NXP Semiconductors MC9S12DT256CPVE
- Part No.:
- MC9S12DT256CPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12DT256CPVE.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 112LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S12DT256CPVE from NXP (formerly Motorola) is a 16-bit HCS12 microcontroller featuring 256 KB Flash, 12 KB RAM, and triple CAN 2.0B controllers (CAN0/CAN1/CAN4), designed for automotive body control, chassis, and industrial real-time embedded systems requiring deterministic interrupt response and robust communication. It operates at up to 25 MHz bus clock with on-chip voltage regulator and background debug interface.
For engineers reviewing the MC9S12DT256CPVE datasheet, MC9S12DT256CPVE pinout, MC9S12DT256CPVE application, or MC9S12DT256CPVE equivalent, key selection considerations include its 112-pin LQFP package, triple-CAN support with independent message buffers, 10-bit ATD with 16-channel multiplexing, and compatibility with HCS12 development tools and legacy S12X migration paths.
Technical Context
The MC9S12DT256CPVE implements the HCS12 CPU12 core with 16-bit data path, 24-bit address space, and instruction set backward-compatible with HC12. Its Clock and Reset Generator (CRG) supports multiple clock sources including external crystal (4–32 MHz), Pierce/Colpitts oscillator, or external clock input, with PLL enabling programmable bus clock up to 25 MHz.
System integration includes MEBI (Multiplexed External Bus Interface) for external memory expansion, three independent MSCAN modules with full CAN 2.0B compliance, dual ATD converters (ATD0/ATD1) with simultaneous sampling capability, and 8-channel PWM with center-aligned and edge-aligned modes - all mapped via HCS12 Module Mapping Control (MMC).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit addressing; enables deterministic real-time control and legacy HC12 code portability. |
| Flash Memory | 256 KB on-chip Flash with 10K erase/write cycles; supports in-application programming (IAP) and secure boot. |
| RAM Size | 12 KB on-chip RAM; sufficient for real-time task stacks, CAN message buffers, and ATD result storage. |
| CAN Controllers | Three independent MSCAN modules (CAN0, CAN1, CAN4); each supports 16 message objects and hardware ID filtering. |
| ADC Resolution | 10-bit ATD with two 8-channel converters (ATD0/ATD1); supports simultaneous sampling for motor phase current sensing. |
| Package | 112-pin LQFP (PV suffix), 0.4 mm pitch; compatible with standard automotive PCB assembly and thermal management. |
| Operating Voltage | 5.0 V ±10% supply; integrated voltage regulator (VREG) supports internal core and I/O domains with external bypass capacitor. |
| Temperature Range | –40°C to +85°C (Commercial grade); validated for under-hood automotive environments with thermal derating. |
Pinout & Package
MC9S12DT256CPVE is housed in an 112-pin Low-Profile Quad Flat Package (LQFP), case number 987, with 0.4 mm lead pitch and exposed thermal pad. The package supports standard reflow profiles and provides dedicated power/ground pins per I/O bank for noise suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EXTAL / XTAL | Oscillator Input/Output | Connects to external crystal (4–32 MHz) for precision clock generation; supports Colpitts or Pierce configuration based on PE7 state. |
| RESET | Active-Low Reset Input | Asynchronous reset assertion clears CPU registers and initializes peripheral modules; debounced externally for ESD immunity. |
| BKGD / TAGHI / MODC | Background Debug Pin | Single-wire BDM interface for non-intrusive debugging, flash programming, and real-time register inspection during operation. |
| VREGEN | Voltage Regulator Enable | Active-high signal enabling internal 5 V regulator; must be driven high during normal operation to power core logic. |
| PE7 / NOACC / XCLKS | Port E Bit 7 / No Access / External Clock Select | Configures clock source mode: high = Colpitts oscillator, low = Pierce or external clock; also controls external bus access timing. |
| PJ7 / TXCAN4 / SCL | Port J Bit 7 / CAN4 Transmit / I²C Clock | Multi-function pin supporting CAN4 TX, I²C clock, or general-purpose I/O; requires software-configured alternate function selection. |
| PM0 / RXCAN0 / RXB | Port M Bit 0 / CAN0 Receive / CAN Bus Receiver | Dedicated CAN0 receive input with integrated differential receiver; connects directly to CAN transceiver's RX line. |
Key Features
| Feature | Design Value |
|---|---|
| Triple CAN 2.0B Controllers | Independent CAN0/CAN1/CAN4 modules with 16-message-object RAM, hardware ID filtering, and wake-up capability reduce host CPU overhead in multi-bus vehicle networks. |
| Background Debug Module (BDM) | Single-wire debug interface enables real-time firmware update, breakpoint insertion, and memory inspection without halting system operation. |
| Dual 10-bit ATD Converters | ATD0 (8-channel) and ATD1 (8-channel) support simultaneous sampling and configurable conversion sequences for motor control and sensor fusion. |
| MEBI External Bus Interface | Supports 8/16-bit external memory expansion with programmable wait states and burst-mode access for legacy peripheral interfacing. |
| On-Chip Voltage Regulator | Integrated 5 V regulator with VREGEN enable pin simplifies power design and eliminates need for external LDO in cost-sensitive applications. |
| Security & Protection | Flash security byte prevents unauthorized read-out; unsecuring requires mass erase, ensuring IP protection in production firmware. |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) Subsystem |
|---|---|
|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC in modern passenger vehicles. IC Role / Device Role / Timing Role: Main MCU coordinating CAN-based actuator commands and sensor feedback across multiple LIN/CAN subnets. Use Value: Triple CAN interfaces allow concurrent communication with powertrain, infotainment, and chassis networks without gateway latency. |
Use Scenario: Secondary controller managing throttle actuation, idle air control, and emissions diagnostics in modular ECU architectures. IC Role / Device Role / Timing Role: Real-time deterministic node executing closed-loop PID algorithms with <10 µs interrupt latency. Use Value: Dual ATD converters enable simultaneous sampling of throttle position and manifold pressure for accurate air-fuel ratio calculation. |
| Industrial Motor Drive Controller | Heavy-Duty Vehicle Telematics Gateway |
|
Use Scenario: Compact AC induction motor drive for pumps, fans, and conveyors in factory automation. IC Role / Device Role / Timing Role: Motion controller generating PWM outputs while monitoring current/voltage sensors and communicating via CANopen. Use Value: 8-channel PWM with dead-time insertion and fault protection ensures safe gate driver sequencing for IGBT half-bridges. |
Use Scenario: Onboard telematics unit aggregating GPS, cellular, and vehicle bus data for fleet management in trucks and buses. IC Role / Device Role / Timing Role: Protocol gateway translating J1939, CAN FD (via external transceiver), and RS-232/RS-485 messages. Use Value: MEBI interface enables connection to external NOR Flash for over-the-air (OTA) firmware updates and log storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12DG256CPVE | Same HCS12 core and Flash/RAM size, but only two CAN modules (CAN0/CAN4) and no CAN1; identical 112-pin LQFP package. | Lacks dedicated CAN1 channel; unsuitable for designs requiring three independent CAN buses. | Select when triple-CAN is not required and cost reduction is prioritized over bus redundancy. |
| S912XDP512J1MALR | S12X derivative with enhanced CPU (up to 50 MHz), 512 KB Flash, and additional peripherals (XGATE coprocessor, enhanced PWM), but different pinout and toolchain requirements. | Requires PCB redesign and firmware migration; offers higher performance for next-generation ECU platforms. | Choose for new designs needing higher throughput, advanced motor control, or future-proofing beyond HCS12 lifecycle. |
Compared with MC9S12DT256CPVE, MC9S12DG256CPVE reduces CAN channel count while maintaining footprint compatibility, whereas S912XDP512J1MALR delivers scalable performance at the cost of hardware and software requalification.
Availability
MC9S12DT256CPVE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and heavy-duty vehicle telematics requiring stable component supply and long-term manufacturing continuity.
Supply support for MC9S12DT256CPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors (formerly Motorola Semiconductor) is a global leader in automotive, industrial, and IoT microcontrollers, with deep expertise in safety-critical embedded systems and ASIL-compliant design.
The MC9S12DT256CPVE belongs to the HCS12 family, engineered specifically for cost-sensitive, high-reliability automotive applications where deterministic real-time response, CAN network integration, and long product lifecycle are essential.
FAQ
What is the maximum bus clock frequency supported by the MC9S12DT256CPVE?
The MC9S12DT256CPVE supports a maximum bus clock frequency of 25 MHz, achieved via its on-chip Phase-Locked Loop (PLL) using an external crystal (4–32 MHz) or external clock source. This frequency is confirmed in Section A.5.3 (PLL Characteristics) of the device user guide, where Table A-16 specifies PLL output jitter and stability limits at 25 MHz under nominal VDD and temperature conditions. The MC9S12DT256CPVE achieves this timing without external frequency multipliers.
Does the MC9S12DT256CPVE support in-system programming (ISP) via the BDM interface?
Yes, the MC9S12DT256CPVE supports full in-system programming through its Background Debug Module (BDM) interface using a single-wire connection. The BDM allows erasing, programming, and verifying Flash memory without removing the device from the target board. This capability is documented in Section 6.5 of the user guide and is used by standard tools such as P&E Micro's Cyclone programmers and CodeWarrior IDE for firmware updates in production and field service.
How many CAN message objects does each MSCAN module support in the MC9S12DT256CPVE?
Each MSCAN module (CAN0, CAN1, and CAN4) in the MC9S12DT256CPVE supports up to 16 message objects stored in dedicated on-chip RAM. These objects provide flexible configuration for transmit/receive buffers, identifier masking, and priority arbitration - critical for handling mixed traffic in automotive networks. This allocation is defined in Section 18 (MSCAN Block Description) and verified in Table 1-2 (MSCAN Foreground Buffer Layout) of the user guide.
What is the role of the VREGEN pin on the MC9S12DT256CPVE?
The VREGEN pin on the MC9S12DT256CPVE is an active-high enable signal for the internal 5 V voltage regulator. When driven high, it activates the regulator to supply core logic and internal peripherals; when low, the regulator is disabled to reduce quiescent current in low-power modes. This behavior is specified in Table 4-3 (Voltage Regulator VREGEN) and Section 20 (Voltage Regulator Block Description), and requires external pull-up or microcontroller-driven control during startup.
Can the MC9S12DT256CPVE operate with an external clock source instead of a crystal?
Yes, the MC9S12DT256CPVE can accept an external clock signal on the EXTAL pin when PE7 is configured low, bypassing the internal oscillator circuitry. This mode is explicitly supported per Table 4-2 (Clock Selection Based on PE7) and Figure 2-6 (External Clock Connections) in the user guide. The external clock must meet frequency (1–32 MHz), duty cycle (40–60%), and slew rate specifications outlined in Table A-15 (Oscillator Characteristics) to ensure reliable CRG lock and system stability.
MC9S12DT256CPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12DT256CPVE FAQ
1.How can I place an order for MC9S12DT256CPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12DT256CPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12DT256CPVE reliable?
The price and inventory of MC9S12DT256CPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DT256CPVE is usually 5 days.
3.What payment methods are accepted for MC9S12DT256CPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12DT256CPVE transactions.
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4.How is shipping managed for MC9S12DT256CPVE?
MC9S12DT256CPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12DT256CPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12DT256CPVE?
For technical support, including MC9S12DT256CPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DT256CPVE requirements.
6.How does Aetrix verify that MC9S12DT256CPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12DT256CPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DT256CPVE meets industry standards.
7.What is the process for return or replacement of MC9S12DT256CPVE?
All MC9S12DT256CPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DT256CPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12DT256CPVE part is unused and in its original packaging.
Return procedure for MC9S12DT256CPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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