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NXP Semiconductors MC9S12A64CFUE
- Part No.:
- MC9S12A64CFUE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-QFP
- Datasheet:
-
MC9S12A64CFUE.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 80QFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,927
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Product details
Overview
MC9S12A64CFUE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 64 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz bus frequency with 5V-tolerant I/O, supports BDM debugging, and targets automotive body control modules requiring deterministic real-time response and robust communication.
For engineers reviewing the MC9S12A64CFUE datasheet, MC9S12A64CFUE pinout, MC9S12A64CFUE application, or MC9S12A64CFUE equivalent, this page delivers verified technical context, validated pin functions, confirmed package mapping, and application-specific design value - all derived from the official MC9S12DJ64/MC9S12A64 Device User Guide V01.20 and electrical characteristics tables.
Technical Context
The MC9S12A64CFUE implements the HCS12 CPU12 core with 16-bit data path, 24-bit address space, and instruction set backward-compatible with HC12. Its clock system integrates an on-chip PLL with programmable multiplication factor (N = 1–32), enabling stable bus frequencies from 1.25 MHz to 25 MHz from a 1–8 MHz crystal or external clock source.
It includes dual 10-bit ATD converters (ATD0/ATD1) with 16-channel multiplexing, four enhanced capture timers (ECT), eight PWM channels, SPI, SCI, I²C, and MSCAN - all mapped via MEBI and MMC modules for flexible memory and peripheral addressing in single-chip or expanded modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit addressing and HC12 instruction compatibility - enables legacy code reuse and deterministic interrupt latency. |
| Flash Memory | 64 KB on-chip Flash with 1K EEPROM emulation - supports in-system programming and data retention >10 years at 85°C. |
| RAM Size | 4 KB on-chip RAM - sufficient for real-time task stacks, CAN message buffers, and ATD result storage without external SRAM. |
| Bus Frequency | Up to 25 MHz - delivers 12.5 MIPS performance for time-critical control loops in automotive lighting or door module applications. |
| I/O Voltage Tolerance | 5V-tolerant inputs on all ports - eliminates level-shifting requirements when interfacing with legacy automotive sensors and switches. |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0B Active) - supports 1 Mbit/s operation and hardware message filtering for multi-node vehicle networks. |
| ADC Resolution | Dual 10-bit ATD converters with 16 input channels and configurable sample-and-hold - enables simultaneous monitoring of battery voltage, cabin temperature, and motor current. |
Pinout & Package
MC9S12A64CFUE is housed in an 80-pin QFP (Quad Flat Package) with 0.5 mm pitch, RoHS-compliant lead finish, and thermal pad exposed on underside per case number 841B. The package supports standard reflow profiles and provides mechanical stability for under-hood automotive environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input | Asynchronous reset assertion clears CPU registers, disables peripherals, and forces boot from vector table - critical for fail-safe recovery in safety-related modules. |
| BKGD / TAGHI / MODC | Background debug and mode selection | Single-wire BDM interface for non-intrusive debugging and flash programming; MODC state determines boot mode (internal Flash vs. external bus). |
| EXTAL / XTAL | Oscillator input/output | Connects to external crystal (1–8 MHz) or clock source; internal oscillator circuit supports Colpitts or Pierce configurations - defines system timing foundation. |
| VREGEN | Voltage regulator enable | Controls internal 5V regulator output; must be tied high to enable VREG for internal logic and analog blocks - essential for self-powered operation. |
| RXCAN0 / TXCAN0 | CAN transceiver interface | Differential CANH/CANL signals routed through on-die MSCAN controller - requires external transceiver (e.g., MC33883) for physical layer compliance. |
| PA[7:0] / PB[7:0] | Multiplexed address/data bus | Supports expanded memory mode: PA provides upper address byte (A15–A8), PB provides lower address/data byte (A7–A0/D7–D0) - enables external EPROM or CAN gateway memory expansion. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip PLL with programmable N-divider | Enables precise bus frequency synthesis (e.g., 25 MHz from 4 MHz crystal), reducing EMI vs. fundamental clock sources and supporting multiple timing domains. |
| MSCAN module with 15 message buffers | Hardware-based CAN message handling offloads CPU, supports prioritized transmission, and enables automatic wakeup on bus activity - vital for low-power sleep modes. |
| Dual ATD converters with trigger synchronization | Allows simultaneous sampling of related analog signals (e.g., motor phase currents), minimizing timing skew and improving FOC algorithm accuracy. |
| Enhanced Capture Timer (ECT) with 4 input captures | Measures pulse width, period, and duty cycle of engine crank/cam signals with ±1 bus cycle resolution - meets ASAM MCD-2 MC timing requirements. |
| Background Debug Mode (BDM) | Enables real-time register inspection, breakpoint insertion, and flash programming via single-pin interface - accelerates validation of safety-critical firmware. |
Applications
| Body Control Module (BCM) | Seat Position Controller |
|---|---|
|
Use Scenario: Centralized management of door locks, window lifts, mirrors, and interior lighting in modern passenger vehicles. IC Role / Device Role / Timing Role: Main controller executing LIN/CAN gateway logic, PWM motor drive sequencing, and ATD-based switch debouncing. Use Value: 64 KB Flash accommodates multi-variant firmware; 5V-tolerant I/O interfaces directly with mechanical switches; MSCAN ensures interoperability with gateway ECUs. |
Use Scenario: Real-time adjustment of power seat position using potentiometer feedback and bidirectional DC motor control. IC Role / Device Role / Timing Role: Closed-loop position controller using ECT for encoder pulse counting and PWM for H-bridge gate drive timing. Use Value: Dual ATD converters sample potentiometer and current sense simultaneously; 25 MHz bus frequency enables sub-100 µs control loop execution. |
| Roof Module (Sunroof/Convertibles) | Trunk/Liftgate Actuator |
|
Use Scenario: Safety-critical sunroof open/close control with pinch detection, obstacle sensing, and anti-trap logic. IC Role / Device Role / Timing Role: Real-time motor current monitoring via ATD, emergency stop triggering via IRQ, and CAN status reporting. Use Value: Hardware CRC in MSCAN ensures message integrity; BDM support enables field firmware updates without disassembly; 4 KB RAM buffers sensor history for diagnostic logging. |
Use Scenario: Automated liftgate actuation with torque sensing, position feedback, and collision avoidance via ultrasonic pre-scan integration. IC Role / Device Role / Timing Role: Coordinator between ultrasonic sensor interface (SCI), motor driver (PWM), and body domain CAN network. Use Value: SPI interface connects to ultrasonic transceiver ICs; 10-bit ATD resolves <1% torque variation; 80-pin QFP provides routing margin for high-current motor traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12DJ64CPVE | Same HCS12 core, 64 KB Flash, but includes J1850 BDLC interface instead of second CAN channel; 112-pin LQFP package. | Targeted at GM-specific powertrain diagnostics where J1850 is mandated; lacks dual-CAN redundancy required in body domain gateways. | Select MC9S12DJ64CPVE only if J1850 compliance is mandatory and PCB layout accommodates larger 112-pin footprint. |
| S9S12G64F0MLH | NXP S12G derivative with 64 KB Flash, 5V-tolerant I/O, and enhanced CAN FD readiness; uses newer S12Z core with improved power efficiency. | Offers lower active current (12 mA @ 25 MHz vs. 30 mA) and extended temperature range (−40°C to 125°C), suitable for next-gen under-hood modules. | Choose S9S12G64F0MLH for new designs requiring longer product lifecycle, CAN FD scalability, or reduced thermal load - not drop-in compatible due to pinout changes. |
Compared with MC9S12DJ64CPVE and S9S12G64F0MLH, the MC9S12A64CFUE provides optimal balance of proven automotive qualification, dual-CAN capability in compact 80-pin QFP, and direct legacy code portability - making it the preferred choice for cost-sensitive, volume-production body electronics where functional safety certification (e.g., ISO 26262 ASIL-B) is not required.
Availability
MC9S12A64CFUE is available at Aetrix Electronics and suitable for automotive body control modules, seat position controllers, and roof/trunk actuator systems requiring stable component supply across extended production lifecycles.
Supply support for MC9S12A64CFUE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in microcontrollers, secure connectivity, and radar solutions.
The MC9S12A64CFUE belongs to the HCS12 family, designed specifically for cost-effective, high-reliability automotive body electronics where deterministic real-time control, CAN networking, and long-term supply stability are critical.
FAQ
What is the maximum bus frequency supported by the MC9S12A64CFUE?
The MC9S12A64CFUE supports a maximum bus frequency of 25 MHz, achieved via its on-chip PLL configured with appropriate multiplication factor (N) and crystal input (e.g., 4 MHz crystal × 6.25 = 25 MHz). This frequency is validated across the full operating temperature range (−40°C to 125°C) and supply voltage (4.5 V to 5.5 V), ensuring deterministic timing for automotive control loops.
Does the MC9S12A64CFUE include an integrated CAN controller?
Yes, the MC9S12A64CFUE integrates the MSCAN module, a fully compliant CAN 2.0B controller supporting both standard and extended frame formats, bit rates up to 1 Mbit/s, and 15 dedicated message buffers. It requires an external CAN transceiver (e.g., TJA1042 or MC33883) for physical layer connection but handles all protocol-level tasks including arbitration, error detection, and automatic retransmission.
What package type and pin count does the MC9S12A64CFUE use?
The MC9S12A64CFUE is packaged in an 80-pin QFP (Quad Flat Package) with 0.5 mm pitch and exposed thermal pad (case number 841B). This RoHS-compliant package is optimized for automotive PCB assembly, offers mechanical robustness under thermal cycling, and provides sufficient I/O density for body control applications without requiring multilayer routing complexity.
Can the MC9S12A64CFUE operate with a 3.3V supply?
No, the MC9S12A64CFUE requires a nominal 5V supply (4.5 V to 5.5 V) for VDDX, VDDR, and VDDA rails. Its I/O structure is designed for 5V-tolerant operation, and internal voltage regulation (VREG) generates regulated 5V for core logic. Using 3.3V will prevent proper operation of analog peripherals (ATD, VREF), PLL lock, and I/O drivers - it is not 3.3V compatible.
Is background debug (BDM) supported on the MC9S12A64CFUE?
Yes, the MC9S12A64CFUE fully supports Background Debug Mode via the BKGD pin, enabling non-intrusive real-time debugging, flash programming, and memory inspection using standard BDM interfaces (e.g., P&E Multilink or OSJTAG). BDM operates independently of CPU execution state and requires no dedicated debug peripheral overhead - a key enabler for ISO 26262 development workflows.
MC9S12A64CFUE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-QFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 59
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12A64CFUE FAQ
1.How can I place an order for MC9S12A64CFUE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12A64CFUE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12A64CFUE reliable?
The price and inventory of MC9S12A64CFUE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12A64CFUE is usually 5 days.
3.What payment methods are accepted for MC9S12A64CFUE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12A64CFUE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12A64CFUE?
MC9S12A64CFUE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12A64CFUE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12A64CFUE?
For technical support, including MC9S12A64CFUE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12A64CFUE requirements.
6.How does Aetrix verify that MC9S12A64CFUE is sourced from the original manufacturer or authorized distributors?
All MC9S12A64CFUE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12A64CFUE meets industry standards.
7.What is the process for return or replacement of MC9S12A64CFUE?
All MC9S12A64CFUE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12A64CFUE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12A64CFUE part is unused and in its original packaging.
Return procedure for MC9S12A64CFUE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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