NXP Semiconductors MC9S12DG256BCFU
- Part No.:
- MC9S12DG256BCFU
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-QFP
- Datasheet:
-
MC9S12DG256BCFU.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 80QFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,342
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S12DG256BCFU from NXP (formerly Freescale Semiconductor) is a 16-bit HCS12 microcontroller featuring 256 KB on-chip Flash EEPROM, 12 KB RAM, and integrated CAN 2.0B controller, designed for automotive body control and industrial embedded systems requiring deterministic real-time response. It operates at up to 25 MHz bus clock, supports 8-channel 10-bit ATD converters, and includes 8-channel PWM with center-aligned mode.
For engineers reviewing the MC9S12DG256BCFU datasheet, MC9S12DG256BCFU pinout, MC9S12DG256BCFU application, or MC9S12DG256BCFU equivalent, key selection criteria include its 80-pin QFP package, 5V-tolerant I/O, PLL-based clock generation with external crystal support, and integrated MSCAN module for robust vehicle network communication.
Technical Context
The MC9S12DG256BCFU implements the HCS12 CPU core with 16-bit data path, 24-bit address space, and enhanced BDM debug interface. Its Clock and Reset Generator (CRG) block supports multiple clock sources including external crystal (1–8 MHz), internal RC oscillator, and PLL multiplication (up to 50 MHz core clock).
System integration includes dual ATD modules (ATD0 and ATD1) with simultaneous sampling capability, 8-channel Enhanced Capture Timer (ECT) with input capture/output compare/PWM functions, and full-duplex SCI, SPI, and IIC peripherals - all mapped to dedicated I/O ports with configurable pull-up/pull-down devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit addressing and 1.25 MIPS/MHz performance |
| Flash Memory | 256 KB on-chip Flash EEPROM with 10K erase/write cycles and 10-year data retention |
| RAM Size | 12 KB on-chip RAM with 2-cycle access time in expanded multiplexed bus mode |
| Bus Clock Speed | Up to 25 MHz - enables real-time control loop execution within 40 ns per instruction cycle |
| ADC Resolution | Two independent 10-bit ATD modules (ATD0/ATD1), each with 8 channels and 8 µs conversion time |
| PWM Channels | 8-channel PWM subsystem supporting center-aligned, edge-aligned, and complementary output modes |
| CAN Interface | Integrated MSCAN module compliant with ISO 11898-1, supporting CAN 2.0B protocol with 32 message buffers |
| I/O Voltage | 5V-tolerant digital I/O pins with programmable pull-up/pull-down and hysteresis for noise immunity |
Pinout & Package
MC9S12DG256BCFU is housed in an 80-pin Quad Flat Package (QFP), case number 841B, with 0.5 mm lead pitch and exposed thermal pad. The package supports standard reflow soldering and provides mechanical stability for automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EXTAL / XTAL | Oscillator Input / Output | Connects to external crystal (1–8 MHz); determines base timing reference for CRG block |
| RESET | Active-low Reset Input | Asynchronous reset assertion clears CPU registers and initializes peripheral control registers |
| BKGD | Background Debug Pin | Single-wire BDM interface for non-intrusive debugging and flash programming |
| VDDX / VSSX | I/O Power / Ground | Supplies 5V to digital I/O drivers; separate from core voltage domain for noise isolation |
| VDDA / VSSA | Analog Power / Ground | Dedicated 5V supply for ATD converters and voltage regulator reference circuitry |
| PJ6 / PJ7 | CAN RX / TX Pins | Direct connection to external CAN transceiver (e.g., MC33883); require 120 Ω termination |
| PS0–PS3 | SCI0 Serial I/O | Full-duplex UART interface supporting asynchronous communication at up to 1 Mbps |
| PH0–PH7 | SPI1 Master/Slave I/O | Configurable as master or slave; supports CPHA/CPOL modes and up to 8 MHz SCK frequency |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Voltage Regulator | Internal 2.5V regulator powers core logic; enabled via VREGEN pin for flexible power sequencing |
| Security Module | Flash security lock prevents unauthorized read-out of program memory; unsecuring requires mass erase |
| Low-Power Modes | Stop, Wait, and Pseudo-Stop modes reduce current to ≤10 µA (Stop) while preserving RAM contents |
| Interrupt Vector Table | Fixed 64-entry vector table with priority-based nesting; supports 43 interrupt sources including timer, ADC, and CAN events |
| External Bus Interface | 8/16-bit multiplexed address/data bus with programmable wait-state generation for external memory expansion |
| Real-Time Interrupt (RTI) | Programmable periodic interrupt source with 1–128 ms intervals; independent of main clock domain |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) Subsystem |
|---|---|
Use Scenario: Centralized management of lighting, door locks, wipers, and HVAC in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing CAN message routing, sensor polling, and actuator drive logic with deterministic 10 ms task scheduling. Use Value: Integrated MSCAN and 8-channel PWM eliminate need for external CAN controller and motor driver ICs, reducing BOM count by ≥3 components. | Use Scenario: Secondary control node monitoring throttle position, coolant temperature, and fan speed in Tier-1 engine subsystems. IC Role / Device Role / Timing Role: Real-time analog acquisition via dual ATD modules with synchronized sampling across 16 channels. Use Value: Simultaneous 10-bit conversion on ATD0/ATD1 enables precise phase-aligned measurements critical for closed-loop feedback control. |
| Industrial Motor Drive Controller | Commercial Vehicle Telematics Gateway |
Use Scenario: Compact BLDC motor controller for HVAC blowers and power steering assist pumps. IC Role / Device Role / Timing Role: PWM generator with dead-time insertion and fault protection using ECT timers and I/O port interrupts. Use Value: Hardware-supported complementary PWM outputs reduce firmware overhead and improve switching reliability versus software-timed solutions. | Use Scenario: In-vehicle gateway aggregating J1939, LIN, and GPS data for fleet telematics reporting. IC Role / Device Role / Timing Role: Multi-protocol bridge with SCI0 (GPS), SCI1 (modem), and MSCAN (J1939) operating concurrently. Use Value: Independent baud rate generators per SCI channel allow simultaneous 9600 bps (GPS) and 38.4 kbps (modem) without CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12DJ256CPVE | Same HCS12 core and memory size but uses 112-pin LQFP package; adds extra I/O and additional CAN channel | Preferred for designs requiring >80 I/O pins or dual-CAN networks (e.g., heavy-duty truck ECUs) | Select when board layout allows larger footprint and additional CAN or PWM resources are needed |
| S912XDP512J1MALR | Enhanced XGATE co-processor, 512 KB Flash, 32 KB RAM; pin-compatible with MC9S12DG256 but higher power consumption | Suitable for next-generation platforms needing hardware-accelerated signal processing or larger code storage | Choose for migration paths where legacy software compatibility is required but performance headroom is critical |
Compared with MC9S12DJ256CPVE and S912XDP512J1MALR, the MC9S12DG256BCFU offers optimal balance of compact 80-pin packaging, proven automotive qualification, and sufficient peripheral integration for cost-sensitive body electronics - avoiding overdesign while maintaining long-term supply stability.
Availability
MC9S12DG256BCFU is available at Aetrix Electronics and suitable for automotive body control, industrial motor drives, and commercial vehicle telematics requiring stable component supply, extended temperature operation (−40°C to +125°C), and AEC-Q100 Grade 2 qualification.
Supply support for MC9S12DG256BCFU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontroller innovation through its Freescale acquisition.
The MC9S12DG256BCFU belongs to the HCS12 family, engineered specifically for cost-effective, high-reliability automotive body electronics and industrial control applications demanding robust CAN networking and mixed-signal integration.
FAQ
What is the maximum operating frequency of the MC9S12DG256BCFU?
The MC9S12DG256BCFU supports a maximum bus clock frequency of 25 MHz, achieved via its internal Phase-Locked Loop (PLL) which multiplies an external crystal input (1–8 MHz). This yields a 50 MHz core clock, enabling sub-40 ns instruction execution times essential for hard real-time control loops in automotive applications.
Does the MC9S12DG256BCFU support in-circuit debugging?
Yes, the MC9S12DG256BCFU includes a Background Debug Mode (BDM) interface accessible via the BKGD pin. This single-wire debug interface supports non-intrusive breakpoints, register inspection, and flash programming without requiring dedicated JTAG pins or halting real-time peripheral operation during development.
What are the power supply requirements for the MC9S12DG256BCFU?
The MC9S12DG256BCFU requires three distinct voltage domains: 5.0 V ±10% for I/O (VDDX/VSSX), 5.0 V ±10% for analog circuits (VDDA/VSSA), and 2.5 V regulated core supply (VDDR/VSSR) generated internally when VREGEN is asserted. Separate ground planes for digital, analog, and core domains are mandatory to meet EMC and ADC accuracy specifications.
How many CAN controllers does the MC9S12DG256BCFU integrate?
The MC9S12DG256BCFU integrates one fully compliant MSCAN module supporting CAN 2.0B protocol with 32 message buffers, programmable bit timing, and automatic retransmission. It connects directly to external CAN transceivers via PJ6 (RX) and PJ7 (TX) pins and meets ISO 11898-1 physical layer requirements.
Is the MC9S12DG256BCFU qualified for automotive use?
Yes, the MC9S12DG256BCFU is AEC-Q100 Grade 2 qualified (−40°C to +105°C ambient), with extended temperature variants rated to +125°C. It features built-in watchdog timers, clock monitor circuitry, and flash error correction - all validated for automotive body electronics and chassis control applications per ISO 26262 ASIL-B readiness guidelines.
MC9S12DG256BCFU Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-QFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 59
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12DG256BCFU FAQ
1.How can I place an order for MC9S12DG256BCFU through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12DG256BCFU on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12DG256BCFU reliable?
The price and inventory of MC9S12DG256BCFU are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DG256BCFU is usually 5 days.
3.What payment methods are accepted for MC9S12DG256BCFU?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12DG256BCFU transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12DG256BCFU?
MC9S12DG256BCFU orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12DG256BCFU order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12DG256BCFU?
For technical support, including MC9S12DG256BCFU datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DG256BCFU requirements.
6.How does Aetrix verify that MC9S12DG256BCFU is sourced from the original manufacturer or authorized distributors?
All MC9S12DG256BCFU products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DG256BCFU meets industry standards.
7.What is the process for return or replacement of MC9S12DG256BCFU?
All MC9S12DG256BCFU units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DG256BCFU, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12DG256BCFU part is unused and in its original packaging.
Return procedure for MC9S12DG256BCFU:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S12DG256BCFU Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

