Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MC9S12DG128CPV

Part No.:
MC9S12DG128CPV
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-LQFP
Datasheet:
AetrixMC9S12DG128CPV.pdf
Description:
IC MCU 16BIT 128KB FLASH 112LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,455

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MC9S12DG128CPV from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller with 128 KB on-chip Flash, 8 KB RAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz bus frequency, supports 5 V I/O, and features 10-bit ATD converter with 16 channels, 8-channel PWM, and background debug interface. It targets automotive body control modules requiring robust real-time control and CAN network integration.

For engineers reviewing the MC9S12DG128CPV datasheet, MC9S12DG128CPV pinout, MC9S12DG128CPV application, or MC9S12DG128CPV equivalent, key selection criteria include its 112-pin LQFP package, 5 V tolerant I/O, single CAN controller with dedicated pins PJ7/PJ6, PLL-based clock generation with external crystal support, and AEC-Q100 qualification for automotive use.

Technical Context

The MC9S12DG128CPV implements the HCS12 CPU core with 16-bit data path, 24-bit address space, and enhanced BDM for in-circuit debugging. Its CRG block integrates a PLL with programmable multiplication factor (1–32×), enabling stable bus clocks from 1–25 MHz using external crystals (1–8 MHz) or oscillators.

Peripheral integration includes MSCAN with full CAN 2.0B compliance, two asynchronous SCI modules, one synchronous SPI, I²C interface, 16-channel 10-bit ATD with configurable sample-and-hold, and 8-channel 8-bit PWM with center-aligned and edge-aligned modes - all mapped via MEBI and controlled through memory-mapped registers.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHCS12 16-bit CPU with 24-bit addressing and 1.25 MIPS/MHz performance
Flash Memory128 KB on-chip Flash with 2-bit backdoor security and row programming capability
RAM Size8 KB on-chip RAM, accessible in all operating modes including wait/stop
Bus FrequencyUp to 25 MHz - determines maximum instruction throughput and peripheral timing margins
I/O Voltage5 V tolerant I/O with ±1 µA leakage current - compatible with legacy automotive sensor/actuator interfaces
CAN InterfaceOne MSCAN module supporting CAN 2.0B protocol, with dedicated TXCAN0/RXCAN0 pins (PJ7/PJ6)
ADC Resolution10-bit ATD with 16 input channels and software-selectable conversion speed (8–16 µs per sample)
Package Type112-pin LQFP (16 × 16 mm, 0.4 mm pitch) - RoHS-compliant, lead-free PVE variant available

Pinout & Package

The MC9S12DG128CPV is housed in an 112-pin Low-Profile Quad Flat Package (LQFP), thermally optimized for automotive under-hood environments with junction-to-board thermal resistance of 25°C/W.

Pin/TerminalCircuit RoleDesign Meaning
EXTAL / XTALOscillator input/outputConnects to external crystal (1–8 MHz) in Pierce mode; enables precise clock source for PLL input
PJ7 / TXCAN0CAN transmit outputDedicated CAN 2.0B high-speed transmitter pin - requires external CAN transceiver (e.g., TJA1040)
PJ6 / RXCAN0CAN receive inputDedicated CAN 2.0B receiver pin - electrically isolated from MCU core by internal CAN buffer
PE7 / XCLKSExternal clock selectConfigures oscillator mode: PE7 = 1 → Colpitts; PE7 = 0 → Pierce or external clock input
VDDA / VSSAAnalog power supplySeparate 5 V analog domain for ATD reference - minimizes digital noise coupling into ADC conversions
BKGDBackground debug pinSingle-wire BDM interface for flash programming and real-time debugging without halting CPU execution

Key Features

FeatureDesign Value
AEC-Q100 QualifiedGrade 2 (-40°C to +105°C ambient) - validated for automotive powertrain and chassis applications
On-chip Voltage RegulatorVREGEN pin enables internal 2.5 V regulator for PLL and core logic - reduces external component count
Security ModuleROMCTL-based flash protection with 2-bit backdoor key - prevents unauthorized readout of firmware
Low-Power ModesStop, Wait, and Pseudo-Stop modes with wake-up via IRQ, CAN message, or timer - extends battery life in sleep-state systems
Peripheral IntegrationMSCAN, dual SCI, SPI, I²C, ATD, PWM, ECT, and PIM in single die - eliminates need for external co-processors in body control units

Applications

Body Control Module (BCM)Door Module Controller

Use Scenario: Centralized management of lighting, window lifts, mirrors, and locks in modern vehicles.

IC Role / Device Role / Timing Role: Main system controller executing real-time state machines and CAN message routing between LIN sub-nodes and main bus.

Use Value: 128 KB Flash stores multi-variant firmware; MSCAN handles up to 500 kbps CAN traffic; 8-channel PWM drives LED dimming and motor control.

Use Scenario: Localized control of power windows, side mirrors, and door locks with anti-pinch detection.

IC Role / Device Role / Timing Role: Dedicated node processor interfacing with analog sensors (potentiometers, Hall effect), switches, and brushed DC motors.

Use Value: 16-channel 10-bit ATD acquires position feedback; 5 V I/O directly interfaces with mechanical switches; low-power Stop mode extends vehicle battery life.

Engine Coolant Heater ControlSeat Heating System

Use Scenario: Pre-heating engine coolant using resistive elements before cold-start in EVs and hybrids.

IC Role / Device Role / Timing Role: Safety-critical thermal controller monitoring NTC sensors and driving high-side MOSFETs via PWM-gated gate drivers.

Use Value: Independent ATD reference (VRH/VRL) ensures ±1 LSB accuracy over temperature; watchdog timer and COP reset prevent runaway heating.

Use Scenario: Multi-zone seat heating with independent temperature regulation per zone using PWM-driven resistive elements.

IC Role / Device Role / Timing Role: Thermal management unit receiving CAN commands, reading thermistors, and modulating heater power.

Use Value: 8-channel PWM provides simultaneous independent duty-cycle control; 8 KB RAM buffers PID coefficients and calibration tables.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12DJ128CPVIncludes Byteflight (BF) interface; lacks MSCAN; same Flash/RAM and coreTargeted at airbag and occupant restraint systems requiring BF safety bus instead of CANSelect when BF protocol compliance is mandatory and CAN is not required
S912XDP512J0VLQEnhanced S12X core; 512 KB Flash; 32 KB RAM; dual CAN; higher max bus frequency (50 MHz)Designed for next-gen powertrain and advanced driver assistance where scalability and dual-CAN redundancy are neededChoose for future-proofing or higher memory/performance demands; not drop-in compatible

Compared with MC9S12DG128CPV, MC9S12DJ128CPV trades CAN for Byteflight safety interface - suitable for passive safety domains - while S912XDP512J0VLQ delivers significantly more memory and dual CAN but requires PCB redesign and toolchain migration.

Availability

MC9S12DG128CPV is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and embedded CAN gateway designs requiring stable component supply across extended product lifecycles.

Supply support for MC9S12DG128CPV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in automotive microcontrollers, secure connectivity, and power management ICs, with deep expertise in functional safety and ASIL-compliant design.

The MC9S12DG128CPV belongs to the HCS12 family, engineered specifically for cost-sensitive, high-reliability automotive applications such as body control, lighting, and comfort systems requiring CAN 2.0B and AEC-Q100 Grade 2 operation.

FAQ

What is the maximum bus frequency supported by the MC9S12DG128CPV?

The MC9S12DG128CPV supports a maximum bus frequency of 25 MHz, achieved via its on-chip PLL with programmable multiplication factor (1–32×) and external crystal input (1–8 MHz). This frequency defines the timing base for all peripherals including MSCAN, ATD, and PWM modules. The PLL lock time and stability are specified in the CRG section of the device user guide, and operation above 25 MHz violates absolute maximum ratings.

Does the MC9S12DG128CPV include a built-in CAN controller?

Yes, the MC9S12DG128CPV integrates one fully compliant MSCAN module supporting CAN 2.0B protocol with dedicated TXCAN0 and RXCAN0 pins (PJ7 and PJ6). It supports bit rates up to 1 Mbps, message filtering, and automatic retransmission. External CAN transceivers (e.g., TJA1040 or SN65HVD230) are required for physical layer interfacing, and the MCU handles protocol stack processing in firmware.

What package type and pin count does the MC9S12DG128CPV use?

The MC9S12DG128CPV uses a 112-pin LQFP package (case number 987, 16 × 16 mm, 0.4 mm pitch), RoHS-compliant and available in lead-free PVE variant. Pin assignments are documented in Figure 2-1 of the Device User Guide, covering all signal functions including I/O ports, power supplies, oscillator, BDM, and CAN interfaces. Thermal resistance is characterized at 25°C/W junction-to-board.

Is the MC9S12DG128CPV qualified for automotive applications?

Yes, the MC9S12DG128CPV is AEC-Q100 qualified for Grade 2 operation (−40°C to +105°C ambient temperature), making it suitable for under-hood and cabin automotive applications. It meets requirements for electrostatic discharge (HBM ≥ 2 kV), latch-up immunity, and long-term reliability under thermal cycling and humidity stress - verified per AEC-Q100 Rev G test plan.

How is flash memory secured on the MC9S12DG128CPV?

Flash security on the MC9S12DG128CPV is implemented via ROMCTL register and a 2-bit backdoor key mechanism. When secured, the Flash cannot be read or programmed externally via BDM unless the correct key sequence is written to specific memory locations during reset. Unsecuring requires mass erase, which clears all Flash and EEPROM contents. Security behavior is detailed in Section 4.3 of the Device User Guide.

MC9S12DG128CPV Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12DG128CPV FAQ

1.How can I place an order for MC9S12DG128CPV through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12DG128CPV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12DG128CPV reliable?

The price and inventory of MC9S12DG128CPV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DG128CPV is usually 5 days.

3.What payment methods are accepted for MC9S12DG128CPV?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12DG128CPV transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S12DG128CPV?

MC9S12DG128CPV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12DG128CPV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12DG128CPV?

For technical support, including MC9S12DG128CPV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DG128CPV requirements.

6.How does Aetrix verify that MC9S12DG128CPV is sourced from the original manufacturer or authorized distributors?

All MC9S12DG128CPV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DG128CPV meets industry standards.

7.What is the process for return or replacement of MC9S12DG128CPV?

All MC9S12DG128CPV units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DG128CPV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12DG128CPV part is unused and in its original packaging.

Return procedure for MC9S12DG128CPV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S12DG128CPV Tags

  • MC9S12DG128CPV
  • MC9S12DG128CPV PDF
  • MC9S12DG128CPV Datasheet
  • MC9S12DG128CPV Specifications
  • MC9S12DG128CPV Images
  • NXP Semiconductors
  • NXP Semiconductors MC9S12DG128CPV
  • Buy MC9S12DG128CPV
  • MC9S12DG128CPV Price
  • MC9S12DG128CPV Distributor
  • MC9S12DG128CPV Supplier
  • MC9S12DG128CPV Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER