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NXP Semiconductors MC9S12DT128MPVE

Part No.:
MC9S12DT128MPVE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-LQFP
Datasheet:
AetrixMC9S12DT128MPVE.pdf
Description:
IC MCU 16BIT 128KB FLASH 112LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:724

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Product details

Overview

MC9S12DT128MPVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller with 128 KB on-chip Flash, 8 KB RAM, and integrated CAN 2.0B controller, designed for automotive body control modules requiring deterministic real-time response, low-power operation, and robust communication. It features a 25 MHz bus clock, 10-bit ATD converter with 16 channels, and 8-channel PWM subsystem.

For engineers reviewing the MC9S12DT128MPVE datasheet, MC9S12DT128MPVE pinout, MC9S12DT128MPVE application, or MC9S12DT128MPVE equivalent, key selection criteria include its 112-pin LQFP package, AEC-Q100 qualification status, background debug interface (BDM), and support for both Colpitts and Pierce oscillator configurations - critical for automotive ECU timing stability and production programming.

Technical Context

The MC9S12DT128MPVE implements the HCS12 CPU core with 16-bit data path, 24-bit address space, and instruction set backward-compatible with HC12. Its Clock and Reset Generator (CRG) supports multiple modes including PLL-enabled high-speed operation (up to 25 MHz bus clock) and low-power stop/wait states with wake-up via interrupt or CAN message.

It integrates dual CAN controllers (MSCAN0 and MSCAN1), an enhanced capture timer (ECT) with input capture/output compare capabilities, and a flexible external bus interface (MEBI) supporting multiplexed or non-multiplexed 8/16-bit memory expansion - enabling scalable system architecture in cost-sensitive automotive applications.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHCS12 16-bit CPU with 24-bit addressing; enables legacy HC12 code migration and deterministic interrupt latency ≤ 7 cycles.
Flash Memory128 KB on-chip Flash with 2-bit backdoor security key; supports in-circuit reprogramming and EEPROM emulation.
RAM Size8 KB on-chip RAM; sufficient for real-time task stacks, CAN message buffers, and ATD result storage without external SRAM.
Bus Clock SpeedUp to 25 MHz; delivers 12.5 MIPS performance at 5V supply, meeting timing requirements for LIN gateway and door module control loops.
ADC Resolution10-bit ATD with 16 input channels and programmable sample-and-hold; supports battery voltage monitoring and sensor signal acquisition with ±1 LSB INL.
CAN InterfacesDual MSCAN modules compliant with ISO 11898-1 (CAN 2.0B); enable concurrent powertrain diagnostics and body network messaging with hardware message filtering.
PWM Channels8-channel 8-bit PWM with center-aligned and edge-aligned modes; suitable for LED dimming, motor speed control, and solenoid drive in HVAC actuators.

Pinout & Package

The MC9S12DT128MPVE is housed in a 112-pin LQFP package (case no. 987), RoHS-compliant and lead-free (PVE suffix), with 0.4 mm pitch and exposed thermal pad for enhanced thermal dissipation in automotive under-hood environments.

Pin/TerminalCircuit RoleDesign Meaning
EXTAL / XTALOscillator input/outputSupports crystal (4–8 MHz) or ceramic resonator; PE7 configures Colpitts vs. Pierce mode - critical for EMI-controlled board layout.
BKGD / TAGHI / MODCBackground Debug pinSingle-wire BDM interface for flash programming and real-time debugging without halting CPU execution.
PJ7 / TXCAN0, PJ6 / RXCAN0CAN0 transceiver I/ODedicated differential CAN bus pins with internal pull-ups; require external CAN transceiver (e.g., TJA1042) for physical layer compliance.
PS3 / TXD1, PS2 / RXD1SCI1 serial interfaceFull-duplex UART supporting LIN 2.2 protocol at up to 115.2 kbps; used for diagnostic communication with vehicle scan tools.
PP0–PP7PWM output channelsEight independent PWM outputs with dead-time insertion capability; directly drive gate drivers for brushless DC motor commutation.
VDDA / VSSAAnalog power domainIsolated analog supply pins reduce noise coupling into ATD reference; mandatory separation from digital VDD for <1 LSB ADC error.

Key Features

FeatureDesign Value
AEC-Q100 Grade 2 qualificationRated for −40°C to +105°C ambient operation - validated for engine bay and passenger compartment ECUs.
On-chip voltage regulator (VREG)Generates internal 2.5 V for core logic from 5 V supply; eliminates need for external LDO and simplifies power tree design.
Security module with backdoor key2-bit flash protection key prevents unauthorized read-out while allowing field firmware updates via secure BDM sequence.
Enhanced Capture Timer (ECT)16-bit free-running counter with 8 input capture/8 output compare channels; enables precise timing of ignition events and wheel speed measurement.
Byteflight interface supportIntegrated BF_PSLM, BF_PERR, BF_PROK pins for safety-critical airbag controller communication per SAE J2990.

Applications

Body Control Module (BCM)Door Module Controller

Use Scenario: Centralized management of lighting, wipers, locks, and mirrors in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing real-time control tasks, coordinating LIN slave nodes, and communicating via CAN with instrument cluster and gateway.

Use Value: 128 KB Flash accommodates multi-feature firmware; dual CAN interfaces isolate body network traffic from powertrain bus, improving fault containment.

Use Scenario: Local control of window lift, mirror adjustment, and anti-pinch detection in automotive door assemblies.

IC Role / Device Role / Timing Role: Dedicated door ECU performing analog sensor sampling (potentiometers, current sense), PWM motor control, and LIN communication.

Use Value: Integrated 10-bit ATD and 8-channel PWM eliminate external components; 8 KB RAM supports real-time position tracking and safety state machine execution.

Heating/Ventilation/Air Conditioning (HVAC)Seat Control Module

Use Scenario: Regulating cabin temperature via blower motor, blend door actuators, and refrigerant pressure monitoring.

IC Role / Device Role / Timing Role: Real-time HVAC controller managing PWM-driven stepper motors, reading thermistor networks, and exchanging climate data over CAN.

Use Value: Dual MSCAN modules allow simultaneous connection to vehicle CAN backbone and local LIN subnetwork for actuator feedback.

Use Scenario: Controlling seat position, lumbar support, and heating elements in premium automotive seating systems.

IC Role / Device Role / Timing Role: Safety-aware seat MCU monitoring switch inputs, driving bidirectional DC motors, and detecting stall conditions via current sensing.

Use Value: AEC-Q100 qualification ensures reliability in long-life applications; on-chip VREG reduces bill-of-materials and improves thermal margin under continuous load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12DG128CPVELacks Byteflight interface and one MSCAN module; identical Flash/RAM, same 112-pin LQFP package.Suitable for non-safety-critical body electronics without airbag integration or dual-CAN redundancy.Select when Byteflight and second CAN channel are unnecessary - lower cost and reduced software validation scope.
S912XDP512J0VLHEnhanced XGATE co-processor, 512 KB Flash, 32 KB RAM; pin-compatible but requires updated BOM and layout review.Targeted at next-generation platforms needing higher compute throughput for predictive diagnostics or OTA update handling.Choose for scalability path - retains software investment via HCS12 compatibility but adds XGATE offload capability.

Compared with MC9S12DG128CPVE, the MC9S12DT128MPVE adds Byteflight and dual CAN for safety-critical domains; versus S912XDP512J0VLH, it offers proven qualification and simpler toolchain support at lower memory capacity - ideal for mature, cost-optimized designs.

Availability

MC9S12DT128MPVE is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, HVAC systems, and seat control units requiring stable component supply across extended product lifecycles.

Supply support for MC9S12DT128MPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontroller innovation through its acquisition of Freescale.

The MC9S12DT128MPVE belongs to the HCS12 family, engineered specifically for cost-sensitive, high-reliability automotive applications where functional safety, long-term supply assurance, and production programming efficiency are paramount.

FAQ

What is the maximum operating temperature range for the MC9S12DT128MPVE?

The MC9S12DT128MPVE is qualified to AEC-Q100 Grade 2 specifications, supporting continuous operation from −40°C to +105°C ambient temperature. This rating is verified per JEDEC JESD22-A108 and applies to the full 112-pin LQFP package variant, making it suitable for under-hood and passenger compartment automotive applications where thermal stress is a key design constraint. The MC9S12DT128MPVE maintains specified Flash endurance and ADC accuracy across this range.

Does the MC9S12DT128MPVE support in-system programming via BDM?

Yes, the MC9S12DT128MPVE supports full in-system programming and real-time debugging via its single-wire Background Debug Mode (BDM) interface on the BKGD pin. This allows flash erasure, programming, and breakpoint-based debugging without removing the device from the target board. The MC9S12DT128MPVE implements the standard HCS12 BDM protocol with sync/acknowledge handshake, compatible with P&E Micro and Segger J-Link BDM adapters.

How many CAN controllers does the MC9S12DT128MPVE integrate, and what protocol versions do they support?

The MC9S12DT128MPVE integrates two fully independent MSCAN controllers (MSCAN0 and MSCAN1), each compliant with ISO 11898-1:2003 and supporting CAN 2.0B active protocol with 29-bit extended identifier capability. Both controllers feature hardware message filtering, transmit/receive FIFOs, and automatic retransmission - enabling concurrent communication on separate CAN buses, such as body network and diagnostic bus, without CPU overhead. The MC9S12DT128MPVE does not support CAN FD.

What oscillator configurations are supported by the MC9S12DT128MPVE?

The MC9S12DT128MPVE supports three oscillator configurations: Colpitts crystal (4–8 MHz), Pierce crystal/resonator, and external CMOS clock input. Configuration is selected via the PE7/XCLKS pin state at reset - high for Colpitts, low for Pierce or external clock. The MC9S12DT128MPVE's CRG block then generates stable bus clocks up to 25 MHz using its PLL, with jitter specifications defined in Figure A-5 of the Device User Guide.

Is the MC9S12DT128MPVE pin-compatible with other HCS12 derivatives like the MC9S12DG128?

Yes, the MC9S12DT128MPVE shares identical pinout and package (112-pin LQFP) with the MC9S12DG128CPVE and MC9S12DJ128CPVE, as confirmed in Figure 2-1 of the Device User Guide. However, functional differences exist - notably the MC9S12DT128MPVE includes Byteflight interface signals (BF_PSLM, BF_PERR, etc.) and a second MSCAN module not present in DG128. PCB layout is interchangeable, but firmware and peripheral initialization must account for these distinctions. The MC9S12DT128MPVE is not pin-compatible with 80-pin QFP variants.

MC9S12DT128MPVE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Active
Programmable:
Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12DT128MPVE FAQ

1.How can I place an order for MC9S12DT128MPVE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12DT128MPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12DT128MPVE reliable?

The price and inventory of MC9S12DT128MPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DT128MPVE is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12DT128MPVE transactions.

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MC9S12DT128MPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12DT128MPVE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12DT128MPVE?

For technical support, including MC9S12DT128MPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DT128MPVE requirements.

6.How does Aetrix verify that MC9S12DT128MPVE is sourced from the original manufacturer or authorized distributors?

All MC9S12DT128MPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DT128MPVE meets industry standards.

7.What is the process for return or replacement of MC9S12DT128MPVE?

All MC9S12DT128MPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DT128MPVE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12DT128MPVE part is unused and in its original packaging.

Return procedure for MC9S12DT128MPVE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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