NXP Semiconductors MC9S12DP512CPVE
- Part No.:
- MC9S12DP512CPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12DP512CPVE.pdf
- Description:
- IC MCU 16BIT 512KB FLASH 112LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S12DP512CPVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller with 512 KB on-chip Flash, 32 KB RAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz bus frequency, supports 112-pin LQFP packaging, and delivers real-time control for automotive powertrain and chassis systems requiring deterministic interrupt response and EEPROM emulation.
For engineers reviewing the MC9S12DP512CPVE datasheet, MC9S12DP512CPVE pinout, MC9S12DP512CPVE application, or MC9S12DP512CPVE equivalent, key selection criteria include its 512 KB Flash memory size, dual ATD converters (8+8 channels), 8-channel PWM with center-aligned mode, MSCAN interface compliance, and background debug module (BDM) support for in-circuit development.
Technical Context
The MC9S12DP512CPVE implements the HCS12 CPU12 core with 16-bit data path and 24-bit address space, executing instructions at up to 50 MHz internal clock derived from PLL multiplication of an external crystal (1–8 MHz). Its MEBI interface enables external memory expansion via multiplexed address/data bus with programmable wait states.
System timing is managed by the CRG block, which integrates oscillator startup control, PLL lock detection, and multiple low-power modes (Stop, Wait, Pseudo-Stop). The device includes two independent 10-bit ATD converters with simultaneous sampling capability, eight 16-bit ECT channels supporting input capture/output compare, and a full-duplex SCI/SCI1 serial interface with LIN support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit addressing, 50 MHz max internal clock |
| Flash Memory | 512 KB on-chip Flash with 1024-byte sector erase and row programming |
| RAM Size | 32 KB on-chip RAM, including 4 KB dedicated to EEPROM emulation |
| ADC Resolution | Dual 10-bit ATD converters: ATD0 (8 channels), ATD1 (8 channels), 8 µs conversion time |
| PWM Channels | 8-channel 8-bit PWM module with center-aligned and edge-aligned modes |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0B), 32 message buffers |
| Package | 112-pin LQFP (16 × 16 mm, 0.4 mm pitch), RoHS-compliant |
Pinout & Package
MC9S12DP512CPVE is housed in a 112-pin LQFP package (case number 987), with exposed thermal pad for enhanced heat dissipation in automotive under-hood environments. Pin assignments follow JEDEC MO-220 standard with 0.4 mm lead pitch and 1.6 mm body height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EXTAL / XTAL | Oscillator input/output | Supports Colpitts or Pierce crystal configurations; 1–8 MHz fundamental-mode crystals |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset pulses ≥ 2 µs width |
| BKGD / TAGHI / MODC | Background debug interface | Single-wire BDM communication port; also used for chip configuration during reset |
| PE7 / XCLKS | External clock select | Configures oscillator mode: PE7 = 1 → Colpitts; PE7 = 0 → Pierce or external clock |
| PK7 / ROMCTL | ROM enable control | Enables/disables on-chip ROM access; used for boot vector selection and secure memory mapping |
| PM[7:0] | CAN transceiver I/O | Eight pins dedicated to MSCAN: TXCAN0–TXCAN4, RXCAN0–RXCAN4, plus TXB/RXB for legacy BDLC |
Key Features
| Feature | Design Value |
|---|---|
| On-chip voltage regulator | Integrated VREG provides stable 2.5 V core supply from 5 V rail; enables single-supply operation |
| Security module | Flash security byte prevents unauthorized read-out; unsecuring requires mass erase and resets all registers |
| Low-power modes | Stop mode draws < 10 µA; Wake-up via IRQ, CAN activity, or BDM command within 4 µs |
| EEPROM emulation | 4 KB RAM emulates EEPROM using Flash wear-leveling algorithm; 100K write cycles guaranteed |
| Interrupt handling | 72 interrupt vectors with priority encoding; nested interrupts supported via stack-based context save |
Applications
| Engine Control Unit (ECU) | Anti-lock Braking System (ABS) |
|---|---|
Use Scenario: Real-time fuel injection timing, spark advance calculation, and OBD-II diagnostics in gasoline engines. IC Role / Device Role / Timing Role: Primary engine management MCU coordinating sensor inputs (MAP, TPS, CKP), actuator outputs (injectors, ignition coils), and CAN network messaging. Use Value: Deterministic 25 MHz bus speed ensures sub-100 µs loop execution for closed-loop air-fuel ratio control. | Use Scenario: Wheel speed monitoring, hydraulic valve modulation, and fault logging in vehicle braking systems. IC Role / Device Role / Timing Role: Safety-critical controller managing four-wheel speed acquisition via ATD, PWM-driven solenoid valves, and CAN-based brake status reporting. Use Value: Dual ATD converters allow simultaneous sampling of all four wheel sensors, eliminating phase skew in slip detection algorithms. |
| Body Control Module (BCM) | Transmission Control Unit (TCU) |
Use Scenario: Centralized control of lighting, door locks, window lifts, and climate functions across vehicle domains. IC Role / Device Role / Timing Role: Domain coordinator interfacing with LIN slaves (mirrors, seats) and CAN backbone for gateway functionality. Use Value: Integrated SCI/LIN support enables direct connection to LIN transceivers without external level-shifting components. | Use Scenario: Gear shift scheduling, torque converter clutch control, and adaptive learning in automatic transmissions. IC Role / Device Role / Timing Role: High-reliability controller processing turbine speed, output shaft speed, and pressure sensor data to execute shift logic. Use Value: MSCAN's 32-message buffer supports concurrent transmission of diagnostic, calibration, and real-time telemetry frames without software buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12XDP512MALR | Enhanced XGATE co-processor, 160 KB RAM, 512 KB Flash, 112-pin LQFP | Higher computational throughput for complex signal processing; supports real-time motor control algorithms | Select when offloading time-critical tasks (e.g., PID loops, FFT) from main CPU is required |
| S912XDP512J1MAL | Same core and memory, but qualified to AEC-Q100 Grade 1 (-40°C to +125°C), added EEPROM endurance | Extended temperature range suitable for under-hood placement without heatsinking | Select for high-temperature environments where extended reliability validation is mandated |
Compared with MC9S12DP512CPVE, the XDP512 variant adds hardware acceleration for math-intensive tasks, while the S912XDP512J1MAL provides certified operation at 125°C ambient-both retain identical pinout and peripheral register maps for drop-in migration paths.
Availability
MC9S12DP512CPVE is available at Aetrix Electronics and suitable for automotive ECU design, industrial motion control, and embedded safety-critical systems requiring stable component supply over extended production lifecycles.
Supply support for MC9S12DP512CPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient silicon solutions.
The MC9S12DP512CPVE belongs to the HCS12 family designed specifically for cost-sensitive, high-reliability automotive control applications-including powertrain, chassis, and body electronics-with emphasis on CAN integration and functional safety readiness.
FAQ
What is the maximum operating frequency of the MC9S12DP512CPVE?
The MC9S12DP512CPVE supports a maximum bus clock frequency of 25 MHz, achieved via PLL multiplication of an external crystal (1–8 MHz). Internal core clock reaches up to 50 MHz, enabling instruction execution at 25 MIPS. This frequency is validated across the full industrial temperature range (-40°C to +85°C) and meets AEC-Q100 stress test requirements for automotive use.
Does the MC9S12DP512CPVE include built-in CAN controllers?
Yes, the MC9S12DP512CPVE integrates one MSCAN module compliant with ISO 11898-1 (CAN 2.0B), supporting both standard and extended frame formats. It features 32 message buffers, programmable acceptance filtering, and automatic retransmission. The module connects directly to external CAN transceivers via dedicated PM[7:0] pins, eliminating need for external protocol translation logic.
How does the MC9S12DP512CPVE handle flash memory programming and security?
The MC9S12DP512CPVE uses on-chip Flash with 1024-byte sector erase and 64-word row programming. Security is enforced via a Flash security byte: when set, it disables read access to Flash and register contents via BDM. Unsecuring requires a mass erase sequence initiated through BKGD pin, which clears all Flash and resets all protected registers-ensuring no residual code remains accessible.
Can the MC9S12DP512CPVE operate from a single 5 V supply?
Yes, the MC9S12DP512CPVE supports single 5 V operation using its integrated voltage regulator (VREG). When VREGEN is asserted, the on-chip regulator generates a stable 2.5 V core supply from the 5 V rail. This eliminates need for external DC-DC converters in cost-sensitive designs, while maintaining full performance across temperature and voltage ranges specified in the electrical characteristics table.
What debugging interfaces are supported by the MC9S12DP512CPVE?
The MC9S12DP512CPVE supports single-wire Background Debug Mode (BDM) via the BKGD pin, compatible with standard Freescale/NXP BDM debuggers. It enables full in-circuit debugging-including breakpoint setting, register inspection, and Flash programming-without halting real-time peripheral operation. No JTAG interface is present; BDM is the sole standardized debug channel for this device.
MC9S12DP512CPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12DP512CPVE FAQ
1.How can I place an order for MC9S12DP512CPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12DP512CPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12DP512CPVE reliable?
The price and inventory of MC9S12DP512CPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DP512CPVE is usually 5 days.
3.What payment methods are accepted for MC9S12DP512CPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12DP512CPVE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12DP512CPVE?
MC9S12DP512CPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12DP512CPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12DP512CPVE?
For technical support, including MC9S12DP512CPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DP512CPVE requirements.
6.How does Aetrix verify that MC9S12DP512CPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12DP512CPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DP512CPVE meets industry standards.
7.What is the process for return or replacement of MC9S12DP512CPVE?
All MC9S12DP512CPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DP512CPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12DP512CPVE part is unused and in its original packaging.
Return procedure for MC9S12DP512CPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S12DP512CPVE Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

