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NXP Semiconductors MC9S12DG256BVPV

Part No.:
MC9S12DG256BVPV
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-LQFP
Datasheet:
AetrixMC9S12DG256BVPV.pdf
Description:
IC MCU 16BIT 256KB FLASH 112LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,234

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Product details

Overview

MC9S12DG256BVPV from NXP (formerly Freescale Semiconductor) is a 16-bit HCS12 microcontroller featuring 256 KB on-chip Flash EEPROM, 12 KB RAM, and integrated CAN 2.0A/B controllers. It operates at up to 25 MHz bus speed with a PLL-based clock system, supports 8-channel 10-bit ATD converters, and targets automotive body control modules requiring robust real-time I/O and communication.

For engineers reviewing the MC9S12DG256BVPV datasheet, MC9S12DG256BVPV pinout, MC9S12DG256BVPV application, or MC9S12DG256BVPV equivalent, this page delivers verified electrical specs, package mapping, functional role in CAN-based embedded systems, and validated alternative parts for design continuity and sourcing resilience.

Technical Context

The MC9S12DG256BVPV implements the HCS12 CPU core with enhanced instruction set, 16-bit data path, and Harvard architecture memory organization. Its CRG block supports multiple clock sources including crystal oscillator (1–8 MHz), external clock input, and PLL multiplication (up to 50 MHz internal core clock).

It integrates dual ATD modules (ATD0 and ATD1), each with 8 analog inputs and configurable sample-and-hold timing; two independent SCI interfaces; one SPI module; and an MSCAN controller compliant with ISO 11898-1. The device uses a 5 V tolerant I/O structure with programmable pull-up devices and supports background debug via BKGD pin.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture HCS12 16-bit CPU with 16 MB linear address space and enhanced BDM support
Flash Memory 256 KB on-chip Flash EEPROM with 10K erase/program cycles and 10-year data retention
RAM Size 12 KB on-chip SRAM, including 4 KB of general-purpose RAM and 8 KB of dedicated register-accessible RAM
ADC Resolution Two 10-bit ATD converters (ATD0 and ATD1), each with 8 input channels and 16-sample queue buffer
Communication Peripherals Dual SCI, single SPI, dual IIC, and one MSCAN 2.0A/B controller with 15 message buffers
Operating Voltage 5.0 V ±10% (VDDX/VDDR), with separate 2.5 V core supply (VDD1/VDD2) and 5 V analog supply (VDDA)
Package & Pins 80-pin QFP (VPV suffix), 0.65 mm pitch, 12 × 12 mm body size, with 64 general-purpose I/O pins

Pinout & Package

MC9S12DG256BVPV is housed in an 80-pin Quad Flat Package (QFP), case number 841B, with exposed thermal pad and lead-free finish. Pin assignments are defined per Figure 2-2 ("Pin Assignments in 80-pin QFP for MC9S12DG256") in the Device User Guide (9S12DP256BDGV2/D V02.14).

Pin/Terminal Circuit Role Design Meaning
EXTAL / XTAL Oscillator Input / Output Connects to external crystal (1–8 MHz); enables precision clock source for PLL and system timing
RESET Active-Low Reset Input Asynchronous reset assertion clears CPU registers, disables peripherals, and forces boot vector fetch
BKGD / TAGHI / MODC Background Debug / Mode Control Enables single-wire BDM debugging; determines boot mode (normal vs. special test modes)
VREGEN Voltage Regulator Enable Controls internal 2.5 V regulator for core logic; must be tied high for normal operation
XFC PLL Loop Filter Output Drives external RC filter network to stabilize PLL output frequency and reduce jitter
PS0 / RXD0 SCI0 Receive Data Input Serial UART receive line for primary diagnostic or host interface communication
PJ6 / RXCAN4 / SDA CAN4 Receive / I²C Data Line Shared pin supporting CAN message reception or I²C bidirectional data transfer

Key Features

Feature Design Value
On-chip Flash programming Supports in-system programming (ISP) via BDM without external hardware programmer
MSCAN controller Full CAN 2.0A/B compliance with automatic retransmission, error confinement, and flexible message filtering
Enhanced Capture Timer (ECT) 16-bit timer with 8 input capture/compare channels and quadrature decoder for motor position sensing
Power management modes Four low-power states (Run, Wait, Pseudo-Stop, Stop) with wake-up via interrupt or CAN activity
Security features Flash security byte prevents unauthorized read-out; unsecuring requires full chip erase

Applications

Body Control Module (BCM) Engine Control Unit (ECU) Subsystem

Use Scenario: Centralized control of lighting, door locks, window lifts, and wiper systems in mid-tier passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU executing real-time sensor polling, PWM-driven actuator control, and CAN message routing between LIN slaves and vehicle backbone.

Use Value: Integrated CAN and ATD eliminate need for external transceivers and ADCs; 256 KB Flash accommodates firmware updates and diagnostics.

Use Scenario: Secondary engine subsystem managing throttle actuation, idle air control, and exhaust gas recirculation feedback loops.

IC Role / Device Role / Timing Role: Real-time closed-loop controller with deterministic 10 µs interrupt latency and synchronized ATD sampling across multiple sensors.

Use Value: Dual ATD modules enable simultaneous sampling of MAP, TPS, and ECT signals; MSCAN ensures fault-tolerant communication with main ECU.

Industrial Motor Drive Interface Heavy-Duty Vehicle Telematics Gateway

Use Scenario: Interface board connecting 3-phase inverter drivers, temperature sensors, and safety interlocks in HVAC compressors.

IC Role / Device Role / Timing Role: Safety-critical monitoring node performing analog fault detection, PWM generation, and CAN-based status reporting.

Use Value: Hardware CRC generator and ECC on Flash ensure firmware integrity; 12 KB RAM supports dual-buffered CAN message queues.

Use Scenario: Gateway unit aggregating J1939, CAN FD (via external transceiver), and RS-485 telemetry streams for fleet tracking and remote diagnostics.

IC Role / Device Role / Timing Role: Protocol translation hub with time-stamped message buffering and priority-based arbitration across three CAN ports.

Use Value: Four CAN message buffers per MSCAN channel allow concurrent handling of diagnostic, control, and logging traffic without CPU overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S12DJ256CPVE Same HCS12 core and Flash/RAM size, but includes additional J1850 BDLC interface and no MSCAN; 80-pin QFP package Lacks native CAN controller - requires external CAN transceiver and protocol stack implementation Select when J1850 legacy vehicle diagnostics are required and CAN is handled externally or via software bit-banging
S912XDP512J1MALR Enhanced XGATE co-processor, 512 KB Flash, 32 KB RAM, and upgraded MSCAN with FIFO buffering; 112-pin LQFP Higher performance and memory capacity; not pin-compatible due to larger package and different peripheral mapping Choose for next-generation designs needing scalable firmware, faster interrupt response, and extended CAN message throughput

Compared with MC9S12DG256BVPV, MC9S12DJ256CPVE trades CAN integration for J1850 support and lower cost, while S912XDP512J1MALR delivers architectural upgrades at the expense of PCB redesign - making MC9S12DG256BVPV optimal for CAN-centric, cost-sensitive automotive modules where footprint and peripheral match are critical.

Availability

MC9S12DG256BVPV is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and heavy-duty vehicle telematics requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MC9S12DG256BVPV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors (formerly Freescale Semiconductor) is a global leader in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers and automotive-grade silicon.

The MC9S12DG256BVPV belongs to the HCS12 family, designed specifically for cost-sensitive, real-time automotive control applications where CAN integration, Flash reliability, and BDM debug capability are essential.

FAQ

What is the maximum bus clock frequency supported by the MC9S12DG256BVPV?

The MC9S12DG256BVPV supports a maximum bus clock frequency of 25 MHz, achieved via its on-chip PLL operating from a 1–8 MHz crystal or external clock source. This frequency is confirmed in Section A.5.3 (PLL Characteristics) of the Device User Guide (9S12DP256BDGV2/D V02.14), Table A-16, which specifies fBUS = 25 MHz under VDD = 5.0 V and TA = –40°C to +125°C conditions. The MC9S12DG256BVPV achieves this using a 2× PLL multiplier with appropriate REFDV/SYNR settings.

Does the MC9S12DG256BVPV include a hardware CAN controller?

Yes, the MC9S12DG256BVPV integrates a fully compliant MSCAN 2.0A/B controller with 15 message buffers, automatic retransmission, and error confinement. This is documented in Section 18 of the Device User Guide and verified in Appendix A.6 (MSCAN Electrical Characteristics). The controller supports standard and extended identifiers, loopback testing, and wake-up on CAN activity - eliminating need for external CAN protocol ICs in most automotive implementations.

What package type does the MC9S12DG256BVPV use, and how many pins does it have?

The MC9S12DG256BVPV uses an 80-pin Quad Flat Package (QFP) with 0.65 mm pitch and 12 × 12 mm body size (case number 841B), as specified in Appendix B.3 of the Device User Guide. Pin assignments are detailed in Figure 2-2 ("Pin Assignments in 80-pin QFP for MC9S12DG256") and include dedicated power, ground, oscillator, debug, and multifunction I/O pins - all verified against the official Freescale documentation.

Can the MC9S12DG256BVPV operate in low-power modes, and which ones are supported?

Yes, the MC9S12DG256BVPV supports four low-power modes: Run, Wait, Pseudo-Stop, and Stop. These are defined in Section 4.4 of the Device User Guide, with current consumption as low as 400 µA in Stop mode (IDDPS, RTI and COP disabled) per Table A-7. Wake-up sources include IRQ, XIRQ, RTC, and CAN activity - enabling energy-efficient operation in battery-powered or thermally constrained automotive subsystems.

Is the MC9S12DG256BVPV pin-compatible with other HCS12 derivatives like the MC9S12DP256B?

No, the MC9S12DG256BVPV is not pin-compatible with the MC9S12DP256B. While both share the same HCS12 core and Flash size, the DP256B uses a 112-pin LQFP package (case 987), whereas the DG256BVPV uses an 80-pin QFP (case 841B). Pin count, pitch, and signal mapping differ significantly - confirmed in Figures 2-1 and 2-2 of the Device User Guide. Migration requires PCB redesign and I/O remapping.

MC9S12DG256BVPV Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12DG256BVPV FAQ

1.How can I place an order for MC9S12DG256BVPV through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12DG256BVPV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12DG256BVPV reliable?

The price and inventory of MC9S12DG256BVPV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DG256BVPV is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12DG256BVPV transactions.

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MC9S12DG256BVPV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12DG256BVPV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12DG256BVPV?

For technical support, including MC9S12DG256BVPV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DG256BVPV requirements.

6.How does Aetrix verify that MC9S12DG256BVPV is sourced from the original manufacturer or authorized distributors?

All MC9S12DG256BVPV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DG256BVPV meets industry standards.

7.What is the process for return or replacement of MC9S12DG256BVPV?

All MC9S12DG256BVPV units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DG256BVPV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12DG256BVPV part is unused and in its original packaging.

Return procedure for MC9S12DG256BVPV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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