

Its peripheral set includes two msCAN modules (each with five receive buffers and three prioritized transmit buffers), one J1850 interface, three SPIs (up to 6.25 Mbps), two SCIs, and an I²C bus - all mapped to a unified memory space via the multiplexed external bus interface (MEBI) and managed by the module mapping control (MMC) block.

Key Specifications

ParameterValue and Actual Design Meaning
CoreHCS12 16-bit CPU, 25 MHz bus speed, 40 ns min instruction cycle
Memory256 KB Flash (512-byte erase granularity), 12 KB RAM, 4 KB EEPROM
ADCTwo independent 8-channel 10-bit ATD modules, 7 µs conversion time per sample
CAN InterfacesFive CAN 2.0 A/B modules, each with FIFO-based RX (5 buffers) and prioritized TX (3 buffers)
PWM8-channel 8-bit or 4-channel 16-bit PWM with center-aligned mode support
Voltage RegulatorOn-chip 5 V to 2.5 V regulator enabling single-supply operation
Wake-Up16-key interrupt-capable GPIO wake-up source for low-power sleep modes

Pinout & Package

MC9S12A256CPVE is housed in a 112-lead LQFP package (16 × 16 mm, 0.4 mm pitch) rated for −40°C to +85°C operation. Pin functions are defined per the HCS12 D-family pin mapping standard and support multiplexed I/O, dedicated CAN transceiver pins (RX/TX per module), BDM debug interface (BKGD, RESET), and analog reference inputs (VRL, VRH).

Pin/TerminalCircuit RoleDesign Meaning
BKGDBackground Debug InterfaceSingle-wire serial debug channel for programming, breakpointing, and real-time memory/register access
RESETActive-Low Reset InputAsynchronous reset assertion; also serves as BDM entry trigger when held low during power-up
CAN0_TX / CAN0_RXCAN Module 0 Differential I/ODedicated pins for CAN0 bus physical layer connection; require external transceiver
PORTA[7:0]General-Purpose I/O / ADC Channel Inputs8-bit port configurable as digital I/O or analog inputs for ATD0; supports pull-up/pull-down
VREG_IN / VREG_OUTInternal Voltage Regulator I/OVREG_IN accepts 5 V supply; VREG_OUT delivers regulated 2.5 V to core logic and peripherals

Key Features

FeatureDesign Value
In-application Flash reprogrammingSelf-timed 20 ms page erase (512 bytes); 20 µs 16-bit burst programming without external HV
Virtual EEPROM implementationFlash array emulates EEPROM functionality for calibration data storage with 46 µs write time per 2-byte word
FIFO-based CAN receive architectureFive deep RX buffers per msCAN module enable reliable event-driven message handling without CPU polling overhead
Programmable PLL clock synthesis1024 frequency options (÷16 to ×64) allow precise bus timing alignment with low-cost crystals and reduced EMI
Enhanced Capture Timer (ECT)8-channel 16-bit timer with input capture, output compare, and pulse accumulation for motor phase control and encoder decoding

Applications

Automotive Engine Control Unit (ECU)Body Control Module (BCM)

Use Scenario: Real-time management of fuel injection timing, ignition spark advance, and OBD-II diagnostics across multiple sensors and actuators.

IC Role / Device Role / Timing Role: Central deterministic controller coordinating CAN-based sensor fusion, PWM-driven injector drivers, and ADC-sampled knock/temperature signals.

Use Value: Five CAN modules enable concurrent communication with powertrain, chassis, and infotainment networks while maintaining <100 µs interrupt latency for critical engine events.

Use Scenario: Integrated control of door locks, lighting, wipers, and HVAC using discrete I/O, PWM dimming, and LIN/CAN gateway functions.

IC Role / Device Role / Timing Role: Multi-peripheral hub managing 16-key wake-up inputs, 8-bit PWM for LED brightness control, and J1850 messaging to legacy systems.

Use Value: On-chip 5 V to 2.5 V regulator eliminates need for external LDO, reducing BOM count and PCB area in space-constrained BCM designs.

Industrial Motor Drive ControllerHeavy-Duty Vehicle Telematics Gateway

Use Scenario: Closed-loop control of 3-phase BLDC motors using hall-effect feedback, current sensing, and thermal monitoring.

IC Role / Device Role / Timing Role: Real-time motion controller executing commutation logic via ECT timer outputs and regulating torque via 16-bit PWM channels.

Use Value: Dual 10-bit ADCs sample up to 16 analog channels (phase currents, DC bus voltage, temperature) with synchronized 7 µs conversion for accurate field-oriented control.

Use Scenario: Aggregation and translation of J1850, CAN, and RS-232 telemetry data from engine ECUs, GPS modules, and driver displays.

IC Role / Device Role / Timing Role: Protocol bridge with five CAN ports and one J1850 interface, performing message filtering, prioritization, and store-and-forward routing.

Use Value: Independent FIFO buffers per CAN module prevent message loss during burst traffic from multiple vehicle subsystems under heavy network load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12DJ256BVPVSame HCS12 core, identical peripheral set, but rated for −40°C to +105°C and packaged in 112 LQFPHigher ambient temperature tolerance; no change in CAN count, Flash size, or debug interfaceSelect when extended temperature operation is required without altering firmware or PCB layout
S912XDP512J1MALREnhanced XGATE co-processor, 512 KB Flash, same pinout but different memory map and BDM protocol versionSupports higher-throughput signal processing tasks; requires updated linker scripts and debugger configurationChoose for new designs needing >256 KB code space and hardware-accelerated math operations

Compared with MC9S12A256CPVE, MC9S12DJ256BVPV offers identical functionality with extended temperature range, while S912XDP512J1MALR adds co-processing capability and doubled Flash but demands toolchain updates and memory remapping.

Availability

MC9S12A256CPVE is available at Aetrix Electronics and suitable for automotive ECU development, industrial motor control, and telematics gateway design requiring stable component supply, long-lifecycle availability, and traceable sourcing.

Supply support for MC9S12A256CPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and NXP's MCU division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S12A256CPVE belongs to the HCS12 D-family product line, designed specifically for cost-sensitive, high-reliability automotive control applications requiring multi-bus networking, deterministic real-time response, and field-upgradable firmware.

FAQ

What is the operating temperature range for the MC9S12A256CPVE?

The MC9S12A256CPVE is specified for operation from −40°C to +85°C. This industrial-grade temperature range supports deployment in under-hood automotive environments and industrial control enclosures where ambient conditions exceed commercial limits. The device maintains full parameter compliance-including CAN timing accuracy, ADC linearity, and Flash write endurance-across this entire range. Thermal derating is not required within these bounds, and the internal voltage regulator remains stable without external compensation.

Does the MC9S12A256CPVE support in-circuit debugging?

Yes, the MC9S12A256CPVE includes a dedicated Background Debug Mode (BDM) interface compliant with HCS12 BDM specification v4. It uses a single BKGD pin for bidirectional serial communication with host debug tools such as USBMULTILINKBDM. The interface supports real-time memory/register read/write, hardware breakpoints, and flash programming without halting CPU execution. No external debug header or JTAG adapter is needed, and CodeWarrior™ and Cosmic compiler toolchains provide native support for MC9S12A256CPVE BDM sessions.

How many CAN modules does the MC9S12A256CPVE integrate?

The MC9S12A256CPVE integrates five independent CAN 2.0 A/B-compliant modules. Each module features three prioritized transmit buffers and five FIFO-organized receive buffers, enabling concurrent message handling across multiple vehicle networks (e.g., powertrain, chassis, body). Unlike earlier HCS12 variants, this five-CAN configuration eliminates the need for external CAN controllers or bus arbitration logic in complex ECU architectures. All modules share the same register map and interrupt vector structure, simplifying firmware scalability.

Can the MC9S12A256CPVE operate from a single 5 V supply?

Yes, the MC9S12A256CPVE operates from a single 5 V supply via its integrated voltage regulator, which generates a stable 2.5 V core voltage internally. The VREG_IN pin accepts 4.5–5.5 V, and VREG_OUT supplies regulated 2.5 V to the CPU, Flash, RAM, and most peripherals. External decoupling (two 100 nF ceramic capacitors near VREG_IN/VREG_OUT) is required per the datasheet. This eliminates the need for an external LDO and reduces system-level power design complexity compared to non-regulated HCS12 variants.

What is the Flash memory endurance and data retention specification for the MC9S12A256CPVE?

The MC9S12A256CPVE Flash memory is rated for 10,000 program/erase cycles per block and guarantees data retention for 10 years at +85°C or 20 years at +25°C. Its 512-byte erase granularity and 2-byte programming capability enable fine-grained field updates without disturbing adjacent code. Flash endurance is validated per JEDEC JESD22-A117, and retention testing follows JESD22-A108. These specifications apply directly to the MC9S12A256CPVE and are confirmed in the MC9S12A256CPVE datasheet revision dated 2006.

MC9S12A256CPVE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Active
Programmable:
Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12A256CPVE FAQ

1.How can I place an order for MC9S12A256CPVE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12A256CPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12A256CPVE reliable?

The price and inventory of MC9S12A256CPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12A256CPVE is usually 5 days.

3.What payment methods are accepted for MC9S12A256CPVE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12A256CPVE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S12A256CPVE?

MC9S12A256CPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12A256CPVE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12A256CPVE?

For technical support, including MC9S12A256CPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12A256CPVE requirements.

6.How does Aetrix verify that MC9S12A256CPVE is sourced from the original manufacturer or authorized distributors?

All MC9S12A256CPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12A256CPVE meets industry standards.

7.What is the process for return or replacement of MC9S12A256CPVE?

All MC9S12A256CPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12A256CPVE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12A256CPVE part is unused and in its original packaging.

Return procedure for MC9S12A256CPVE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S12A256CPVE Tags

  • MC9S12A256CPVE
  • MC9S12A256CPVE PDF
  • MC9S12A256CPVE Datasheet
  • MC9S12A256CPVE Specifications
  • MC9S12A256CPVE Images
  • NXP Semiconductors
  • NXP Semiconductors MC9S12A256CPVE
  • Buy MC9S12A256CPVE
  • MC9S12A256CPVE Price
  • MC9S12A256CPVE Distributor
  • MC9S12A256CPVE Supplier
  • MC9S12A256CPVE Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER