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NXP Semiconductors MC9S12A256MPVE
- Part No.:
- MC9S12A256MPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12A256MPVE.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 112LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:300
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Product details
Overview
MC9S12A256MPVE from NXP (formerly Motorola) is a 16-bit HCS12 microcontroller with 256 KB on-chip Flash, 12 KB RAM, and 4 KB EEPROM, operating at up to 25 MHz bus frequency. It integrates dual 10-bit ATD converters (16-channel), 8-channel PWM, 32-bit enhanced capture timer, SPI, SCI, and I²C interfaces. It targets automotive body control modules requiring deterministic real-time response and robust nonvolatile storage.
For engineers reviewing the MC9S12A256MPVE datasheet, MC9S12A256MPVE pinout, MC9S12A256MPVE application, or MC9S12A256MPVE equivalent, key selection criteria include its 112-pin LQFP package, -40°C to +105°C extended temperature grade, absence of CAN controllers (distinguishing it from DT/DJ variants), and compatibility with HCS12 BDM debug protocol for in-circuit development.
Technical Context
The MC9S12A256MPVE implements the HCS12 CPU12 core with 16-bit ALU, 24-bit address space, and background debug mode (BDM) support. Its memory map includes 256 KB Flash organized in 2-KB sectors, 4 KB EEPROM with 100K write/erase cycles, and 12 KB RAM-fully accessible via the multiplexed external bus interface (MEBI).
System clocking uses an internal PLL with external crystal (4–8 MHz) or ceramic resonator input, generating a stable 25 MHz bus clock. The device lacks CAN modules (per Table 0-1), distinguishing it from MC9S12DT256/DJ256, and relies on SCI/SPI/I²C for serial communication and J1850 support is absent.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit addressing, supporting BDM debugging and single-cycle instruction execution for critical timing paths. |
| Flash Memory | 256 KB on-chip Flash with 2-KB sector erase, enabling field firmware updates without external memory and supporting secure boot via flash protection bits. |
| RAM | 12 KB on-chip RAM mapped at $2000–$4FFF, providing fast scratchpad and stack space for real-time interrupt service routines. |
| EEPROM | 4 KB EEPROM rated for 100,000 program/erase cycles and 10-year data retention at 85°C, suitable for calibration storage and configuration persistence. |
| ATD Converter | Dual 10-bit ATD modules (ATD0/ATD1), each with 8/8 analog inputs and configurable sample-and-hold, delivering ≤±2 LSB integral nonlinearity for sensor signal acquisition. |
| Bus Clock Speed | Up to 25 MHz derived from PLL (input 4–8 MHz crystal), enabling 25 MIPS throughput and deterministic interrupt latency under worst-case conditions. |
| Operating Temperature | -40°C to +105°C (V-grade), validated per AEC-Q100 stress test requirements for under-hood automotive applications. |
| I/O Count | 91 general-purpose I/O pins across Ports A, B, E, H, J, K, M, P, S, T - configurable as digital I/O, peripheral function pins, or analog inputs. |
Pinout & Package
MC9S12A256MPVE is housed in a 112-pin Low-Profile Quad Flat Package (LQFP), 20 mm × 20 mm body, 0.65 mm lead pitch, RoHS-compliant (package code PV). Thermal resistance θJA = 32°C/W (JEDEC Std 2s2p board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input | Asynchronous hardware reset with internal pull-up; initiates full register initialization and vector fetch from $FFFE–$FFFF upon deassertion. |
| EXTAL / XTAL | Crystal/resonator connection | Drives Pierce oscillator circuit (PE7=0); supports 4–8 MHz fundamental-mode crystals for precise system clock generation. |
| VDDX / VSSX | I/O power supply pair | Supplies 5 V to all GPIO ports; decoupling required within 10 mm of pins to maintain noise immunity during high-speed switching. |
| VDDA / VSSA | Analog power supply pair | Isolates ATD reference and analog front-end from digital noise; requires separate LC filtering from VDDX for ≤1 LSB conversion error. |
| BKGD | Background debug pin | Single-wire BDM interface for flash programming, breakpoint insertion, and live register inspection without halting real-time operation. |
| PA[7:0] / PB[7:0] | Multiplexed address/data bus | Provides lower/upper byte of 16-bit external bus (MEBI) in expanded mode; enables connection to external EPROM, SRAM, or peripherals. |
Key Features
| Feature | Design Value |
|---|---|
| Flash security lock | Prevents unauthorized read-out of firmware via BDM or external bus access using flash protection register (FPROT), meeting OEM anti-tampering requirements. |
| Low-power stop mode | Reduces current draw to ≤10 µA while retaining RAM contents and wake-up capability via IRQ, XIRQ, or reset - essential for battery-backed systems. |
| Enhanced capture timer (ECT) | 32-bit free-running counter with 8 input capture/compare channels and programmable prescaler, enabling precise PWM generation and encoder position tracking. |
| On-chip voltage regulator | Internal 2.5 V regulator (enabled via VREGEN pin) powers core logic, reducing external component count and improving power supply rejection ratio (PSRR). |
| Peripheral disable control | Individual module enable/disable via MODRR registers allows dynamic power gating of unused peripherals (e.g., disabling SCI when idle), cutting leakage current. |
Applications
| Body Control Module | Instrument Cluster |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in modern passenger vehicles. IC Role / Device Role / Timing Role: Main application MCU executing real-time control loops, managing LIN gateway functions, and storing user preferences in EEPROM. Use Value: 256 KB Flash accommodates multi-feature firmware with OTA update headroom; 10-bit ATD reads potentiometer and thermistor feedback for closed-loop actuator control. | Use Scenario: Driving analog gauges, LCD displays, warning indicators, and CAN message parsing in vehicle dashboards. IC Role / Device Role / Timing Role: Primary display controller interfacing with stepper drivers, segment LCDs, and discrete LEDs via GPIO and PWM outputs. Use Value: 8-channel PWM provides independent brightness control for backlighting and indicator LEDs; 25 MHz bus clock ensures sub-10 ms gauge update latency. |
| Seat Position Controller | Roof Module |
Use Scenario: Motorized seat adjustment with memory presets, obstruction detection, and multi-axis position sensing. IC Role / Device Role / Timing Role: Dedicated motor control MCU acquiring Hall sensor and potentiometer inputs, driving H-bridge gate drivers, and logging fault events. Use Value: Dual ATD modules simultaneously sample 16 analog channels (position, current, temperature); EEPROM stores seat profile offsets with 10-year retention. | Use Scenario: Integrated sunroof, power window, and ambient lighting control located in vehicle roof console. IC Role / Device Role / Timing Role: Local node MCU handling switch debouncing, PWM dimming, and LIN communication with body domain controller. Use Value: 91 GPIO pins support direct connection to 12+ switches, 4 motors, and 8 LED strings without external I/O expanders; -40°C to +105°C rating ensures reliability in sun-exposed locations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12DG256MPVE | Includes two MSCAN modules (CAN0/CAN4); identical Flash/RAM/EEPROM and pinout; same 112-pin LQFP package. | Required where CAN-based communication with powertrain or chassis ECUs is needed; not drop-in replaceable due to CAN register access conflicts. | Select MC9S12DG256MPVE only if CAN protocol integration is mandatory; otherwise MC9S12A256MPVE reduces software complexity and eliminates CAN driver overhead. |
| S912XDP512J1MAG | Successor S12X derivative with 512 KB Flash, 32 KB RAM, XGATE co-processor, and enhanced debug; 112-pin LQFP but different pin mapping and voltage requirements (3.3 V I/O). | Targets next-gen designs needing higher performance, larger code space, or advanced safety features (e.g., lockstep checking); not pin-compatible. | Choose S912XDP512J1MAG for new designs requiring scalability; retain MC9S12A256MPVE for cost-sensitive, CAN-free legacy platforms with proven qualification. |
Compared with MC9S12DG256MPVE, the MC9S12A256MPVE removes CAN hardware to reduce die size and cost while maintaining identical memory, timing, and I/O capabilities - ideal for LIN-only or discrete-signal architectures. Versus S912XDP512J1MAG, it offers mature qualification, simpler toolchain support, and 5 V tolerance, trading raw performance for production stability.
Availability
MC9S12A256MPVE is available at Aetrix Electronics and suitable for automotive body electronics, instrument clusters, and seat control modules requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MC9S12A256MPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors (formerly Motorola Semiconductor) is a global leader in automotive microcontrollers, offering scalable 8-/16-/32-bit MCUs with ASIL-ready functional safety features and broad ecosystem support.
The MC9S12A256MPVE belongs to the HCS12 family, designed specifically for cost-optimized, real-time automotive body and convenience applications where CAN is unnecessary but robust Flash, EEPROM, and analog integration are critical.
FAQ
What is the maximum bus clock frequency supported by the MC9S12A256MPVE?
The MC9S12A256MPVE supports a maximum bus clock frequency of 25 MHz, achieved via its internal PLL using a 4–8 MHz external crystal or resonator. This frequency is fully characterized across the -40°C to +105°C operating range and enables deterministic interrupt response times and 25 MIPS processing throughput for time-critical automotive control tasks.
Does the MC9S12A256MPVE include CAN controller hardware?
No, the MC9S12A256MPVE does not include any CAN controller modules. As confirmed in Table 0-1 of the MC9S12DT256 Device User Guide (which covers MC9S12A256), the "# of CANs" entry is "0", and CAN0/CAN1/CAN4 register blocks are absent. This distinguishes it from MC9S12DT256 (3 CANs) and MC9S12DG256 (2 CANs), making it suitable for LIN-only or discrete I/O architectures.
What package type and temperature grade does MC9S12A256MPVE use?
The MC9S12A256MPVE uses a 112-pin LQFP package (package code PV) with 0.65 mm pitch and operates over the extended industrial temperature range of -40°C to +105°C (V-grade). This package and rating are validated per AEC-Q100 Grade 2 requirements, ensuring reliability in under-hood and dashboard environments.
How much EEPROM memory does the MC9S12A256MPVE provide, and what is its endurance?
The MC9S12A256MPVE integrates 4 KB of on-chip EEPROM, rated for 100,000 program/erase cycles and guaranteed 10-year data retention at +85°C. This memory is accessed via dedicated EEPROM command registers and supports byte/word/phrase programming, making it suitable for storing calibration coefficients, user settings, and fault logs without external components.
Is the MC9S12A256MPVE compatible with standard HCS12 development tools?
Yes, the MC9S12A256MPVE is fully compatible with standard HCS12 development tools, including P&E Micro's USB-ML-12 and Cyclone PRO debug probes, CodeWarrior Development Studio v5.1+, and standalone flash programming utilities. Its BKGD pin implements the HCS12 Background Debug Mode protocol, enabling full read/write/debug access to Flash, RAM, and registers without requiring a JTAG interface.
MC9S12A256MPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12A256MPVE FAQ
1.How can I place an order for MC9S12A256MPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12A256MPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12A256MPVE reliable?
The price and inventory of MC9S12A256MPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12A256MPVE is usually 5 days.
3.What payment methods are accepted for MC9S12A256MPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12A256MPVE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12A256MPVE?
MC9S12A256MPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12A256MPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12A256MPVE?
For technical support, including MC9S12A256MPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12A256MPVE requirements.
6.How does Aetrix verify that MC9S12A256MPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12A256MPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12A256MPVE meets industry standards.
7.What is the process for return or replacement of MC9S12A256MPVE?
All MC9S12A256MPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12A256MPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12A256MPVE part is unused and in its original packaging.
Return procedure for MC9S12A256MPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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