NXP Semiconductors MC9S12DP512MPVE
- Part No.:
- MC9S12DP512MPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12DP512MPVE.pdf
- Description:
- IC MCU 16BIT 512KB FLASH 112LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:559
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Product details
Overview
MC9S12DP512MPVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller with 512 KB on-chip Flash, 32 KB RAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz bus frequency, supports external memory expansion via MEBI, and targets automotive body control modules requiring real-time I/O, PWM, and analog sensing.
For engineers reviewing the MC9S12DP512MPVE datasheet, MC9S12DP512MPVE pinout, MC9S12DP512MPVE application, or MC9S12DP512MPVE equivalent, key selection criteria include its 112-pin LQFP package, dual ATD converters (8+8 channels), 8-channel PWM, 8-channel ECT, and MSCAN compliance with ISO 11898-1.
Technical Context
The MC9S12DP512MPVE implements the HCS12 CPU12 core with 16-bit data path and 24-bit addressing. Its Clock and Reset Generator (CRG) block includes a PLL supporting 2× to 32× multiplication of 4–8 MHz crystal input, enabling stable 25 MHz bus clock operation. The device uses a multiplexed external bus interface (MEBI) for parallel memory expansion with programmable wait states.
It integrates two independent 10-bit ATD converters (ATD0 and ATD1), each with 8 input channels and configurable sample-and-hold timing. The Enhanced Capture Timer (ECT) provides 8 input capture/output compare channels with selectable prescalers and free-running counter modes, while the Pulse Width Modulator (PWM) module delivers 8 independent 8-bit PWM outputs with center-aligned or edge-aligned modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit address space and 16-MB linear memory map |
| Flash Memory | 512 KB on-chip Flash with 1024-byte sector erase and row programming (64 words/row) |
| RAM Size | 32 KB on-chip RAM, including 2 KB dedicated to stack and register banking |
| Bus Frequency | Up to 25 MHz - determines maximum instruction throughput and peripheral timing margins |
| ADC Resolution | 10-bit ATD0 and ATD1 converters, each with 8 analog inputs and configurable conversion time (4–27 µs) |
| CAN Interface | MSCAN module compliant with ISO 11898-1, supporting CAN 2.0B protocol with 16 message buffers |
| PWM Channels | 8 independent 8-bit PWM outputs with programmable period, duty cycle, and polarity control |
Pinout & Package
The MC9S12DP512MPVE is housed in a 112-pin LQFP (Low-Profile Quad Flat Package) with 0.4 mm pitch, measuring 20 mm × 20 mm. This RoHS-compliant package supports surface-mount reflow assembly and provides full access to all internal peripherals via multiplexed I/O ports.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EXTAL / XTAL | Oscillator input/output | Connects to external crystal (4–8 MHz) or ceramic resonator; enables precise clock source for PLL |
| PE7 / XCLKS | External clock select | Configures oscillator mode: PE7 = 1 → Colpitts; PE7 = 0 → Pierce or external clock input |
| PK7 / ROMCTL | ROM control enable | Enables/disables internal ROM mapping; critical for boot-mode configuration and secure flash access |
| PJ6 / RXCAN0 | CAN0 receive input | Differential receiver input for CAN0 channel; requires external transceiver for physical layer compliance |
| PM0 / RXCAN0 | CAN0 receive alternate | Redundant CAN0 RX pin for layout flexibility; shares same logical function as PJ6 |
| VDDA / VSSA | Analog power supply | Dedicated 5 V analog domain for ATD reference and converter operation; must be filtered separately |
Key Features
| Feature | Design Value |
|---|---|
| Background Debug Module (BDM) | Single-wire debug interface enabling non-intrusive program download, breakpoint setting, and register inspection without halting real-time operation |
| Security Lock Mechanism | Flash-based security byte prevents unauthorized readout of code memory; unsecuring requires mass erase and resets all registers |
| Low-Power Modes | STOP, WAIT, and Pseudo-STOP modes reduce current to <10 µA (STOP) while retaining RAM and register contents |
| Interrupt Vector Table | Fixed 128-entry vector table with priority-based nesting; supports up to 64 unique interrupt sources including CAN, ATD, and ECT events |
| MEBI External Bus | Full 16-bit address/data multiplexed bus with programmable wait-state generation for interfacing to SRAM, EPROM, or FPGA logic |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) Subsystem |
|---|---|
Use Scenario: Centralized vehicle lighting, door lock, window lift, and wiper control in mid-tier passenger vehicles. IC Role / Device Role / Timing Role: Main system controller executing real-time state machines, managing CAN network communication, and driving PWM-controlled LED clusters. Use Value: Integrated MSCAN, 8-channel PWM, and dual ATD enable direct sensor interfacing and actuator control without external glue logic. | Use Scenario: Auxiliary engine subsystem monitoring (e.g., throttle position, coolant temperature, fan speed) in Tier-1 supplier modules. IC Role / Device Role / Timing Role: Dedicated subsystem MCU handling analog sensor acquisition, closed-loop fan PWM control, and CAN message forwarding to main ECU. Use Value: 10-bit ATD accuracy (±2 LSB INL) and deterministic 25 MHz bus timing ensure reliable sensor sampling and actuator response within 100 µs deadlines. |
| Industrial Motor Drive Interface | Heavy-Duty Vehicle Telematics Gateway |
Use Scenario: Low-voltage DC motor control in agricultural equipment with position feedback and thermal monitoring. IC Role / Device Role / Timing Role: Real-time motion controller using ECT input capture for quadrature encoder decoding and PWM output for H-bridge gate drive. Use Value: 8-channel ECT with 16-bit free-running counter and programmable prescaler supports 100 kHz encoder input with ±1 count jitter tolerance. | Use Scenario: CAN-to-serial gateway aggregating J1939 and ISO 11898 messages for telematics reporting in commercial trucks. IC Role / Device Role / Timing Role: Protocol translator bridging multiple CAN buses (CAN0/CAN1) to SCI UART interfaces with message filtering and timestamping. Use Value: Dual CAN controllers (MSCAN), 2x SCI modules, and 32 KB RAM allow concurrent buffer management for >500 messages/sec throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12DG256CPVE | 256 KB Flash, 16 KB RAM, identical pinout and peripheral set except reduced Flash/RAM and no MSCAN | Lacks integrated CAN controller; requires external CAN transceiver + SBC for CAN functionality | Select when CAN is not required and cost-sensitive BOM optimization is prioritized over integration |
| S912XDP512J1MALR | NXP S12X derivative with enhanced XGATE coprocessor, 512 KB Flash, 32 KB RAM, and identical MSCAN/ATD/PWM modules | Software-compatible but requires XGATE-aware toolchain; supports higher interrupt throughput via offload engine | Select for new designs needing deterministic sub-µs ISR response or background signal processing without CPU load |
Compared with MC9S12DP512MPVE, the MC9S12DG256CPVE reduces memory and removes CAN, lowering cost but increasing system complexity; the S912XDP512J1MALR retains full compatibility while adding XGATE acceleration for computationally intensive tasks.
Availability
MC9S12DP512MPVE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and heavy-vehicle telematics requiring stable component supply across extended temperature ranges (−40°C to +105°C).
Supply support for MC9S12DP512MPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S12DP512MPVE belongs to the HCS12 family, designed specifically for cost-sensitive, high-reliability automotive control applications where CAN integration, analog sensing, and deterministic real-time performance are essential.
FAQ
What is the maximum operating frequency of the MC9S12DP512MPVE bus clock?
The MC9S12DP512MPVE supports a maximum bus clock frequency of 25 MHz. This is achieved using the on-chip PLL with a 4–8 MHz crystal input and programmable multiplication factor (2× to 32×). The 25 MHz limit ensures timing compliance across all internal peripherals including ATD, ECT, and MSCAN under worst-case voltage and temperature conditions.
Does the MC9S12DP512MPVE include an integrated CAN controller?
Yes, the MC9S12DP512MPVE includes a fully compliant MSCAN module supporting CAN 2.0B protocol per ISO 11898-1. It features 16 message buffers, programmable acceptance filtering, and automatic retransmission. Physical layer interface requires an external CAN transceiver connected to PJ6/PJ7 or PM0/PM1 pins.
How much Flash and RAM does the MC9S12DP512MPVE provide?
The MC9S12DP512MPVE integrates 512 KB of on-chip Flash memory and 32 KB of on-chip RAM. Flash is organized in 1024-byte sectors with row programming capability (64 words per row), while RAM includes 2 KB reserved for stack and register banking to support nested interrupt handling.
What debug interface does the MC9S12DP512MPVE support?
The MC9S12DP512MPVE supports the Background Debug Mode (BDM) interface using the BKGD pin. This single-wire interface enables non-intrusive firmware download, real-time register inspection, and hardware breakpoint setting without requiring dedicated debug pins or halting system operation during active debugging sessions.
Is the MC9S12DP512MPVE qualified for automotive applications?
Yes, the MC9S12DP512MPVE is AEC-Q100 qualified for automotive applications and rated for operation from −40°C to +105°C. Its design includes on-chip voltage regulator (VREG), ESD protection (>2 kV HBM), and latch-up immunity per JESD78, meeting requirements for under-hood and cabin control modules.
MC9S12DP512MPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12DP512MPVE FAQ
1.How can I place an order for MC9S12DP512MPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12DP512MPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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Once your MC9S12DP512MPVE order is processed, you will receive an email with the shipment details and tracking number.
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6.How does Aetrix verify that MC9S12DP512MPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12DP512MPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DP512MPVE meets industry standards.
7.What is the process for return or replacement of MC9S12DP512MPVE?
All MC9S12DP512MPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DP512MPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12DP512MPVE part is unused and in its original packaging.
Return procedure for MC9S12DP512MPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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