My Inquiry
My Account
NXP Semiconductors MC9S12DP512VPVE
- Part No.:
- MC9S12DP512VPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12DP512VPVE.pdf
- Description:
- IC MCU 16BIT 512KB FLASH 112LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,864
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S12DP512VPVE from NXP (originally Freescale) is a 16-bit HCS12 microcontroller featuring 512 KB on-chip Flash, 32 KB RAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz bus frequency with PLL-based clock generation, supports 10-bit ATD converters (16-channel), 8-channel PWM, and 8-channel ECT - deployed in automotive body control modules and industrial motor controllers requiring deterministic real-time response.
For engineers reviewing the MC9S12DP512VPVE datasheet, MC9S12DP512VPVE pinout, MC9S12DP512VPVE application, or MC9S12DP512VPVE equivalent, key selection criteria include its 112-pin LQFP package, dual CAN interface support, background debug capability via BKGD pin, and compatibility with S12X toolchains and CodeWarrior IDE.
Technical Context
The MC9S12DP512VPVE implements the HCS12 CPU12 core with 16-bit data path and 24-bit addressing, executing instructions in single-cycle (most) or two-cycle (indexed) modes. Its CRG block integrates a PLL with programmable multiplication factor (N = 1–32) and selectable oscillator source (crystal, ceramic resonator, or external clock).
Memory architecture includes unified 512 KB Flash organized in 1024-byte sectors, 4 KB EEPROM with byte-write capability, and 32 KB SRAM mapped across multiple banks. Peripheral integration follows the MEBI standard, enabling external memory expansion up to 1 MB using multiplexed address/data bus (PA/PB ports).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit address bus and 16-MB linear address space |
| Max Bus Frequency | 25 MHz - determines instruction throughput and peripheral timing margins |
| Flash Memory | 512 KB on-chip Flash with 1024-byte sector erase and row programming (64 words/row) |
| RAM Size | 32 KB SRAM, including 2 KB reserved for stack and BDM communication |
| ADC Resolution | 10-bit ATD with 16 input channels, ±1 LSB integral nonlinearity, 12 µs conversion time |
| CAN Interfaces | Dual MSCAN modules compliant with ISO 11898-1 (CAN 2.0B active), each supporting 64 message buffers |
| Package Type | 112-pin LQFP (16 × 16 mm, 0.4 mm pitch) - RoHS-compliant, thermally enhanced for automotive ambient |
| Operating Voltage | 4.5 V to 5.5 V supply range; internal voltage regulator supports VDDA/VDDR/VDDPLL rail separation |
Pinout & Package
MC9S12DP512VPVE uses a 112-pin LQFP package (case no. 987) with exposed thermal pad, rated for −40°C to +105°C operation per AEC-Q100 Grade 2. Pin assignments follow standard HCS12 MEBI layout: PA/PB serve as multiplexed address/data bus; PE provides control signals (R/W, LSTRB, XCLKS); PH/PJ/PK/PM/PP/PS implement SPI, SCI, IIC, PWM, CAN, and ATD functions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PE7 / XCLKS | External Clock Select / Bus Clock Output | Selects oscillator mode (PE7=1: Colpitts; PE7=0: Pierce/external clock); outputs derived bus clock |
| BKGD / TAGHI / MODC | Background Debug Interface | Single-wire BDM channel for flash programming, breakpoint insertion, and real-time register inspection |
| RESET | Active-Low Reset Input | Asynchronous reset with internal pull-up; initiates power-on sequence and clears all registers and I/O states |
| VREGEN | Voltage Regulator Enable | Controls internal 5V-to-2.5V regulator for core logic; must be tied high for normal operation |
| XTAL / EXTAL | Ceramic Resonator or Crystal Inputs | Supports 4–8 MHz fundamental-mode crystals; oscillator start-up time ≤ 10 ms after POR |
| PJ6 / RXCAN0, PJ7 / TXCAN0 | CAN0 Transceiver Interface | Differential CAN bus physical layer interface (requires external transceiver like TJA1040) |
| PK7 / ROMCTL | ROM Control Enable | Enables internal ROM boot loader (S12 LRAE) during reset; used for field firmware recovery |
Key Features
| Feature | Design Value |
|---|---|
| Secure Flash Protection | Configurable security byte (FSEC register) prevents unauthorized read/write access to Flash and EEPROM |
| Low-Power Modes | STOP, Pseudo-STOP, and WAIT modes reduce current to <10 µA (STOP) while preserving RAM and register context |
| Enhanced Capture Timer | 8-channel 16-bit ECT with input capture, output compare, and pulse-width modulation capabilities |
| On-Chip Voltage Regulator | Integrated 2.5 V regulator for core logic (VDD1/VDD2), eliminating need for external LDO in most designs |
| Background Debug Module | Single-pin BDM interface enables full debugging without halting real-time operation or requiring JTAG header |
| Flash Programming Support | Row programming (64-word blocks) and sector erase enable in-system firmware updates via BDM or ROM bootloader |
Applications
| Automotive Body Control Unit (BCU) | Industrial Motor Drive Controller |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, lighting, and HVAC in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU managing CAN network communication, analog sensor inputs (temperature, position), and PWM-driven actuators. Use Value: Dual CAN interfaces allow simultaneous communication with powertrain and infotainment networks; 512 KB Flash accommodates complex state-machine logic and diagnostic routines. | Use Scenario: Closed-loop speed/torque control of 3-phase AC induction motors in factory automation systems. IC Role / Device Role / Timing Role: Real-time executor of FOC (Field-Oriented Control) algorithms using ECT timers and ATD sampling. Use Value: 25 MHz bus clock ensures sub-microsecond interrupt latency; 16-channel ATD enables simultaneous sampling of phase currents and DC bus voltage. |
| Commercial Vehicle Telematics Gateway | Off-Highway Equipment Monitor |
Use Scenario: Aggregation and translation of J1939, CAN, and LIN messages for GPS tracking and remote diagnostics. IC Role / Device Role / Timing Role: Protocol gateway with dual CAN controllers, SCI UARTs, and SPI-connected cellular modem. Use Value: Integrated MSCAN modules handle 250 kbps J1939 traffic with hardware message filtering; 32 KB RAM buffers multi-message payloads. | Use Scenario: Monitoring hydraulic pressure, engine RPM, and operator inputs in construction machinery (e.g., excavators, loaders). IC Role / Device Role / Timing Role: Ruggedized system controller interfacing with analog sensors, solenoid drivers, and CAN-based instrument clusters. Use Value: −40°C to +105°C operating range and internal voltage regulator ensure reliability in harsh environments; ROMCTL pin enables fail-safe firmware recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XDP512J0VLH | S12X derivative with enhanced CPU (pipeline, 50 MHz max bus), larger 64 KB RAM, and improved interrupt latency | Higher-performance replacement for new designs requiring faster math operations or larger code footprint | Requires PCB layout changes due to 144-pin LQFP package and different pin mapping |
| MC9S12XEP100MALR | 1 MB Flash, 64 KB RAM, dual CAN, added XGATE coprocessor for offloading communications tasks | Targeted at next-gen telematics and ADAS support where parallel processing reduces main CPU load | Not pin-compatible; requires updated BDM firmware and toolchain migration to S12X architecture |
Compared with S912XDP512J0VLH and MC9S12XEP100MALR, the MC9S12DP512VPVE offers proven automotive qualification, lower BOM cost, and mature toolchain support - making it optimal for cost-sensitive, volume-production BCU and motor control applications where S12X-level performance is unnecessary.
Availability
MC9S12DP512VPVE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor drives, and commercial vehicle telematics requiring stable component supply over extended product lifecycles.
Supply support for MC9S12DP512VPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontroller innovation dating back to Motorola and Freescale.
The MC9S12DP512VPVE belongs to the HCS12 family, designed specifically for cost-effective, high-reliability automotive control applications where deterministic real-time behavior, CAN networking, and long-term supply stability are critical.
FAQ
What is the maximum operating temperature range for the MC9S12DP512VPVE?
The MC9S12DP512VPVE is qualified for operation from −40°C to +105°C, meeting AEC-Q100 Grade 2 requirements for under-hood automotive applications. This rating is validated across all electrical parameters in the device's operating conditions table, including Flash write/erase endurance and ATD accuracy specifications at temperature extremes.
Does the MC9S12DP512VPVE support in-circuit debugging without external hardware?
Yes, the MC9S12DP512VPVE supports single-wire Background Debug Mode (BDM) via the BKGD pin, enabling full in-circuit debugging - including flash programming, register inspection, and breakpoint execution - using only a standard BDM pod (e.g., USB-ML-12). No JTAG header or external debug probe is required.
How many CAN controllers does the MC9S12DP512VPVE integrate, and what protocol versions do they support?
The MC9S12DP512VPVE integrates two independent MSCAN modules, each compliant with ISO 11898-1 and supporting CAN 2.0B active protocol with full 29-bit identifier capability. Both controllers operate concurrently and independently, with dedicated message buffers and hardware acceptance filtering.
Can the MC9S12DP512VPVE execute code directly from Flash while writing to another Flash sector?
Yes, the MC9S12DP512VPVE supports Read-While-Write (RWW) operation: code execution continues from one Flash sector while another sector undergoes erase or programming. This capability is essential for safe over-the-air (OTA) firmware updates without system interruption.
What oscillator configurations are supported by the MC9S12DP512VPVE, and how is mode selected?
The MC9S12DP512VPVE supports Colpitts crystal, Pierce crystal, and external clock input modes. Selection is controlled by the logic level on PE7 (XCLKS): PE7 = 1 enables Colpitts mode; PE7 = 0 enables Pierce or external clock mode. Configuration occurs at reset and is latched internally.
MC9S12DP512VPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12DP512VPVE FAQ
1.How can I place an order for MC9S12DP512VPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12DP512VPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12DP512VPVE reliable?
The price and inventory of MC9S12DP512VPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DP512VPVE is usually 5 days.
3.What payment methods are accepted for MC9S12DP512VPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12DP512VPVE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12DP512VPVE?
MC9S12DP512VPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12DP512VPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12DP512VPVE?
For technical support, including MC9S12DP512VPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DP512VPVE requirements.
6.How does Aetrix verify that MC9S12DP512VPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12DP512VPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DP512VPVE meets industry standards.
7.What is the process for return or replacement of MC9S12DP512VPVE?
All MC9S12DP512VPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DP512VPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12DP512VPVE part is unused and in its original packaging.
Return procedure for MC9S12DP512VPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S12DP512VPVE Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
