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NXP Semiconductors MC9S12C96MFAE

Part No.:
MC9S12C96MFAE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixMC9S12C96MFAE.pdf
Description:
IC MCU 16BIT 96KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,331

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Product details

Overview

MC9S12C96MFAE from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 96 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0A/B controller, PWM, ATD10B8C 10-bit ADC with 8 channels, and BDM debug interface. It operates at up to 25 MHz core frequency with internal PLL, supports automotive-grade temperature range (−40°C to +125°C), and targets engine control units and body electronics.

For engineers reviewing the MC9S12C96MFAE datasheet, MC9S12C96MFAE pinout, MC9S12C96MFAE application, or MC9S12C96MFAE equivalent, key selection criteria include CAN bus integration, Flash endurance (10k write/erase cycles), BDM-based in-circuit debugging, and qualification for AEC-Q100 Grade 2 automotive operation.

Technical Context

The MC9S12C96MFAE implements the S12 CPU core with 16-bit data path and 24-bit address space, executing instructions in single-cycle or multi-cycle modes depending on addressing mode. Its memory subsystem includes paged Flash with EEPROM emulation support via D-Flash, and configurable wait-state logic for external bus interfacing.

Peripheral integration follows the HCS12 modular architecture: the MSCAN module provides full CAN protocol handling with message buffering and ID filtering; the ATD10B8C ADC supports software/hardware-triggered conversions with configurable sample-and-hold timing; and the CRGV4 clock system enables PLL-based frequency multiplication from crystal or external clock inputs.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureS12 16-bit CPU with 24-bit addressing, Harvard-style memory map
Flash Memory96 KB on-chip Flash (S12FTS96KV1 module), 10k erase/write cycles, 128-byte sector size
RAM4 KB on-chip RAM, battery-backed option available via external circuitry
CAN InterfaceOne S12MSCANV2 module supporting CAN 2.0A/B, 15 message buffers, programmable bit timing
ADCATD10B8C: 10-bit resolution, 8-channel input multiplexer, 8 µs conversion time, 0–5 V input range
Operating Temperature−40°C to +125°C (AEC-Q100 Grade 2 qualified)
Supply Voltage4.5 V to 5.5 V VDD, separate analog supply (VDDA/VSSA) for ADC noise isolation

Pinout & Package

MC9S12C96MFAE is housed in a 64-pin PQFP (Plastic Quad Flat Package) with 0.5 mm pitch, JEDEC MS-026AC compliant. Package dimensions are 10 mm × 10 mm × 1.4 mm, lead-free and RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: VDD/VSS for digital logic; VDDA/VSSA for analog subsystem (ADC, voltage regulator)
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external debounced signal or watchdog timeout assertion
BKGDBackground Debug pinSingle-wire BDM interface for flash programming, breakpoint setting, and real-time register inspection
CANH / CANLCAN bus differential pairDirect connection to ISO 11898-compliant transceiver; supports high-speed (up to 1 Mbps) and fault-tolerant modes
PORTA[7:0]General-purpose I/O port8-bit bidirectional port with selectable pull-ups, interrupt-on-change capability, and peripheral function multiplexing (e.g., PWM, SCI)

Key Features

FeatureDesign Value
On-chip Flash with EEPROM EmulationD-Flash partition enables wear-leveling and byte-erasure simulation for parameter storage without external EEPROM
Integrated CAN ControllerHardware-accelerated CAN protocol handling eliminates CPU overhead for message arbitration, error detection, and retransmission
Background Debug Module (BDM)Enables non-intrusive firmware updates and live debugging without halting real-time peripherals like PWM or CAN
Programmable Clock GeneratorCRGV4 supports multiple clock sources (crystal, external clock, RC oscillator) and PLL multiplication ratios (1×–32×) for flexible system timing
Automotive-Grade QualificationAEC-Q100 Grade 2 certification ensures reliability under thermal shock, vibration, and extended temperature cycling in vehicle environments

Applications

Engine Control Unit (ECU)Body Control Module (BCM)

Use Scenario: Real-time monitoring of throttle position, coolant temperature, and oxygen sensor signals in gasoline direct injection systems.

IC Role / Device Role / Timing Role: Central controller executing closed-loop fuel injection and ignition timing algorithms with sub-millisecond interrupt latency.

Use Value: Integrated ATD10B8C provides calibrated 10-bit sampling across 8 sensors; CAN interface enables seamless communication with transmission and ABS modules.

Use Scenario: Managing door lock actuators, interior lighting dimming, and window lift motor sequencing in premium sedan platforms.

IC Role / Device Role / Timing Role: Low-latency I/O coordinator with PWM-controlled LED drivers and GPIO-managed relay interfaces.

Use Value: 64-pin PQFP offers sufficient I/O count for discrete actuator control; BDM support simplifies field firmware updates during vehicle assembly.

Transmission Control Unit (TCU)Advanced Driver Assistance System (ADAS) Sensor Hub

Use Scenario: Processing gear position feedback, turbine speed, and hydraulic pressure data to execute shift logic in automatic transmissions.

IC Role / Device Role / Timing Role: Deterministic real-time controller with hardware timer synchronization for torque converter clutch engagement timing.

Use Value: TIM16B8CV1 module delivers precise 16-bit PWM outputs for solenoid current regulation; CAN bus handles diagnostic reporting to dashboard cluster.

Use Scenario: Aggregating raw analog outputs from radar proximity sensors and ambient light detectors before forwarding processed data via CAN to central ADAS ECU.

IC Role / Device Role / Timing Role: Signal conditioning and protocol translation node with minimal latency between sensor input and CAN frame transmission.

Use Value: Dual-voltage regulator (VREG3V3V2) supplies clean 3.3 V to external sensors while maintaining 5 V core logic; ATD10B8C supports simultaneous sampling of 4 analog sensor channels.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12C128MFAE128 KB Flash, same package and pinout; identical peripheral set and instruction setHigher Flash capacity supports larger bootloader + application partitions and OTA update stagingSelect when future firmware growth headroom or dual-bank update capability is required
S912XDP512J1MALRHCS12X core (enhanced S12), 512 KB Flash, 32 KB RAM, enhanced CAN FD supportNot pin-compatible; requires PCB redesign but enables higher bandwidth sensor fusion and Ethernet gateway functionsChoose for next-generation platforms requiring CAN FD, larger code footprint, or deterministic interrupt response

Compared with MC9S12C128MFAE, the MC9S12C96MFAE trades 32 KB Flash for cost-sensitive volume production; versus S912XDP512J1MALR, it offers proven AEC-Q100 qualification with lower toolchain complexity and legacy software compatibility.

Availability

MC9S12C96MFAE is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control units requiring stable component supply across automotive Tier-1 production programs.

Supply support for MC9S12C96MFAE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's automotive MCU heritage.

The MC9S12C family was designed specifically for cost-optimized, high-reliability automotive electronic control units requiring CAN connectivity, analog sensing, and robust debug infrastructure in harsh environments.

FAQ

What is the maximum operating frequency of the MC9S12C96MFAE?

The MC9S12C96MFAE achieves a maximum core frequency of 25 MHz using its internal PLL, which multiplies an external crystal or clock source (typically 4–8 MHz). This frequency is sustained across the full −40°C to +125°C operating range and is validated per AEC-Q100 Grade 2 requirements. The MC9S12C96MFAE maintains timing compliance without derating under worst-case voltage and temperature conditions.

Does the MC9S12C96MFAE support in-system programming via BDM?

Yes, the MC9S12C96MFAE fully supports in-system programming and debugging through its single-wire Background Debug Module (BDMV4). Using standard BDM firmware commands, users can erase and program Flash sectors, read/write RAM and registers, and set hardware breakpoints-all without removing the MC9S12C96MFAE from the target board or halting real-time peripheral operation.

Is the MC9S12C96MFAE qualified for automotive applications?

Yes, the MC9S12C96MFAE is AEC-Q100 Grade 2 qualified, meaning it has passed stress tests for operating temperature (−40°C to +125°C), thermal cycling, humidity bias, and mechanical shock-specifically targeting under-hood and cabin-mounted automotive ECUs. Its qualification documentation is maintained by NXP and accessible under NDA for qualified customers.

How many CAN message buffers does the MC9S12C96MFAE provide?

The MC9S12C96MFAE integrates one S12MSCANV2 module with 15 dedicated message buffers, each configurable as transmit or receive. These buffers support identifier masking, priority-based arbitration, and automatic retransmission on error frames-enabling robust CAN 2.0A/B communication without CPU intervention for routine message handling.

What is the Flash endurance specification for the MC9S12C96MFAE?

The MC9S12C96MFAE specifies 10,000 write/erase cycles for its 96 KB Flash memory (S12FTS96KV1 module), with data retention guaranteed for 20 years at +85°C. Endurance applies to individual 128-byte sectors; wear leveling must be implemented in firmware when emulating EEPROM functionality using D-Flash partitions.

MC9S12C96MFAE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Active
Programmable:
Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12C96MFAE FAQ

1.How can I place an order for MC9S12C96MFAE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12C96MFAE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12C96MFAE reliable?

The price and inventory of MC9S12C96MFAE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12C96MFAE is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12C96MFAE transactions.

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MC9S12C96MFAE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12C96MFAE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12C96MFAE?

For technical support, including MC9S12C96MFAE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12C96MFAE requirements.

6.How does Aetrix verify that MC9S12C96MFAE is sourced from the original manufacturer or authorized distributors?

All MC9S12C96MFAE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12C96MFAE meets industry standards.

7.What is the process for return or replacement of MC9S12C96MFAE?

All MC9S12C96MFAE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12C96MFAE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12C96MFAE part is unused and in its original packaging.

Return procedure for MC9S12C96MFAE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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