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NXP Semiconductors MC9S12DG128BCFU

Part No.:
MC9S12DG128BCFU
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
80-QFP
Datasheet:
AetrixMC9S12DG128BCFU.pdf
Description:
IC MCU 16BIT 128KB FLASH 80QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,680

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Product details

Overview

MC9S12DG128BCFU from Freescale Semiconductor is a 16-bit HCS12 microcontroller featuring 128 KB on-chip Flash EEPROM, 8 KB RAM, dual 10-bit 8-channel ADCs (ATD0/ATD1), 8-channel PWM, 3× CAN 2.0A/B modules (MSCAN0/1/4), SPI, SCI, IIC, and J1850 BDLC interfaces - deployed in automotive engine control units and body electronics requiring deterministic real-time response.

For engineers reviewing the MC9S12DG128BCFU datasheet, MC9S12DG128BCFU pinout, MC9S12DG128BCFU application, or MC9S12DG128BCFU equivalent, key selection criteria include its 112-pin LQFP package, 25 MHz bus clock capability via PLL, 5V-tolerant I/O, integrated voltage regulator (VREG), and support for background debug mode (BDM) over BKGD pin.

Technical Context

The MC9S12DG128BCFU implements the HCS12 CPU core with 16-bit data path, 24-bit address space, and Harvard architecture memory organization. It integrates a Clock and Reset Generator (CRG) block supporting crystal, external clock, or Pierce oscillator inputs with programmable PLL multiplication (1×–32×) to achieve up to 25 MHz bus frequency.

Its peripheral set includes three independent MSCAN controllers compliant with ISO 11898-1, two 10-bit ATD converters with sample-and-hold and configurable conversion sequences, and an Enhanced Capture Timer (ECT) with input capture, output compare, and pulse-width modulation functions - all synchronized to the same internal clock domain.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture HCS12 16-bit CPU with 24-bit addressing and 16 MB linear memory map
Flash Memory 128 KB on-chip Flash EEPROM with 10K erase/write cycles and 10-year data retention
RAM 8 KB on-chip SRAM, battery-backed option available via external circuitry
Bus Clock Speed Up to 25 MHz via PLL (fOSC = 4 MHz base, ×6.25 multiplier typical)
ADC Resolution & Channels Dual 10-bit ATD converters: ATD0 and ATD1, each with 8 analog inputs and 16-word result queue
CAN Interfaces Three independent MSCAN modules (CAN0, CAN1, CAN4), each supporting full CAN 2.0A/B protocol and message buffering
I/O Voltage Tolerance 5V-tolerant digital I/O pins compatible with legacy automotive sensor and actuator interfaces

Pinout & Package

MC9S12DG128BCFU is housed in a 112-pin LQFP (Low-Profile Quad Flat Package) with 0.4 mm lead pitch, JEDEC MS-026AC standard footprint, and thermal pad for enhanced heat dissipation in engine bay applications.

Pin/Terminal Circuit Role Design Meaning
BKGD / TAGHI / MODC Background Debug Interface Single-wire BDM channel for programming, debugging, and real-time trace without halting CPU execution
EXTAL / XTAL Oscillator Input/Output Connects to external crystal (4 MHz typical) or ceramic resonator for system clock generation
XFC PLL Loop Filter Analog filter node for external RC network stabilizing PLL feedback loop; critical for jitter control
VDDA / VSSA Analog Power Supply Dedicated 5V analog supply and ground for ATD reference and converter operation; isolated from digital noise
VRH / VRL ATD Reference Inputs Accept external high/low reference voltages (e.g., 0V–5V) to define ADC full-scale range
PJ7 / PJ6 CAN4 TX/RX Differential CAN physical layer interface for third CAN bus - supports fault-tolerant or high-speed modes per configuration

Key Features

Feature Design Value
On-chip Voltage Regulator (VREG) Generates stable 2.5V core supply from 5V VDD; enables single-rail 5V system design without external LDO
Security Module Configurable flash protection via SEC register; prevents unauthorized read-out of firmware during field operation
Low-Power Modes Stop, Wait, and Pseudo-Stop modes reduce current to ≤10 µA (Stop) while preserving RAM and register state
Background Debug (BDM) Real-time non-intrusive debugging via BKGD pin; supports breakpoint insertion, memory inspection, and register dump without code modification
Peripheral Integration Coordinated timing across ECT, PWM, ATD, and CAN via shared prescalers and synchronization registers - eliminates inter-peripheral skew

Applications

Engine Control Unit (ECU) Body Control Module (BCM)

Use Scenario: Real-time acquisition of crankshaft position, throttle angle, and oxygen sensor signals in gasoline direct injection systems.

IC Role / Device Role / Timing Role: Central controller executing closed-loop fuel injection and ignition timing algorithms with sub-microsecond interrupt latency.

Use Value: Dual ATD converters enable simultaneous sampling of 16 analog channels at 8 µs conversion time, meeting ASAM MCD-2 MC timing requirements.

Use Scenario: Managing door lock actuators, window lift motors, and interior lighting via LIN and CAN networks.

IC Role / Device Role / Timing Role: Master node coordinating distributed slave devices using SCI (LIN) and MSCAN (body CAN).

Use Value: Integrated J1850 BDLC and three CAN controllers allow concurrent communication on powertrain, chassis, and infotainment buses without external bridge ICs.

Transmission Control Unit (TCU) Advanced Driver Assistance Systems (ADAS) Sensor Hub

Use Scenario: Monitoring turbine speed, solenoid valve status, and hydraulic pressure in 8-speed automatic transmissions.

IC Role / Device Role / Timing Role: Safety-critical controller implementing ASIL-B logic with watchdog supervision and memory ECC checking.

Use Value: Flash EEPROM with 10K endurance supports over-the-air calibration updates; CRC-16 checksum engine validates firmware integrity before execution.

Use Scenario: Aggregating radar, camera, and ultrasonic sensor data for parking assist and blind-spot detection.

IC Role / Device Role / Timing Role: Pre-processing node performing time-synchronized timestamping and packetization of raw sensor streams.

Use Value: ECT timer with input capture and 16-bit resolution provides ±100 ns timestamp accuracy for multi-sensor fusion alignment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S12XDP512 Enhanced XGATE co-processor, 512 KB Flash, 32 KB RAM, additional CAN and LIN channels Higher integration for complex ADAS domain controllers requiring parallel processing offload Select when >256 KB Flash or hardware-accelerated signal processing is required; not pin-compatible
S912XEQ512J2 Same HCS12 core but with enhanced EEPROM endurance (100K cycles), extended temperature range (−40°C to 125°C), and updated qualification Extended life-cycle support for new production programs targeting 15+ year vehicle service life Preferred for new designs requiring AEC-Q100 Grade 1 compliance and long-term supply assurance

Compared with MC9S12DG128BCFU, MC9S12XDP512 adds XGATE acceleration for sensor fusion tasks but requires PCB redesign, while S912XEQ512J2 offers drop-in reliability upgrades without layout changes - making it the most viable migration path for legacy platform refreshes.

Availability

MC9S12DG128BCFU is available at Aetrix Electronics and suitable for automotive ECU development, industrial motor control, and embedded safety-critical systems requiring stable component supply and long-term lifecycle support.

Supply support for MC9S12DG128BCFU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) pioneered automotive-grade microcontrollers with robust qualification, on-chip safety features, and broad ecosystem support.

The MC9S12DG128BCFU belongs to the HCS12 family designed specifically for cost-sensitive, high-reliability automotive applications including engine management, transmission control, and body electronics - emphasizing functional safety, EMC resilience, and long-term manufacturability.

FAQ

What is the maximum operating frequency of the MC9S12DG128BCFU?

The MC9S12DG128BCFU achieves a maximum bus clock frequency of 25 MHz using its internal PLL with a 4 MHz crystal input (×6.25 multiplication). This frequency governs instruction execution, peripheral timing, and interrupt response - confirmed in Section A.5.3 of the Device User Guide. The MC9S12DG128BCFU does not support overclocking beyond this specification under rated conditions.

Does the MC9S12DG128BCFU support CAN FD?

No, the MC9S12DG128BCFU implements only classic CAN 2.0A/B protocol via its three MSCAN modules. It lacks CAN FD framing, bit-rate switching, and extended data length support. CAN FD capability was introduced in later S12X and S32K families. For MC9S12DG128BCFU-based systems, CAN FD adoption requires gateway-level protocol translation.

How is flash memory programmed on the MC9S12DG128BCFU?

Flash programming on the MC9S12DG128BCFU is performed via the Background Debug Mode (BDM) interface using the BKGD pin and standard Freescale BDM protocol. The MC9S12DG128BCFU supports in-system programming without removing the device from the board, with dedicated flash control registers ($0100–$010F) managing erase, program, and verify operations.

What are the power supply requirements for the MC9S12DG128BCFU?

The MC9S12DG128BCFU requires separate analog (VDDA/VSSA) and digital (VDDX/VSSX, VDDR/VSSR) supplies, all rated at 5.0 V ±10%. Core logic uses an internal 2.5 V regulator powered from VDDX. The MC9S12DG128BCFU specifies absolute maximum ratings of −0.3 V to +6.5 V on all I/O pins, enabling direct interfacing with 5 V sensors and actuators.

Is the MC9S12DG128BCFU pin-compatible with other HCS12 derivatives like MC9S12DT128B?

Yes, the MC9S12DG128BCFU shares identical pinout and electrical characteristics with MC9S12DT128B and MC9S12DJ128B in the 112-pin LQFP package, as confirmed in Figure 2-1 of the Device User Guide. However, feature sets differ: MC9S12DG128BCFU omits CAN1 and Byteflight (BF) blocks present in DT/DJ variants, making it functionally distinct despite mechanical compatibility.

MC9S12DG128BCFU Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
80-QFP
Series:
HCS12
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
59
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12DG128BCFU FAQ

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5.How can I obtain technical support or documentation for MC9S12DG128BCFU?

For technical support, including MC9S12DG128BCFU datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DG128BCFU requirements.

6.How does Aetrix verify that MC9S12DG128BCFU is sourced from the original manufacturer or authorized distributors?

All MC9S12DG128BCFU products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DG128BCFU meets industry standards.

7.What is the process for return or replacement of MC9S12DG128BCFU?

All MC9S12DG128BCFU units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DG128BCFU, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12DG128BCFU part is unused and in its original packaging.

Return procedure for MC9S12DG128BCFU:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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