NXP Semiconductors MC9S12D64MPVE
- Part No.:
- MC9S12D64MPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12D64MPVE.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 112LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S12D64MPVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller with 64 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0B controller, designed for automotive body electronics and industrial control systems requiring deterministic real-time response, EEPROM emulation, and robust EMI immunity. It operates at up to 25 MHz bus frequency with 5V I/O tolerance and supports BDM debugging.
For engineers reviewing the MC9S12D64MPVE datasheet, MC9S12D64MPVE pinout, MC9S12D64MPVE application, or MC9S12D64MPVE equivalent, key selection criteria include its 80-pin QFP package, dual ATD converters (10-bit, 16-channel), MSCAN interface, PLL-based clock generation, and support for wait/stop low-power modes in safety-critical embedded environments.
Technical Context
The MC9S12D64MPVE implements the HCS12 CPU12 core with 16-bit data path and 24-bit address space, executing instructions at 1–25 MHz bus clock derived from internal PLL locked to external crystal or oscillator input. Its memory subsystem includes 64 KB Flash organized in 512-byte sectors, 4 KB RAM, and 1 KB EEPROM-emulated data storage via Flash wear-leveling routines.
Peripheral integration includes two 10-bit ATD converters (ATD0 and ATD1) with simultaneous sampling capability, four enhanced capture timers (ECT) supporting PWM generation and input capture, two full-duplex SCI modules, one SPI interface, one I²C bus controller, and a fully compliant MSCAN 2.0B module with 15 message buffers and programmable acceptance filtering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit addressing, 1–25 MHz bus clock operation |
| Flash Memory | 64 KB on-chip Flash with 512-byte sector erase, 100k write/erase cycles, 10-year data retention |
| RAM | 4 KB on-chip SRAM, accessible in all operating modes including wait/stop |
| ADC Resolution | Two independent 10-bit ATD converters (ATD0/ATD1), each with 8/16-channel multiplexed inputs and configurable sample time |
| CAN Interface | MSCAN 2.0B-compliant controller with 15 message buffers, hardware ID filtering, and loopback self-test mode |
| Package | 80-pin QFP (Quad Flat Package), 14 × 14 mm body, 0.65 mm pitch, RoHS-compliant lead finish |
| I/O Voltage | 5V-tolerant digital I/O pins with ±1 µA leakage current and 6 pF input capacitance |
| Supply Range | VDD = 4.5–5.5 V; VDDA = 4.5–5.5 V for analog section; VDDPLL = 2.35–5.5 V |
Pinout & Package
The MC9S12D64MPVE is housed in an 80-pin QFP package (case number 841B), with exposed thermal pad for improved heat dissipation in automotive under-hood applications. Pin assignments follow the standard HCS12 signal mapping for compatibility with development tools and legacy designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PT[7:0] | Port T I/O pins / IOC[7:0] | General-purpose I/O with interrupt-on-change capability; used for wake-up detection and sensor polling |
| PS[7:0] | Port S I/O pins / SCI0/SCI1/SPI signals | Dual SCI UARTs and SPI master/slave interface share these pins; configurable per mode register |
| PJ6 / RXCAN0 | CAN0 receive input | Differential receiver input for CAN physical layer; requires external transceiver (e.g., MC33886) |
| PJ7 / TXCAN0 | CAN0 transmit output | Differential driver output for CAN bus; logic-level signal routed to external CAN transceiver |
| PM[7:0] | Port M I/O pins / CAN0/SPI signals | Shared functions include CAN0 TX/RX, SPI MOSI/MISO/SCK/SS - pin multiplexing controlled by MODRR register |
| RESET | Active-low reset input | Asynchronous reset assertion clears CPU registers and initializes peripheral control registers to default states |
| BKGD | Background debug pin | Single-wire BDM interface for flash programming, breakpoint setting, and real-time register inspection |
| EXTAL / XTAL | Oscillator input/output | Connects to external crystal (4–8 MHz) or ceramic resonator; supports Colpitts or Pierce configurations |
Key Features
| Feature | Design Value |
|---|---|
| On-chip voltage regulator | Internal VREG supplies regulated 2.5 V to PLL circuitry; enabled via VREGEN pin with external capacitor filtering |
| Security module | Flash security lock prevents unauthorized read-out of program memory; unsecuring requires chip erase and BDM command sequence |
| Low-power modes | Stop mode draws ≤100 µA; pseudo-stop retains RAM and selected peripherals while halting CPU and bus clocks |
| EEPROM emulation | 1 KB of Flash configured as EEPROM-equivalent storage using NVM library routines with wear leveling and error correction |
| Interrupt vector table | Fixed 128-entry vector table located at $FF80–$FFFF; supports priority-based nested interrupts with software-selectable levels |
| Memory protection | MMC block enables dynamic remapping of Flash/RAM regions to isolate boot code, application code, and data segments |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) Subsystem |
|---|---|
Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing real-time control logic, polling switches via Port T, driving relays via PWM outputs on Port P, and communicating over CAN bus. Use Value: Integrated MSCAN and 10-bit ATD enable direct sensor interfacing (e.g., ambient temperature, battery voltage) without external ADC or CAN transceiver logic. | Use Scenario: Secondary controller monitoring throttle position, coolant temperature, and oxygen sensor signals in Tier-2 emission-compliant engines. IC Role / Device Role / Timing Role: Sensor acquisition node feeding processed data to primary ECU via CAN; uses ATD0/ATD1 simultaneous sampling for correlated measurements. Use Value: Dual ATD converters with shared trigger allow synchronized sampling across 16 channels, reducing timing skew in multi-sensor feedback loops. |
| Industrial Motor Drive Interface | Off-Highway Vehicle Telematics Gateway |
Use Scenario: Closed-loop speed and direction control of 3-phase BLDC motors in material handling equipment. IC Role / Device Role / Timing Role: PWM generator and encoder counter via ECT module; interfaces with gate driver ICs and Hall-effect sensors through Port P and Port T. Use Value: Four ECT channels support complementary PWM outputs with dead-time insertion and quadrature encoder input decoding for precise rotor position tracking. | Use Scenario: Aggregating J1939 and CAN FD data from engine, transmission, and hydraulics subsystems for remote diagnostics and fleet management. IC Role / Device Role / Timing Role: Protocol bridge between legacy CAN 2.0B networks and cellular modem; leverages dual SCI ports for modem control and GPS NMEA parsing. Use Value: Two independent SCI modules allow concurrent UART communication with modem and GNSS receiver while maintaining CAN message throughput ≥50 kbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XDP512J1MAL | 32-bit S12X core, 512 KB Flash, higher performance (50 MHz), enhanced debug features | Targeted at next-generation ECUs requiring larger code footprint and faster ISR execution | Select when migrating from legacy HCS12 designs needing scalability without architectural rewrite |
| MC9S12XEP100MAL | 16-bit S12X core, 1 MB Flash, XGATE coprocessor for offloading communications tasks | Used in high-end telematics units where CAN message filtering and protocol translation must run independently of main CPU | Choose for applications demanding parallel processing of CAN traffic and real-time control tasks |
Compared with S912XDP512J1MAL and MC9S12XEP100MAL, the MC9S12D64MPVE offers lower cost, smaller footprint, and proven qualification for AEC-Q100 Grade 2 automotive use - making it optimal for cost-sensitive, volume production body electronics where deterministic latency and field-proven reliability outweigh raw compute power.
Availability
MC9S12D64MPVE is available at Aetrix Electronics and suitable for automotive body control modules, industrial motor drives, and off-highway vehicle telematics gateways requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified silicon.
Supply support for MC9S12D64MPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in microcontrollers, RF, and analog technologies.
The MC9S12D64MPVE belongs to the HCS12 family, engineered specifically for cost-effective, high-reliability automotive body electronics and industrial control applications where robustness, CAN integration, and long product life cycles are critical design requirements.
FAQ
What is the maximum bus clock frequency supported by the MC9S12D64MPVE?
The MC9S12D64MPVE supports a maximum bus clock frequency of 25 MHz, achieved via its internal Phase-Locked Loop (PLL) which multiplies the external crystal or oscillator input (typically 4–8 MHz). This frequency is specified under VDD = 4.5–5.5 V and ambient temperature range –40°C to +125°C, meeting AEC-Q100 Grade 2 requirements for automotive under-hood deployment. The MC9S12D64MPVE's PLL configuration registers allow fine-grained control over multiplication factor and lock detection thresholds.
Does the MC9S12D64MPVE include hardware support for EEPROM emulation?
Yes, the MC9S12D64MPVE provides dedicated firmware libraries and NVM control registers enabling reliable EEPROM emulation using its on-chip Flash memory. The device allocates 1 KB of Flash for this purpose, implementing wear-leveling algorithms and error correction to achieve ≥100,000 write/erase cycles and 10-year data retention. This functionality is documented in Appendix A.3.2 of the MC9S12D64MPVE Device User Guide and validated for use in parameter storage and calibration data logging applications.
How many analog-to-digital converter channels does the MC9S12D64MPVE have?
The MC9S12D64MPVE integrates two independent 10-bit Analog-to-Digital Converters: ATD0 with 8 input channels and ATD1 with 8 input channels (total 16 unique analog inputs). Both converters support simultaneous sampling triggered by shared or independent sources, configurable conversion sequences, and selectable sample-and-hold times. Channel mapping is defined in the PAD[15:0] and AN[15:0] signal assignments, with dedicated pins such as PAD07/AN07 and PAD15/AN15 referenced in the MC9S12D64MPVE pinout documentation.
Is the MC9S12D64MPVE pin-compatible with other members of the HCS12 family?
The MC9S12D64MPVE shares the same 80-pin QFP package and core signal mapping with MC9S12D32 and MC9S12A64 derivatives, but is not fully pin-compatible due to differences in peripheral enablement and alternate function allocation. For example, PJ6/PJ7 are assigned to CAN0 in MC9S12D64MPVE but reserved in MC9S12D32. Pin compatibility must be verified per specific derivative using the "Derivative Differences" table in the MC9S12D64MPVE Device User Guide revision V01.20.
What debug interface does the MC9S12D64MPVE support?
The MC9S12D64MPVE supports the Background Debug Mode (BDM) interface via the BKGD pin, enabling single-wire in-circuit debugging, flash programming, and real-time register inspection without halting system operation. This interface is compatible with standard Freescale/NXP BDM pods and third-party debuggers such as P&E Micro's USB-ML-12. The MC9S12D64MPVE's BDM module supports memory read/write, breakpoint insertion, and secure/unsecure transitions as defined in Section 6.5 of its Device User Guide.
MC9S12D64MPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12D64MPVE FAQ
1.How can I place an order for MC9S12D64MPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12D64MPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12D64MPVE reliable?
The price and inventory of MC9S12D64MPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12D64MPVE is usually 5 days.
3.What payment methods are accepted for MC9S12D64MPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12D64MPVE transactions.
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4.How is shipping managed for MC9S12D64MPVE?
MC9S12D64MPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12D64MPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12D64MPVE?
For technical support, including MC9S12D64MPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12D64MPVE requirements.
6.How does Aetrix verify that MC9S12D64MPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12D64MPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12D64MPVE meets industry standards.
7.What is the process for return or replacement of MC9S12D64MPVE?
All MC9S12D64MPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12D64MPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12D64MPVE part is unused and in its original packaging.
Return procedure for MC9S12D64MPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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