NXP Semiconductors MC9S12A256VPVE
- Part No.:
- MC9S12A256VPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12A256VPVE.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 112LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S12A256VPVE from NXP (formerly Motorola) is a 16-bit HCS12 microcontroller featuring 256 KB on-chip Flash, 12 KB RAM, and 4 KB EEPROM. It integrates dual 10-bit ATD converters (ATD0/ATD1), 8-channel PWM, 32-bit enhanced capture timer, SPI, SCI, I²C, and background debug interface. Designed for automotive body electronics and industrial control, it operates at up to 25 MHz bus clock with internal PLL.
For engineers reviewing the MC9S12A256VPVE datasheet, MC9S12A256VPVE pinout, MC9S12A256VPVE application, or MC9S12A256VPVE equivalent, key selection factors include its 112-pin LQFP package, -40°C to +105°C extended temperature grade (V), VREGEN-controlled on-chip voltage regulator, and absence of CAN controllers - distinguishing it from DT/DJ/DG derivatives.
Technical Context
The MC9S12A256VPVE implements the HCS12 CPU12 core with 16-bit data path and 24-bit address space. Its memory subsystem includes 256 KB Flash organized in 2-KB blocks with burst programming capability, 4 KB EEPROM with 100K write/erase cycles, and 12 KB RAM. The CRG block supports crystal, external clock, or Colpitts/Pierce oscillator inputs with programmable PLL multiplication (1×–32×).
Peripheral integration follows the HCS12 modular architecture: MEBI enables external memory expansion; PIM configures port functionality; MSCAN is omitted (confirmed by Derivative Differences Table 0-1); and ATD modules support simultaneous sampling across 16 analog inputs with configurable resolution and conversion speed.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit addressing, supporting 16 MB linear memory map |
| Flash Memory | 256 KB on-chip Flash with 2 KB sector erase, 100K program/erase cycles, 10-year data retention |
| RAM | 12 KB on-chip RAM, battery-backed option via external circuitry |
| EEPROM | 4 KB EEPROM with 100K endurance cycles and automatic wear leveling |
| ADC Resolution | Dual 10-bit ATD converters (ATD0/ATD1), each with 8/16-channel input multiplexing and 8 µs max conversion time |
| Bus Clock Speed | Up to 25 MHz derived from internal PLL (1×–32× multiplication) or direct crystal input |
| Operating Temperature | -40°C to +105°C (V-grade), qualified for under-hood automotive applications |
| Supply Voltage | 5.0 V ±10% core and I/O supply; separate VDDA/VSSA for analog section ensures ADC noise immunity |
Pinout & Package
MC9S12A256VPVE is housed in a 112-pin LQFP (Low-Profile Quad Flat Package) with 0.4 mm pitch, case number 987, measuring 20 mm × 20 mm. Thermal pad exposed on underside improves heat dissipation in high-duty-cycle applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EXTAL / XTAL | Oscillator input/output | Connects to external crystal (4–32 MHz) or ceramic resonator; supports Colpitts or Pierce configuration per PE7 state |
| RESET | Active-low reset input | Asynchronous reset assertion clears CPU registers, disables peripherals, and forces boot vector fetch from $FFFE–$FFFF |
| BKGD / TAGHI / MODC | Background debug pin | Single-wire BDM interface for in-circuit debugging, flash programming, and real-time register inspection |
| VREGEN | Voltage regulator enable | High-active signal enabling internal 5 V regulator; must be tied high for internal VREG operation |
| XFC | PLL loop filter output | Drives external RC filter network to stabilize PLL feedback loop; critical for low-jitter clock generation |
| PA[7:0] / ADDR[15:8] / DATA[15:8] | Multiplexed address/data bus | Provides upper byte of 16-bit address and upper byte of 16-bit data during external memory accesses via MEBI |
| PB[7:0] / ADDR[7:0] / DATA[7:0] | Multiplexed address/data bus | Provides lower byte of 16-bit address and lower byte of 16-bit data; enables 64 KB external memory mapping |
| PE0–PE7 | General-purpose I/O / control signals | Includes IRQ, XIRQ, R/W, LSTRB, ECLK, and NOACC - essential for interrupt handling and external bus timing control |
Key Features
| Feature | Design Value |
|---|---|
| On-chip voltage regulation | Integrated 5 V regulator (VREG) reduces external component count; enabled via VREGEN pin for single-supply operation |
| Secure flash protection | Hardware-enforced security mode prevents unauthorized readout of Flash contents; unsecuring requires full chip erase |
| Low-power modes | Stop, Wait, and Pseudo-Stop modes reduce current to <10 µA (Stop) and <5 mA (Wait), extending battery life in sleep-state applications |
| Background debug interface | Single-pin BDM enables non-intrusive debugging, flash reprogramming, and real-time variable monitoring without halting execution |
| Flexible clock generation | Configurable PLL with selectable multiplication factor (1×–32×) and bypass mode allows precise bus clock tuning for timing-critical peripherals |
| Analog-to-digital redundancy | Dual independent ATD modules permit simultaneous sampling of two sensor sets or cross-checking for functional safety compliance |
Applications
| Automotive Body Control Module | Industrial Motor Drive Interface |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main system controller executing real-time PWM for motor actuation, reading analog sensor feedback (potentiometers, thermistors), and managing LIN communication via SCI. Use Value: 256 KB Flash accommodates complex state-machine logic and diagnostic routines; 105°C rating ensures reliability near engine compartments. | Use Scenario: Closed-loop speed and position control of BLDC motors in HVAC blowers and conveyor systems. IC Role / Device Role / Timing Role: Executes FOC (Field-Oriented Control) algorithms using ATD-sampled current feedback and generates 8-channel complementary PWM outputs with dead-time insertion. Use Value: Dual ATD converters enable simultaneous phase current sampling; 25 MHz bus clock supports sub-10 µs control loop execution. |
| Smart Power Distribution Unit | Embedded Telematics Gateway Subsystem |
Use Scenario: Solid-state replacement for mechanical relays/fuses in vehicle power distribution centers with load monitoring and short-circuit protection. IC Role / Device Role / Timing Role: Monitors voltage/current via ATD inputs, controls MOSFET gate drivers through PWM or GPIO, logs fault events to EEPROM, and communicates status over SCI. Use Value: 4 KB EEPROM provides non-volatile storage for 10,000+ fault records; VREGEN-enabled internal regulator simplifies 12 V to 5 V conversion. | Use Scenario: Secondary processing node in telematics units handling sensor aggregation (temperature, humidity, GPS auxiliary), CAN message filtering, and OTA update staging. IC Role / Device Role / Timing Role: Offloads preprocessing tasks from main MCU; interfaces with primary CAN bus via external transceiver and manages local I²C sensors. Use Value: Absence of integrated CAN eliminates resource contention; SPI and SCI interfaces allow seamless integration with host processor and peripheral ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12DJ256CPVE | Includes two MSCAN modules (CAN0/CAN4); identical Flash/RAM/EEPROM and 112-pin LQFP package | Required where CAN bus communication is needed for vehicle networking or diagnostics | Select when CAN protocol stack integration is mandatory; otherwise MC9S12A256VPVE reduces BOM cost and software complexity |
| S9S12G240F0VLHR | Successor S12G family part with 240 KB Flash, 20 KB RAM, enhanced EEPROM endurance (200K cycles), and improved ESD rating (±8 kV HBM) | Targeted for new designs requiring longer product lifecycle support and higher reliability metrics | Choose for green-field projects needing long-term availability; MC9S12A256VPVE remains valid for legacy maintenance and cost-sensitive replacements |
Compared with MC9S12DJ256CPVE, MC9S12A256VPVE removes CAN hardware to reduce die size and cost while retaining identical analog/peripheral capabilities; versus S9S12G240F0VLHR, it offers proven field reliability but lacks newer features like LINPHY and enhanced debug trace.
Availability
MC9S12A256VPVE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and smart power distribution systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S12A256VPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Motorola's semiconductor division.
The MC9S12A256VPVE belongs to the HCS12 16-bit microcontroller family, engineered for deterministic real-time control in harsh environments where functional safety, thermal resilience, and long-term supply stability are critical.
FAQ
What is the maximum bus clock frequency supported by the MC9S12A256VPVE?
The MC9S12A256VPVE supports a maximum bus clock frequency of 25 MHz. This is achieved using the internal PLL with programmable multiplication factors (1× to 32×) driven by an external crystal (typically 8 MHz) or oscillator. The PLL lock time and jitter specifications are detailed in Table A-16 of the device user guide, ensuring timing compliance for synchronous peripherals like SPI and SCI.
Does the MC9S12A256VPVE include CAN controller hardware?
No, the MC9S12A256VPVE does not include any CAN controller modules. As confirmed in Table 0-1 "Derivative Differences" of the MC9S12DT256 Device User Guide, the MC9S12A256 variant has zero CAN channels, unlike the MC9S12DT256 (3 CANs) or MC9S12DJ256 (2 CANs). System-level CAN communication requires an external CAN transceiver and software-implemented protocol stack.
How is the on-chip voltage regulator enabled on the MC9S12A256VPVE?
The on-chip voltage regulator is enabled by driving the VREGEN pin high (≥0.7 × VDD). When asserted, the internal regulator supplies regulated 5 V to the core and I/O circuits, allowing single-supply operation from a 5 V source. If VREGEN is held low, the device operates in external-regulator mode requiring separate 2.5 V and 5 V supplies - as specified in Section 2.4.7 and Table A-4 of the user guide.
What packaging and temperature grade does MC9S12A256VPVE use?
The MC9S12A256VPVE uses a 112-pin LQFP package (case number 987) and is rated for the extended temperature range of -40°C to +105°C (V-grade). The 'V' in the part number explicitly denotes this industrial/automotive extended temperature qualification, validated per AEC-Q100 stress test requirements for reliability in demanding environments.
Can the MC9S12A256VPVE be programmed and debugged in-circuit?
Yes, the MC9S12A256VPVE supports in-circuit debugging and programming via its single-wire Background Debug Mode (BDM) interface on the BKGD pin. Using standard BDM tools (e.g., P&E Multilink), engineers can perform flash programming, real-time register inspection, breakpoint setting, and memory read/write without removing the device from the target board.
MC9S12A256VPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12A256VPVE FAQ
1.How can I place an order for MC9S12A256VPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12A256VPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12A256VPVE reliable?
The price and inventory of MC9S12A256VPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12A256VPVE is usually 5 days.
3.What payment methods are accepted for MC9S12A256VPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12A256VPVE transactions.
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MC9S12A256VPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12A256VPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12A256VPVE?
For technical support, including MC9S12A256VPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12A256VPVE requirements.
6.How does Aetrix verify that MC9S12A256VPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12A256VPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12A256VPVE meets industry standards.
7.What is the process for return or replacement of MC9S12A256VPVE?
All MC9S12A256VPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12A256VPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12A256VPVE part is unused and in its original packaging.
Return procedure for MC9S12A256VPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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