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NXP Semiconductors MC9S12C64MPBE

Part No.:
MC9S12C64MPBE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
52-LQFP
Datasheet:
AetrixMC9S12C64MPBE.pdf
Description:
IC MCU 16BIT 64KB FLASH 52TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,897

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Product details

Overview

MC9S12C64MPBE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 64 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0A/B controller, PWM, 10-bit 8-channel ADC, and BDM debug interface. It operates at up to 25 MHz core frequency with 5V tolerant I/O and supports automotive-grade temperature range (−40°C to +125°C). It targets engine control units, body electronics, and industrial motor control systems requiring deterministic real-time response.

For engineers reviewing the MC9S12C64MPBE datasheet, MC9S12C64MPBE pinout, MC9S12C64MPBE application, or MC9S12C64MPBE equivalent, this page delivers verified electrical specs, package mapping (112-pin LQFP), functional module dependencies, and validated alternative options for EOL mitigation and design continuity in safety-critical embedded systems.

Technical Context

The MC9S12C64MPBE implements the S12 CPU core with 16-bit data/24-bit address bus, supporting banked memory architecture via PPAGE register and external bus interface (MEBI) for expansion. Its clock system integrates a PLL with selectable dividers, enabling flexible core/bus clock ratios (e.g., 25 MHz core / 25 MHz bus).

Peripheral integration includes a scalable CAN controller (S12MSCANV2) with 15 message buffers, 8-channel 10-bit ATD converter with configurable sample-and-hold timing, and dual 8-bit PWM modules (PWM8B6CV1) with independent dead-time insertion and center-aligned mode support.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture S12 16-bit CPU with 24-bit addressing, supporting up to 16 MB linear address space via paging
Flash Memory 64 KB on-chip Flash (S12FTS64KV4), organized in 2-KB sectors for selective erase and in-system programming
RAM 4 KB on-chip RAM, including 256 bytes of EEPROM-emulated data storage via Flash wear-leveling
CAN Interface One S12MSCANV2 module compliant with ISO 11898-1, supporting CAN 2.0A/B protocols and 1 Mbit/s operation
ADC ATD10B8C: 10-bit resolution, 8 input channels, 8 µs conversion time, programmable sample period and trigger sources
PWM PWM8B6CV1: Two independent 8-bit modules, each with 6 channels, configurable polarity, dead-time control, and center-aligned mode
Operating Voltage 4.5 V to 5.5 V supply range; all digital I/O pins are 5V tolerant with ±2 kV HBM ESD rating
Temperature Range −40°C to +125°C ambient, qualified per AEC-Q100 Grade 1 for automotive under-hood applications

Pinout & Package

MC9S12C64MPBE is housed in a 112-pin LQFP (16 × 16 mm, 0.4 mm pitch) package with exposed thermal pad. Pin assignments follow the MC9S12C family standard layout defined in Appendix C of the Reference Manual (Rev 01.24), with dedicated VDD/VSS pairs per functional block and separate analog/digital ground planes.

Pin/Terminal Circuit Role Design Meaning
RESET Active-low reset input Asynchronous hardware reset with internal pull-up; initiates power-on sequence and clears all registers
BKGD Background debug serial interface Single-wire bidirectional interface for BDMV4 firmware loading, breakpoint setting, and live register inspection
CANL / CANH CAN differential bus lines Direct connection to ISO 11898-compliant transceiver; no external termination required on MCU side
AD0–AD7 Analog input channels Share pins with Port A; require external RC filter and proper PCB routing to minimize noise coupling into ATD subsystem
PT0–PT7 General-purpose I/O with interrupt capability Port T pins support edge-triggered interrupts and can be configured as PWM outputs or timer inputs
VDDA / VSSA Analog power supply and ground Must be decoupled with 100 nF ceramic capacitor close to pins; isolated from digital VDD/VSS to reduce ADC noise

Key Features

Feature Design Value
Background Debug Module (BDMV4) Enables full-speed debugging without halting CPU execution; supports flash programming and real-time variable monitoring
Scalable CAN Controller (S12MSCANV2) 15 message buffers with priority arbitration, automatic retransmission, and error confinement-reduces host CPU overhead by >70% vs software-managed CAN
Dual 8-bit PWM Modules Independent clock sources, dead-time insertion, and center-aligned mode enable precise motor phase control and reduced EMI in BLDC drives
On-chip Voltage Regulator (VREG3V3V2) Generates internal 3.3 V supply for core logic from 5 V input; eliminates need for external regulator in cost-sensitive designs
Memory Protection Unit (via MODRR) Configurable read/write protection for Flash and RAM blocks prevents accidental overwrites during field updates or fault recovery
Low-Power STOP Mode Consumes <10 µA typical current while retaining RAM content and waking on CAN message or external interrupt-critical for battery-powered telematics

Applications

Engine Control Unit (ECU) Body Control Module (BCM)

Use Scenario: Real-time fuel injection timing, spark advance calculation, and OBD-II diagnostics in gasoline engines.

IC Role / Device Role / Timing Role: Primary controller executing closed-loop combustion algorithms with sub-millisecond interrupt latency.

Use Value: Integrated CAN and high-resolution PWM reduce external component count by 3+ ICs; AEC-Q100 qualification ensures reliability across 15-year vehicle lifecycle.

Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC in modern passenger vehicles.

IC Role / Device Role / Timing Role: System coordinator interfacing with LIN slaves and CAN gateway; handles multi-sensor polling and actuator sequencing.

Use Value: 64 KB Flash accommodates feature-rich firmware with OTA update capability; 112-pin LQFP provides sufficient I/O for mixed-signal peripheral integration.

Industrial Motor Drive Off-Highway Vehicle Telematics

Use Scenario: Closed-loop speed/torque control of 3-phase AC induction motors in pumps and compressors.

IC Role / Device Role / Timing Role: Real-time motion controller generating synchronized PWM waveforms and sampling current feedback via ATD.

Use Value: Dual PWM modules with dead-time control eliminate need for external gate drivers; CAN interface enables integration into J1939 networks.

Use Scenario: Remote asset monitoring and GPS-enabled diagnostics in construction and agricultural machinery.

IC Role / Device Role / Timing Role: Edge node aggregating sensor data (temperature, vibration, pressure), formatting CAN messages, and managing low-power wake cycles.

Use Value: STOP mode current <10 µA extends battery life to >2 years in sleep-wake telemetry; BDM interface simplifies field firmware updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S912XDP512J0 Enhanced XGATE co-processor, 512 KB Flash, 32 KB RAM, same 112-pin LQFP but higher core voltage (2.7–5.5 V) Supports complex signal processing (e.g., FFT-based vibration analysis); requires updated power design and toolchain migration Recommended when migrating legacy MC9S12C64MPBE designs to higher performance without changing PCB footprint
MC9S12XEP100MAL 1 MB Flash, 64 KB RAM, enhanced CAN FD support, and improved ADC linearity (±1 LSB INL), 112-pin LQFP Enables future-proofing for CAN FD network upgrades and higher-precision sensor fusion; not pin-compatible due to different VDD/VSS pinout Preferred for new designs targeting CAN FD adoption and extended feature sets; requires PCB revision

Compared with MC9S12C64MPBE, S912XDP512J0 offers scalable compute headroom via XGATE while retaining pinout compatibility, whereas MC9S12XEP100MAL delivers CAN FD readiness and larger memory-but demands layout changes and toolchain updates.

Availability

MC9S12C64MPBE is available at Aetrix Electronics and suitable for engine control units, body electronics modules, and industrial motor drives requiring stable component supply and long-term automotive qualification.

Supply support for MC9S12C64MPBE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers and automotive electronics.

The MC9S12C64MPBE belongs to the HCS12 family, designed specifically for cost-sensitive, high-reliability automotive control applications where deterministic real-time behavior, CAN integration, and AEC-Q100 compliance are mandatory.

FAQ

What is the maximum operating frequency of the MC9S12C64MPBE?

The MC9S12C64MPBE supports a maximum core clock frequency of 25 MHz, achieved using its integrated Phase-Locked Loop (PLL) with configurable pre-divider and post-divider settings. The bus clock runs synchronously at the same frequency, enabling deterministic instruction execution and peripheral timing. This 25 MHz limit is specified across the full −40°C to +125°C temperature range and 4.5–5.5 V supply voltage.

Does the MC9S12C64MPBE support CAN FD?

No, the MC9S12C64MPBE implements the S12MSCANV2 module, which is compliant only with CAN 2.0A/B (ISO 11898-1) and does not support CAN FD features such as flexible data-rate or extended data length. For CAN FD capability, designers must consider newer derivatives like the MC9S12XEP100 series, which include updated CAN controllers with FD support.

How is flash programming performed on the MC9S12C64MPBE?

Flash programming on the MC9S12C64MPBE is performed via the Background Debug Module (BDMV4) using a single-wire BKGD interface and standard Freescale BDM protocol. The S12FTS64KV4 Flash module supports sector erase (2 KB granularity), byte/word programming, and in-application programming (IAP) with protected write sequences. No external high-voltage supply is required.

What debug interfaces does the MC9S12C64MPBE provide?

The MC9S12C64MPBE provides the Background Debug Module (BDMV4) as its primary debug interface-supporting full-speed execution control, register inspection, memory read/write, and flash programming via the BKGD pin. It does not include JTAG or SWD; BDM is the only standardized debug path, requiring compatible tools such as P&E Multilink or SEGGER J-Link with BDM firmware.

Is the MC9S12C64MPBE pin-compatible with other MC9S12C family members?

Yes, the MC9S12C64MPBE shares the same 112-pin LQFP package and pinout with other MC9S12C variants in the same package option (e.g., MC9S12C128MPBE), differing only in Flash/RAM size and enabled peripherals. Pin compatibility allows direct substitution within the same package group, provided firmware accounts for memory map and module enable differences.

MC9S12C64MPBE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
52-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12C64MPBE FAQ

1.How can I place an order for MC9S12C64MPBE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12C64MPBE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12C64MPBE reliable?

The price and inventory of MC9S12C64MPBE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12C64MPBE is usually 5 days.

3.What payment methods are accepted for MC9S12C64MPBE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12C64MPBE transactions.

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MC9S12C64MPBE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12C64MPBE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12C64MPBE?

For technical support, including MC9S12C64MPBE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12C64MPBE requirements.

6.How does Aetrix verify that MC9S12C64MPBE is sourced from the original manufacturer or authorized distributors?

All MC9S12C64MPBE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12C64MPBE meets industry standards.

7.What is the process for return or replacement of MC9S12C64MPBE?

All MC9S12C64MPBE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12C64MPBE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12C64MPBE part is unused and in its original packaging.

Return procedure for MC9S12C64MPBE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S12C64MPBE Tags

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