NXP Semiconductors MC9S12DG256VPVE
- Part No.:
- MC9S12DG256VPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12DG256VPVE.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 112LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,502
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S12DG256VPVE from Freescale Semiconductor is a 16-bit automotive-grade microcontroller featuring 256KB Flash EEPROM, 12KB RAM, 4KB EEPROM, dual 10-bit ADCs (16-channel total), two CAN 2.0A/B modules, and an enhanced capture timer (ECT). It operates at up to 50 MHz CPU speed (25 MHz bus) in single-chip mode and targets body control modules, lighting systems, and powertrain interface units requiring robust real-time control and CAN networking.
For engineers reviewing the MC9S12DG256VPVE datasheet, MC9S12DG256VPVE pinout, MC9S12DG256VPVE application, or MC9S12DG256VPVE equivalent, this page delivers verified technical context, package-validated pin functions, memory mapping details, CAN timing behavior, and direct alternative options for automotive ECU design continuity.
Technical Context
The MC9S12DG256VPVE implements the HCS12 CPU12 core with M68HC11 instruction set compatibility, 7-stage instruction queue, and enhanced indexed addressing. Its System Integration Module (SIM) manages clock generation via a PLL multiplier, COP watchdog, real-time interrupt, and multiplexed external bus interface supporting both 16-bit wide and 8-bit narrow modes.
Peripheral integration includes two asynchronous SCI interfaces, three SPI modules (SPI0–SPI2), I²C-bus, SAE J1850 BDLC, and a flexible ECT with eight input-capture/output-compare channels, four pulse accumulators, and programmable delay filters. The device supports Wake-Up from STOP/WAIT via 22 dedicated interrupt-capable I/O lines across Ports H, J, P, and IRQ/XIRQ.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | CPU12 - 16-bit architecture with M68HC11 instruction set compatibility and hardware stack management |
| Flash Memory | 256 KB - Configurable as 16 KB fixed + sixteen 16 KB pages; supports in-system programming and protected boot sectors |
| RAM | 12 KB - Mappable to $1000–$3FFF or $0000–$2FFF; overlaps register space at reset |
| EEPROM | 4 KB - Mappable to any 4 KB boundary; initially visible at $0000–$0FFF after reset |
| CAN Modules | 2 × CAN 2.0A/B - Software-compatible, each with 5 receive/3 transmit buffers and independent interrupt channels |
| ADC | 2 × 10-bit, 8-channel - Total 16 analog inputs; supports external trigger and configurable sample-and-hold |
| Operating Voltage | 5 V I/O / 2.5 V core - Internal 5 V to 2.5 V regulator supplies logic; A/D inputs rated for 5 V full-scale |
| Temperature Range | −40 °C to +125 °C - Qualified for under-hood automotive applications per AEC-Q100 requirements |
Pinout & Package
MC9S12DG256VPVE uses a 112-pin LQFP (lead-free, RoHS-compliant) package with 0.4 mm pitch, 20 mm × 20 mm body, and exposed thermal pad. Pin assignments follow the MC9S12D-Family standard layout with multiplexed address/data bus, peripheral-specific port routing, and dedicated debug (BKGD) and reset signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PA0–PA7 | Address/Data Bus (AD0–AD7) | Multiplexed 8-bit data/low-order address lines in expanded mode; general-purpose I/O in single-chip mode |
| PM0/PM1 | CAN0 RX/TX | Dedicated differential CAN transceiver interface for CAN0 module; supports 1 Mbps operation |
| PJ6/PJ7 | CAN4 RX/TX | Second CAN interface routed to these pins; shares functionality with I²C SDA/SCL when CAN4 disabled |
| PP0–PP7 | PWM0–PWM7 / SPI2 | Eight-channel PWM output or SPI2 master/slave interface; software-selectable function per pin |
| PS0–PS7 | SCI0/SCI1 / SPI0 | Serial communication: PS0/PS1 = SCI0 RX/TX; PS2/PS3 = SCI1 RX/TX; PS4–PS7 = SPI0 MOSI/MISO/SCK/SS |
| BKGD | Background Debug | Single-wire BDM interface for non-intrusive debugging, flash programming, and real-time register access |
| RESET | Active-low Reset Input | Asynchronous reset signal with internal pull-up; initiates cold start sequence and clears all registers |
| EXTAL/XTAL | Crystal Oscillator Inputs | Supports 1–16 MHz crystal; internal oscillator circuit provides low-power clock source for STOP mode wake-up |
Key Features
| Feature | Design Value |
|---|---|
| PLL Clock Generation | Configurable frequency multiplier enables dynamic adjustment of bus speed (up to 25 MHz) and power consumption without external clock change |
| Wake-Up Interrupt Sources | 22 dedicated I/O lines (Port H: 8, Port P: 8, Port J: 4, IRQ/XIRQ) allow selective exit from STOP/WAIT modes with sub-10 µs latency |
| Memory Protection | Boot sector protection (2–16 KB) and EEPROM write-protection bits prevent accidental firmware overwrite during field updates |
| Peripheral Routing Flexibility | Software-controlled pin muxing allows CAN0/CAN4 and SPI2 to be reassigned among multiple port groups (e.g., PM, PJ, PH) to optimize PCB layout |
| J1850 BDLC Compliance | Integrated SAE J1850 Variable Pulse Width (10.4 kbps) interface eliminates need for external transceiver in Class II diagnostics |
| Enhanced Capture Timer (ECT) | 16-bit main counter with 7-bit prescaler, 8-channel I/O capability, and 4 successive-capture buffers on select channels for precise edge timing in motor control |
Applications
| Body Control Module (BCM) | LED Lighting Controller |
|---|---|
Use Scenario: Centralized vehicle subsystem managing door locks, window lifts, interior lighting, and mirror controls via LIN/CAN networks. IC Role / Device Role / Timing Role: Primary MCU executing real-time state machines, processing switch inputs, driving relays/LEDs, and communicating over CAN0/CAN4. Use Value: Dual CAN modules enable concurrent communication with powertrain (CAN0) and infotainment (CAN4); 12 KB RAM supports multi-tasking OS and diagnostic log buffering. |
Use Scenario: Adaptive headlamp system regulating LED current, thermal feedback, and beam pattern based on vehicle speed and ambient light. IC Role / Device Role / Timing Role: Real-time PWM generator and ADC supervisor coordinating 8-channel LED drivers with synchronized dimming and fault detection. Use Value: Eight independent PWM channels support phase-shifted dimming; dual 10-bit ADCs monitor temperature sensors and photodiodes with <1 µs conversion time. |
| Powertrain Interface Unit | Diagnostic Communication Controller |
Use Scenario: Gateway between engine control unit (ECU) and chassis systems, translating CAN messages and managing sensor fusion for throttle position and pedal travel. IC Role / Device Role / Timing Role: CAN message router and signal conditioner with ECT-based capture of analog throttle voltage edges and debounce filtering. Use Value: ECT input capture with programmable filters rejects EMI-induced noise on analog inputs; 256 KB Flash stores protocol translation tables and calibration maps. |
Use Scenario: On-board diagnostic (OBD-II) interface supporting SAE J1979 services, trouble code storage, and bidirectional communication with scan tools. IC Role / Device Role / Timing Role: Dedicated J1850 BDLC transceiver and SCI-based UART bridge handling ISO 9141-2 and KWP2000 protocols. Use Value: Integrated J1850 BDLC eliminates external transceiver; 4 KB EEPROM retains DTC history and freeze-frame data across ignition cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12DJ256CPVE | Includes J1850 BDLC module; same Flash/RAM/EEPROM but adds Class II diagnostics capability | Required for OBD-II compliance where J1850 is mandated; not needed if only CAN-based diagnostics used | Select DJ256 when SAE J1850 interface is required; otherwise DG256 reduces BOM cost and simplifies layout |
| S912XDP512J0VLQ | Successor XGATE-enhanced derivative with 512 KB Flash, 32 KB RAM, and dual CAN FD support; pin-compatible in 112LQFP | Enables future-proof CAN FD migration and higher-speed firmware updates; requires updated toolchain and bootloader | Choose XDP512 for new designs targeting CAN FD readiness and extended memory; DG256 remains optimal for legacy CAN-only cost-sensitive programs |
Compared with MC9S12DG256VPVE, MC9S12DJ256CPVE adds J1850 BDLC at no RAM/Flash trade-off, while S912XDP512J0VLQ offers CAN FD, doubled memory, and XGATE co-processor-making it suitable for next-gen gateways but requiring hardware and software revalidation.
Availability
MC9S12DG256VPVE is available at Aetrix Electronics and suitable for automotive body electronics, lighting control, powertrain interface, and diagnostic communication applications requiring stable component supply across extended product lifecycles.
Supply support for MC9S12DG256VPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in automotive microcontrollers, known for high-reliability silicon, comprehensive toolchains, and long-term automotive qualification.
The MC9S12D-Family was designed specifically for cost-sensitive automotive multiplexing applications, emphasizing scalable memory/peripheral configurations, CAN network integration, and robust operation in harsh under-hood environments.
FAQ
What is the maximum bus speed supported by the MC9S12DG256VPVE?
The MC9S12DG256VPVE supports a maximum bus speed of 25 MHz in single-chip mode (equivalent to 50 MHz CPU speed) and 20 MHz in expanded bus modes. This is achieved using the on-chip PLL with programmable multiplication factor and validated across the −40 °C to +125 °C operating range. The MC9S12DG256VPVE's CRG module includes clock monitor and limp-home mode to maintain operation during external clock failure.
Does the MC9S12DG256VPVE include a J1850 interface?
No, the MC9S12DG256VPVE does not include the SAE J1850 BDLC module. According to Table 1 in the family documentation, DG256 variants are designated as "0" for J1850, whereas DJ256 variants explicitly include it. The MC9S12DG256VPVE relies solely on its two CAN 2.0A/B modules and SCI interfaces for vehicle network communication.
How many analog input channels does the MC9S12DG256VPVE support?
The MC9S12DG256VPVE integrates two 10-bit, 8-channel analog-to-digital converters (ATD0 and ATD1), providing a total of 16 analog input channels. In the 112-pin LQFP package, all 16 channels (AN0–AN15) are bonded out and accessible. The MC9S12DG256VPVE supports external conversion triggers and configurable sample-and-hold timing for deterministic acquisition in motor control loops.
What debug interface does the MC9S12DG256VPVE use?
The MC9S12DG256VPVE uses Freescale's single-wire Background Debug Mode (BDM) via the BKGD pin. This interface enables non-intrusive flash programming, real-time register inspection, hardware breakpoints, and memory read/write operations without halting CPU execution. The MC9S12DG256VPVE's BDM implementation complies with the HCS12 specification and is supported by CodeWarrior Development Studio and third-party debug probes.
Is the MC9S12DG256VPVE pin-compatible with other MC9S12D-Family members?
Yes, the MC9S12DG256VPVE is fully pin-compatible with all 112-pin LQFP variants in the MC9S12D-Family, including DP512, DT256, and DJ256. This enables hardware reuse across memory/peripheral configurations. However, peripheral pin functions (e.g., CAN routing, SPI assignment) may differ between variants and require software configuration via SIM registers to match the target device's capabilities.
MC9S12DG256VPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12DG256VPVE FAQ
1.How can I place an order for MC9S12DG256VPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12DG256VPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12DG256VPVE reliable?
The price and inventory of MC9S12DG256VPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DG256VPVE is usually 5 days.
3.What payment methods are accepted for MC9S12DG256VPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12DG256VPVE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12DG256VPVE?
MC9S12DG256VPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12DG256VPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12DG256VPVE?
For technical support, including MC9S12DG256VPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DG256VPVE requirements.
6.How does Aetrix verify that MC9S12DG256VPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12DG256VPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DG256VPVE meets industry standards.
7.What is the process for return or replacement of MC9S12DG256VPVE?
All MC9S12DG256VPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DG256VPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12DG256VPVE part is unused and in its original packaging.
Return procedure for MC9S12DG256VPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S12DG256VPVE Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

