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NXP Semiconductors MC9S12DP512CPVE

Part No.:
MC9S12DP512CPVE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-LQFP
Datasheet:
AetrixMC9S12DP512CPVE.pdf
Description:
IC MCU 16BIT 512KB FLASH 112LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,500

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Product details

Overview

MC9S12DP512CPVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller with 512 KB on-chip Flash, 32 KB RAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz bus frequency, supports 112-pin LQFP packaging, and delivers real-time control for automotive powertrain and chassis systems requiring deterministic interrupt response and EEPROM emulation.

For engineers reviewing the MC9S12DP512CPVE datasheet, MC9S12DP512CPVE pinout, MC9S12DP512CPVE application, or MC9S12DP512CPVE equivalent, key selection criteria include its 512 KB Flash memory size, dual ATD converters (8+8 channels), 8-channel PWM with center-aligned mode, MSCAN interface compliance, and background debug module (BDM) support for in-circuit development.

Technical Context

The MC9S12DP512CPVE implements the HCS12 CPU12 core with 16-bit data path and 24-bit address space, executing instructions at up to 50 MHz internal clock derived from PLL multiplication of an external crystal (1–8 MHz). Its MEBI interface enables external memory expansion via multiplexed address/data bus with programmable wait states.

System timing is managed by the CRG block, which integrates oscillator startup control, PLL lock detection, and multiple low-power modes (Stop, Wait, Pseudo-Stop). The device includes two independent 10-bit ATD converters with simultaneous sampling capability, eight 16-bit ECT channels supporting input capture/output compare, and a full-duplex SCI/SCI1 serial interface with LIN support.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHCS12 16-bit CPU with 24-bit addressing, 50 MHz max internal clock
Flash Memory512 KB on-chip Flash with 1024-byte sector erase and row programming
RAM Size32 KB on-chip RAM, including 4 KB dedicated to EEPROM emulation
ADC ResolutionDual 10-bit ATD converters: ATD0 (8 channels), ATD1 (8 channels), 8 µs conversion time
PWM Channels8-channel 8-bit PWM module with center-aligned and edge-aligned modes
CAN InterfaceMSCAN module compliant with ISO 11898-1 (CAN 2.0B), 32 message buffers
Package112-pin LQFP (16 × 16 mm, 0.4 mm pitch), RoHS-compliant

Pinout & Package

MC9S12DP512CPVE is housed in a 112-pin LQFP package (case number 987), with exposed thermal pad for enhanced heat dissipation in automotive under-hood environments. Pin assignments follow JEDEC MO-220 standard with 0.4 mm lead pitch and 1.6 mm body height.

Pin/TerminalCircuit RoleDesign Meaning
EXTAL / XTALOscillator input/outputSupports Colpitts or Pierce crystal configurations; 1–8 MHz fundamental-mode crystals
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external reset pulses ≥ 2 µs width
BKGD / TAGHI / MODCBackground debug interfaceSingle-wire BDM communication port; also used for chip configuration during reset
PE7 / XCLKSExternal clock selectConfigures oscillator mode: PE7 = 1 → Colpitts; PE7 = 0 → Pierce or external clock
PK7 / ROMCTLROM enable controlEnables/disables on-chip ROM access; used for boot vector selection and secure memory mapping
PM[7:0]CAN transceiver I/OEight pins dedicated to MSCAN: TXCAN0–TXCAN4, RXCAN0–RXCAN4, plus TXB/RXB for legacy BDLC

Key Features

FeatureDesign Value
On-chip voltage regulatorIntegrated VREG provides stable 2.5 V core supply from 5 V rail; enables single-supply operation
Security moduleFlash security byte prevents unauthorized read-out; unsecuring requires mass erase and resets all registers
Low-power modesStop mode draws < 10 µA; Wake-up via IRQ, CAN activity, or BDM command within 4 µs
EEPROM emulation4 KB RAM emulates EEPROM using Flash wear-leveling algorithm; 100K write cycles guaranteed
Interrupt handling72 interrupt vectors with priority encoding; nested interrupts supported via stack-based context save

Applications

Engine Control Unit (ECU)Anti-lock Braking System (ABS)

Use Scenario: Real-time fuel injection timing, spark advance calculation, and OBD-II diagnostics in gasoline engines.

IC Role / Device Role / Timing Role: Primary engine management MCU coordinating sensor inputs (MAP, TPS, CKP), actuator outputs (injectors, ignition coils), and CAN network messaging.

Use Value: Deterministic 25 MHz bus speed ensures sub-100 µs loop execution for closed-loop air-fuel ratio control.

Use Scenario: Wheel speed monitoring, hydraulic valve modulation, and fault logging in vehicle braking systems.

IC Role / Device Role / Timing Role: Safety-critical controller managing four-wheel speed acquisition via ATD, PWM-driven solenoid valves, and CAN-based brake status reporting.

Use Value: Dual ATD converters allow simultaneous sampling of all four wheel sensors, eliminating phase skew in slip detection algorithms.

Body Control Module (BCM)Transmission Control Unit (TCU)

Use Scenario: Centralized control of lighting, door locks, window lifts, and climate functions across vehicle domains.

IC Role / Device Role / Timing Role: Domain coordinator interfacing with LIN slaves (mirrors, seats) and CAN backbone for gateway functionality.

Use Value: Integrated SCI/LIN support enables direct connection to LIN transceivers without external level-shifting components.

Use Scenario: Gear shift scheduling, torque converter clutch control, and adaptive learning in automatic transmissions.

IC Role / Device Role / Timing Role: High-reliability controller processing turbine speed, output shaft speed, and pressure sensor data to execute shift logic.

Use Value: MSCAN's 32-message buffer supports concurrent transmission of diagnostic, calibration, and real-time telemetry frames without software buffering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12XDP512MALREnhanced XGATE co-processor, 160 KB RAM, 512 KB Flash, 112-pin LQFPHigher computational throughput for complex signal processing; supports real-time motor control algorithmsSelect when offloading time-critical tasks (e.g., PID loops, FFT) from main CPU is required
S912XDP512J1MALSame core and memory, but qualified to AEC-Q100 Grade 1 (-40°C to +125°C), added EEPROM enduranceExtended temperature range suitable for under-hood placement without heatsinkingSelect for high-temperature environments where extended reliability validation is mandated

Compared with MC9S12DP512CPVE, the XDP512 variant adds hardware acceleration for math-intensive tasks, while the S912XDP512J1MAL provides certified operation at 125°C ambient-both retain identical pinout and peripheral register maps for drop-in migration paths.

Availability

MC9S12DP512CPVE is available at Aetrix Electronics and suitable for automotive ECU design, industrial motion control, and embedded safety-critical systems requiring stable component supply over extended production lifecycles.

Supply support for MC9S12DP512CPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient silicon solutions.

The MC9S12DP512CPVE belongs to the HCS12 family designed specifically for cost-sensitive, high-reliability automotive control applications-including powertrain, chassis, and body electronics-with emphasis on CAN integration and functional safety readiness.

FAQ

What is the maximum operating frequency of the MC9S12DP512CPVE?

The MC9S12DP512CPVE supports a maximum bus clock frequency of 25 MHz, achieved via PLL multiplication of an external crystal (1–8 MHz). Internal core clock reaches up to 50 MHz, enabling instruction execution at 25 MIPS. This frequency is validated across the full industrial temperature range (-40°C to +85°C) and meets AEC-Q100 stress test requirements for automotive use.

Does the MC9S12DP512CPVE include built-in CAN controllers?

Yes, the MC9S12DP512CPVE integrates one MSCAN module compliant with ISO 11898-1 (CAN 2.0B), supporting both standard and extended frame formats. It features 32 message buffers, programmable acceptance filtering, and automatic retransmission. The module connects directly to external CAN transceivers via dedicated PM[7:0] pins, eliminating need for external protocol translation logic.

How does the MC9S12DP512CPVE handle flash memory programming and security?

The MC9S12DP512CPVE uses on-chip Flash with 1024-byte sector erase and 64-word row programming. Security is enforced via a Flash security byte: when set, it disables read access to Flash and register contents via BDM. Unsecuring requires a mass erase sequence initiated through BKGD pin, which clears all Flash and resets all protected registers-ensuring no residual code remains accessible.

Can the MC9S12DP512CPVE operate from a single 5 V supply?

Yes, the MC9S12DP512CPVE supports single 5 V operation using its integrated voltage regulator (VREG). When VREGEN is asserted, the on-chip regulator generates a stable 2.5 V core supply from the 5 V rail. This eliminates need for external DC-DC converters in cost-sensitive designs, while maintaining full performance across temperature and voltage ranges specified in the electrical characteristics table.

What debugging interfaces are supported by the MC9S12DP512CPVE?

The MC9S12DP512CPVE supports single-wire Background Debug Mode (BDM) via the BKGD pin, compatible with standard Freescale/NXP BDM debuggers. It enables full in-circuit debugging-including breakpoint setting, register inspection, and Flash programming-without halting real-time peripheral operation. No JTAG interface is present; BDM is the sole standardized debug channel for this device.

MC9S12DP512CPVE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Active
Programmable:
Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12DP512CPVE FAQ

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Please submit a Request for Quotation (RFQ) for MC9S12DP512CPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of MC9S12DP512CPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DP512CPVE is usually 5 days.

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MC9S12DP512CPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12DP512CPVE?

For technical support, including MC9S12DP512CPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DP512CPVE requirements.

6.How does Aetrix verify that MC9S12DP512CPVE is sourced from the original manufacturer or authorized distributors?

All MC9S12DP512CPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DP512CPVE meets industry standards.

7.What is the process for return or replacement of MC9S12DP512CPVE?

All MC9S12DP512CPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DP512CPVE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12DP512CPVE part is unused and in its original packaging.

Return procedure for MC9S12DP512CPVE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S12DP512CPVE Tags

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