NXP Semiconductors MC9S12DG128CPV
- Part No.:
- MC9S12DG128CPV
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12DG128CPV.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 112LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,455
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Product details
Overview
MC9S12DG128CPV from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller with 128 KB on-chip Flash, 8 KB RAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz bus frequency, supports 5 V I/O, and features 10-bit ATD converter with 16 channels, 8-channel PWM, and background debug interface. It targets automotive body control modules requiring robust real-time control and CAN network integration.
For engineers reviewing the MC9S12DG128CPV datasheet, MC9S12DG128CPV pinout, MC9S12DG128CPV application, or MC9S12DG128CPV equivalent, key selection criteria include its 112-pin LQFP package, 5 V tolerant I/O, single CAN controller with dedicated pins PJ7/PJ6, PLL-based clock generation with external crystal support, and AEC-Q100 qualification for automotive use.
Technical Context
The MC9S12DG128CPV implements the HCS12 CPU core with 16-bit data path, 24-bit address space, and enhanced BDM for in-circuit debugging. Its CRG block integrates a PLL with programmable multiplication factor (1–32×), enabling stable bus clocks from 1–25 MHz using external crystals (1–8 MHz) or oscillators.
Peripheral integration includes MSCAN with full CAN 2.0B compliance, two asynchronous SCI modules, one synchronous SPI, I²C interface, 16-channel 10-bit ATD with configurable sample-and-hold, and 8-channel 8-bit PWM with center-aligned and edge-aligned modes - all mapped via MEBI and controlled through memory-mapped registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit addressing and 1.25 MIPS/MHz performance |
| Flash Memory | 128 KB on-chip Flash with 2-bit backdoor security and row programming capability |
| RAM Size | 8 KB on-chip RAM, accessible in all operating modes including wait/stop |
| Bus Frequency | Up to 25 MHz - determines maximum instruction throughput and peripheral timing margins |
| I/O Voltage | 5 V tolerant I/O with ±1 µA leakage current - compatible with legacy automotive sensor/actuator interfaces |
| CAN Interface | One MSCAN module supporting CAN 2.0B protocol, with dedicated TXCAN0/RXCAN0 pins (PJ7/PJ6) |
| ADC Resolution | 10-bit ATD with 16 input channels and software-selectable conversion speed (8–16 µs per sample) |
| Package Type | 112-pin LQFP (16 × 16 mm, 0.4 mm pitch) - RoHS-compliant, lead-free PVE variant available |
Pinout & Package
The MC9S12DG128CPV is housed in an 112-pin Low-Profile Quad Flat Package (LQFP), thermally optimized for automotive under-hood environments with junction-to-board thermal resistance of 25°C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EXTAL / XTAL | Oscillator input/output | Connects to external crystal (1–8 MHz) in Pierce mode; enables precise clock source for PLL input |
| PJ7 / TXCAN0 | CAN transmit output | Dedicated CAN 2.0B high-speed transmitter pin - requires external CAN transceiver (e.g., TJA1040) |
| PJ6 / RXCAN0 | CAN receive input | Dedicated CAN 2.0B receiver pin - electrically isolated from MCU core by internal CAN buffer |
| PE7 / XCLKS | External clock select | Configures oscillator mode: PE7 = 1 → Colpitts; PE7 = 0 → Pierce or external clock input |
| VDDA / VSSA | Analog power supply | Separate 5 V analog domain for ATD reference - minimizes digital noise coupling into ADC conversions |
| BKGD | Background debug pin | Single-wire BDM interface for flash programming and real-time debugging without halting CPU execution |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Qualified | Grade 2 (-40°C to +105°C ambient) - validated for automotive powertrain and chassis applications |
| On-chip Voltage Regulator | VREGEN pin enables internal 2.5 V regulator for PLL and core logic - reduces external component count |
| Security Module | ROMCTL-based flash protection with 2-bit backdoor key - prevents unauthorized readout of firmware |
| Low-Power Modes | Stop, Wait, and Pseudo-Stop modes with wake-up via IRQ, CAN message, or timer - extends battery life in sleep-state systems |
| Peripheral Integration | MSCAN, dual SCI, SPI, I²C, ATD, PWM, ECT, and PIM in single die - eliminates need for external co-processors in body control units |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, window lifts, mirrors, and locks in modern vehicles. IC Role / Device Role / Timing Role: Main system controller executing real-time state machines and CAN message routing between LIN sub-nodes and main bus. Use Value: 128 KB Flash stores multi-variant firmware; MSCAN handles up to 500 kbps CAN traffic; 8-channel PWM drives LED dimming and motor control. | Use Scenario: Localized control of power windows, side mirrors, and door locks with anti-pinch detection. IC Role / Device Role / Timing Role: Dedicated node processor interfacing with analog sensors (potentiometers, Hall effect), switches, and brushed DC motors. Use Value: 16-channel 10-bit ATD acquires position feedback; 5 V I/O directly interfaces with mechanical switches; low-power Stop mode extends vehicle battery life. |
| Engine Coolant Heater Control | Seat Heating System |
Use Scenario: Pre-heating engine coolant using resistive elements before cold-start in EVs and hybrids. IC Role / Device Role / Timing Role: Safety-critical thermal controller monitoring NTC sensors and driving high-side MOSFETs via PWM-gated gate drivers. Use Value: Independent ATD reference (VRH/VRL) ensures ±1 LSB accuracy over temperature; watchdog timer and COP reset prevent runaway heating. | Use Scenario: Multi-zone seat heating with independent temperature regulation per zone using PWM-driven resistive elements. IC Role / Device Role / Timing Role: Thermal management unit receiving CAN commands, reading thermistors, and modulating heater power. Use Value: 8-channel PWM provides simultaneous independent duty-cycle control; 8 KB RAM buffers PID coefficients and calibration tables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12DJ128CPV | Includes Byteflight (BF) interface; lacks MSCAN; same Flash/RAM and core | Targeted at airbag and occupant restraint systems requiring BF safety bus instead of CAN | Select when BF protocol compliance is mandatory and CAN is not required |
| S912XDP512J0VLQ | Enhanced S12X core; 512 KB Flash; 32 KB RAM; dual CAN; higher max bus frequency (50 MHz) | Designed for next-gen powertrain and advanced driver assistance where scalability and dual-CAN redundancy are needed | Choose for future-proofing or higher memory/performance demands; not drop-in compatible |
Compared with MC9S12DG128CPV, MC9S12DJ128CPV trades CAN for Byteflight safety interface - suitable for passive safety domains - while S912XDP512J0VLQ delivers significantly more memory and dual CAN but requires PCB redesign and toolchain migration.
Availability
MC9S12DG128CPV is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and embedded CAN gateway designs requiring stable component supply across extended product lifecycles.
Supply support for MC9S12DG128CPV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global leader in automotive microcontrollers, secure connectivity, and power management ICs, with deep expertise in functional safety and ASIL-compliant design.
The MC9S12DG128CPV belongs to the HCS12 family, engineered specifically for cost-sensitive, high-reliability automotive applications such as body control, lighting, and comfort systems requiring CAN 2.0B and AEC-Q100 Grade 2 operation.
FAQ
What is the maximum bus frequency supported by the MC9S12DG128CPV?
The MC9S12DG128CPV supports a maximum bus frequency of 25 MHz, achieved via its on-chip PLL with programmable multiplication factor (1–32×) and external crystal input (1–8 MHz). This frequency defines the timing base for all peripherals including MSCAN, ATD, and PWM modules. The PLL lock time and stability are specified in the CRG section of the device user guide, and operation above 25 MHz violates absolute maximum ratings.
Does the MC9S12DG128CPV include a built-in CAN controller?
Yes, the MC9S12DG128CPV integrates one fully compliant MSCAN module supporting CAN 2.0B protocol with dedicated TXCAN0 and RXCAN0 pins (PJ7 and PJ6). It supports bit rates up to 1 Mbps, message filtering, and automatic retransmission. External CAN transceivers (e.g., TJA1040 or SN65HVD230) are required for physical layer interfacing, and the MCU handles protocol stack processing in firmware.
What package type and pin count does the MC9S12DG128CPV use?
The MC9S12DG128CPV uses a 112-pin LQFP package (case number 987, 16 × 16 mm, 0.4 mm pitch), RoHS-compliant and available in lead-free PVE variant. Pin assignments are documented in Figure 2-1 of the Device User Guide, covering all signal functions including I/O ports, power supplies, oscillator, BDM, and CAN interfaces. Thermal resistance is characterized at 25°C/W junction-to-board.
Is the MC9S12DG128CPV qualified for automotive applications?
Yes, the MC9S12DG128CPV is AEC-Q100 qualified for Grade 2 operation (−40°C to +105°C ambient temperature), making it suitable for under-hood and cabin automotive applications. It meets requirements for electrostatic discharge (HBM ≥ 2 kV), latch-up immunity, and long-term reliability under thermal cycling and humidity stress - verified per AEC-Q100 Rev G test plan.
How is flash memory secured on the MC9S12DG128CPV?
Flash security on the MC9S12DG128CPV is implemented via ROMCTL register and a 2-bit backdoor key mechanism. When secured, the Flash cannot be read or programmed externally via BDM unless the correct key sequence is written to specific memory locations during reset. Unsecuring requires mass erase, which clears all Flash and EEPROM contents. Security behavior is detailed in Section 4.3 of the Device User Guide.
MC9S12DG128CPV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12DG128CPV FAQ
1.How can I place an order for MC9S12DG128CPV through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12DG128CPV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12DG128CPV reliable?
The price and inventory of MC9S12DG128CPV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DG128CPV is usually 5 days.
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MC9S12DG128CPV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12DG128CPV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12DG128CPV?
For technical support, including MC9S12DG128CPV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DG128CPV requirements.
6.How does Aetrix verify that MC9S12DG128CPV is sourced from the original manufacturer or authorized distributors?
All MC9S12DG128CPV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DG128CPV meets industry standards.
7.What is the process for return or replacement of MC9S12DG128CPV?
All MC9S12DG128CPV units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DG128CPV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12DG128CPV part is unused and in its original packaging.
Return procedure for MC9S12DG128CPV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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