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NXP Semiconductors MC9S12DG256MPVE

Part No.:
MC9S12DG256MPVE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-LQFP
Datasheet:
AetrixMC9S12DG256MPVE.pdf
Description:
IC MCU 16BIT 256KB FLASH 112LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:589

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Product details

Overview

MC9S12DG256MPVE from Freescale Semiconductor is a 16-bit automotive-grade microcontroller featuring 256KB Flash EEPROM, 12KB RAM, 4KB EEPROM, dual 10-bit ADCs (16-channel total), two CAN 2.0A/B modules, and an enhanced capture timer (ECT). It operates at up to 50MHz core frequency (25MHz bus speed) in single-chip mode and targets body control modules, gateway ECUs, and multiplexed vehicle networks.

For engineers reviewing the MC9S12DG256MPVE datasheet, MC9S12DG256MPVE pinout, MC9S12DG256MPVE application, or MC9S12DG256MPVE equivalent, key selection criteria include its 112-pin LQFP package, dual CAN interface with software compatibility, 2.5V internal logic supply with 5V I/O tolerance, and background debug mode (BDM) support for in-circuit development.

Technical Context

The MC9S12DG256MPVE implements the CPU12 core with M68HC11 instruction set compatibility, 7-bit prescaler ECT with 8 input-capture/output-compare channels, and flexible peripheral routing-including CAN0/CAN4 pins shared with J1850/IIC and software-selectable SPI/PWM mappings. Its SIM module integrates clock generation (PLL-based), interrupt control, and multiplexed external bus interface (MEBI).

It supports both 16-bit wide and 8-bit narrow external bus modes, enabling cost-optimized memory interfacing. The device includes a 0.5–16MHz crystal oscillator, limp-home mode on clock failure, and 22 wake-up capable I/O lines (Port H, P, J, IRQ, XIRQ) for low-power STOP/WAIT operation in automotive environments.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureCPU12 16-bit core, upward-compatible with M68HC11 instruction set and programmer's model
Flash Memory256KB Flash EEPROM with 16KB fixed boot sector and protected page windowing
RAM / EEPROM12KB on-chip RAM; 4KB EEPROM mappable to any 4KB boundary for data retention
CAN InterfacesTwo CAN 2.0A/B software-compatible modules, each with 5 receive + 3 transmit buffers
ADC SystemDual 10-bit ADC modules totaling 16 channels; external trigger capability for synchronized sampling
Operating Voltage5V I/O and analog inputs; internal 2.5V logic supply regulated from 5V via on-chip VREGEN
Package & Temp112-pin LQFP (case 987); rated for −40°C to +125°C ambient operating temperature

Pinout & Package

MC9S12DG256MPVE uses a 112-pin LQFP package (case number 987), measuring 20.0 × 20.0 mm with 0.65 mm pitch. It features 5V-tolerant I/O, 5V A/D inputs, and dedicated power domains (VDDA/VSSA for analog, VDD1/VSS1 and VDD2/VSS2 for digital, VDDPLL/VSSPLL for PLL).

Pin/TerminalCircuit RoleDesign Meaning
PA0–PA7Address/Data Bus (AD0–AD7)Multiplexed 8-bit address/data lines for narrow-mode external memory interface
PM0/PM1CAN0 RX/TXDedicated differential CAN transceiver interface for primary CAN network
PJ6/PJ7CAN4 RX/TXSecondary CAN interface routed via software-controlled port sharing with IIC
PP0–PP7PWM0–PWM7 / SPI28-channel PWM outputs or alternate SPI2 interface; configurable per application need
PS0–PS7SCI0/SCI1 / SPI0Two full-duplex UART interfaces and primary SPI controller on shared pins
PE0–PE7Interrupt-capable I/OIncludes IRQ, XIRQ, and 8-bit Port E with programmable pull-ups for wake-up from low-power modes

Key Features

FeatureDesign Value
Single-wire BDM debugEnables real-time in-circuit debugging and flash programming without dedicated JTAG hardware
Software-routed peripheralsCAN0/CAN4 and SPI2 can be remapped to alternate pins via register configuration-no PCB change required
Dual 10-bit ADC with trigger syncSupports precise timing-critical sensor acquisition across 16 channels using external or timer-based triggers
Flexible CAN filteringConfigurable as 2×32-bit, 4×16-bit, or 8×8-bit identifier masks per module for selective message reception
Low-power wake-up capability22 interrupt-capable pins (Port H, P, J, IRQ, XIRQ) allow rapid exit from STOP/WAIT modes with sub-µs latency

Applications

Body Control Module (BCM)Vehicle Gateway ECU

Use Scenario: Centralized management of lighting, door locks, windows, and wipers in modern passenger vehicles.

IC Role / Device Role / Timing Role: Main controller executing real-time state machines, managing LIN/J1850 communication, and coordinating PWM-driven actuators.

Use Value: Dual CAN interfaces enable seamless bridging between powertrain and body networks; 256KB Flash supports over-the-air update partitioning.

Use Scenario: Protocol translation and message routing between CAN, LIN, and J1850 buses in multi-domain vehicle architectures.

IC Role / Device Role / Timing Role: Network gateway processor handling frame arbitration, filtering, and retransmission with deterministic latency.

Use Value: Two independent CAN modules with separate interrupt channels ensure concurrent high-priority message handling without software contention.

Chassis Domain ControllerAdvanced HVAC Control Unit

Use Scenario: Integration of ABS, ESC, and suspension sensors with actuator drivers in chassis domain ECUs.

IC Role / Device Role / Timing Role: Real-time signal acquisition via dual 10-bit ADCs and precise PWM generation for solenoid valve control.

Use Value: 16-channel ADC with external trigger synchronization enables phase-aligned sampling across multiple wheel speed sensors.

Use Scenario: Climate control system managing blower motors, blend doors, and cabin temperature feedback loops.

IC Role / Device Role / Timing Role: Sensor fusion hub processing thermistor, humidity, and IR sensor inputs while driving 8-channel PWM fan arrays.

Use Value: Eight independent PWM channels with center/left-aligned output and programmable clock select support variable-speed motor control across diverse load profiles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12DT256MPVESame 256KB Flash, 12KB RAM, but adds third CAN module and J1850 BDLC interfaceRequired where SAE J1850 VPW communication (e.g., GM legacy diagnostics) is mandatorySelect MC9S12DT256MPVE only if J1850 support is needed; otherwise MC9S12DG256MPVE offers lower cost and identical core/peripheral feature set
S912XDP512J0Successor HCS12X derivative with 512KB Flash, enhanced CPU (XGATE co-processor), and improved CAN timing resolutionTargeted at next-gen platforms requiring higher code density, deterministic ISR response, or CAN FD readinessChoose S912XDP512J0 for new designs needing scalability; MC9S12DG256MPVE remains optimal for cost-sensitive, CAN 2.0-only legacy replacements

Compared with MC9S12DT256MPVE, MC9S12DG256MPVE omits J1850 but retains identical CAN, ADC, and PWM capabilities-reducing BOM cost where J1850 is unused. Versus S912XDP512J0, it provides proven qualification and simpler toolchain support at lower gate count and power consumption for stable production programs.

Availability

MC9S12DG256MPVE is available at Aetrix Electronics and suitable for automotive body electronics, gateway ECUs, and chassis control systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC9S12DG256MPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in automotive, industrial, and networking microcontrollers and analog solutions.

The MC9S12D-Family was designed specifically for automotive multiplexing applications, emphasizing pin compatibility across memory/peripheral variants to simplify platform scaling and reduce design reuse effort.

FAQ

What is the maximum bus speed supported by the MC9S12DG256MPVE?

The MC9S12DG256MPVE supports a maximum bus speed of 25 MHz in single-chip mode (equivalent to 50 MHz core frequency) and 20 MHz in expanded bus modes. This is achieved via its integrated PLL circuit, which multiplies the external crystal reference (0.5–16 MHz) to generate the required system clock while maintaining stability across −40°C to +125°C.

Does the MC9S12DG256MPVE support J1850 communication?

No, the MC9S12DG256MPVE does not include the J1850 BDLC module. Per the family product brief, only DT-series variants (e.g., MC9S12DT256MPVE) integrate the SAE J1850 Variable Pulse Width interface. The "G" suffix in MC9S12DG256MPVE explicitly denotes the two-CAN, no-J1850 configuration.

How many CAN modules are implemented in the MC9S12DG256MPVE?

The MC9S12DG256MPVE implements exactly two CAN 2.0A/B software-compatible modules: CAN0 and CAN4. These are physically routed to PM0/PM1 and PJ6/PJ7 respectively, with CAN4 sharing pins with the IIC interface and configurable via software register settings.

What ADC resolution and channel count does the MC9S12DG256MPVE provide?

The MC9S12DG256MPVE integrates two 10-bit analog-to-digital converters (ATD0 and ATD1), supporting up to 16 total input channels (8 per module). Both modules support external conversion triggering, allowing synchronized sampling across multiple sensors-a critical capability for automotive chassis and powertrain sensing.

Is the MC9S12DG256MPVE pin-compatible with other MC9S12D-Family members?

Yes, all MC9S12D-Family members-including MC9S12DG256MPVE-are fully pin-compatible within the same package variant (112-pin LQFP or 80-pin QFP). This enables direct hardware reuse across memory and peripheral configurations, such as upgrading from DG256 to DT256 without PCB redesign.

MC9S12DG256MPVE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Active
Programmable:
Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12DG256MPVE FAQ

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Please submit a Request for Quotation (RFQ) for MC9S12DG256MPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12DG256MPVE reliable?

The price and inventory of MC9S12DG256MPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DG256MPVE is usually 5 days.

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Once your MC9S12DG256MPVE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12DG256MPVE?

For technical support, including MC9S12DG256MPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DG256MPVE requirements.

6.How does Aetrix verify that MC9S12DG256MPVE is sourced from the original manufacturer or authorized distributors?

All MC9S12DG256MPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DG256MPVE meets industry standards.

7.What is the process for return or replacement of MC9S12DG256MPVE?

All MC9S12DG256MPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DG256MPVE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12DG256MPVE part is unused and in its original packaging.

Return procedure for MC9S12DG256MPVE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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