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NXP Semiconductors MC9S12DT256MPVE
- Part No.:
- MC9S12DT256MPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12DT256MPVE.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 112LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,938
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Product details
Overview
MC9S12DT256MPVE from NXP (formerly Motorola) is a 16-bit HCS12 microcontroller with 256 KB on-chip Flash, 12 KB RAM, and integrated triple CAN 2.0B controllers (CAN0/CAN1/CAN4), designed for automotive body control, powertrain communication gateways, and industrial real-time embedded systems requiring deterministic timing and robust fault-tolerant networking.
For engineers reviewing the MC9S12DT256MPVE datasheet, MC9S12DT256MPVE pinout, MC9S12DT256MPVE application, or MC9S12DT256MPVE equivalent, key selection factors include its 112-pin LQFP package, 80 MHz bus clock capability via PLL, 16-channel 10-bit ATD converter, background debug interface (BDM), and support for external memory expansion via multiplexed 16-bit bus interface.
Technical Context
The MC9S12DT256MPVE implements the HCS12 CPU12 core with 16-bit data path and 24-bit addressing, supporting both single-cycle and multi-cycle instructions. Its Clock and Reset Generator (CRG) block integrates a crystal oscillator, PLL with programmable multiplication factor (1–32×), and multiple low-power modes including Stop, Pseudo-Stop, and Wait.
The device features three independent MSCAN modules compliant with ISO 11898-1, each with 16 message buffers, programmable acceptance filtering, and automatic retransmission. It also includes dual SPI interfaces, two SCI UARTs, J1850 BDLC support (via CAN4), 8-channel PWM, and 16-bit Enhanced Capture Timer (ECT) with input capture/output compare functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit address space and 16 MB linear memory map |
| Flash Memory | 256 KB on-chip Flash with 100K program/erase cycles and 15-year data retention at 85°C |
| RAM | 12 KB on-chip RAM (8 KB general-purpose + 4 KB register-mapped I/O) |
| CAN Interfaces | Three independent CAN 2.0B controllers (CAN0, CAN1, CAN4) with full protocol handling and wake-up capability |
| ADC | Two 10-bit ATD converters: ATD0 (8 channels) and ATD1 (8 channels), 7 µs conversion time, ±2 LSB integral nonlinearity |
| Bus Clock | Up to 50 MHz (with 8 MHz crystal × 6.25 PLL multiplier) or 80 MHz (with 10 MHz crystal × 8) |
| Package | 112-pin LQFP (16 × 16 mm, 0.4 mm pitch), RoHS-compliant, lead-free |
Pinout & Package
MC9S12DT256MPVE is housed in an 112-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, optimized for automotive-grade thermal dissipation and EMI control in engine bay and chassis applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EXTAL / XTAL | Oscillator input/output | Connects to external crystal (4–10 MHz) or ceramic resonator; enables precise clock source for CRG block |
| RESET | Active-low reset input | Asynchronous hardware reset with internal pull-up; initiates cold start sequence and register initialization |
| BKGD / TAGHI / MODC | Background debug interface | Single-wire BDM channel for in-circuit debugging, flash programming, and real-time trace without halting CPU |
| PE7 / NOACC / XCLKS | Mode select / clock output | Selects oscillator mode (Colpitts/Pierce/external); outputs system clock (XCLKS) for synchronization of external peripherals |
| PH[7:0] / PJ[7:0] | CAN physical layer I/O | Dedicated pins for CAN0 (PH), CAN1 (PJ), and CAN4 (PM/PJ) transceiver interfacing with differential signaling |
Key Features
| Feature | Design Value |
|---|---|
| Triple CAN 2.0B Controllers | Enables distributed vehicle networks with redundant messaging paths and gateway routing between CAN domains |
| On-Chip Voltage Regulator (VREG) | Generates stable 5 V internal supply from 5–18 V battery input; eliminates need for external LDO in 12 V automotive systems |
| Security Module | Prevents unauthorized access to Flash contents via secure lock/unlock sequence; protects firmware IP in production ECUs |
| Multiplexed External Bus Interface (MEBI) | Supports 16-bit data/16-bit address expansion up to 1 MB external RAM/Flash, enabling boot-from-external-memory configurations |
| Low-Power Stop Mode | Reduces current draw to <10 µA while retaining RAM content and enabling CAN wake-up events - critical for always-on vehicle modules |
Applications
| Body Control Module (BCM) | Powertrain Gateway |
|---|---|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC in modern vehicles. IC Role / Device Role / Timing Role: Main MCU executing real-time control tasks, managing LIN subnets, and bridging CAN messages between comfort and chassis domains. Use Value: Triple CAN enables concurrent communication with instrument cluster, infotainment, and sensor nodes while maintaining deterministic latency under 100 µs. | Use Scenario: Translation and arbitration between engine, transmission, and chassis CAN buses in hybrid powertrains. IC Role / Device Role / Timing Role: Protocol-aware gateway with message filtering, prioritization, and store-and-forward buffering across isolated CAN networks. Use Value: Independent CAN0/CAN1/CAN4 modules allow simultaneous high-speed (500 kbps) and fault-tolerant (125 kbps) operation without software arbitration overhead. |
| Industrial Motor Controller | Commercial Vehicle Telematics Unit |
Use Scenario: Closed-loop motor drive with analog feedback, PWM output, and safety monitoring in factory automation. IC Role / Device Role / Timing Role: Real-time controller executing PID loops at 1 kHz, sampling ATD inputs, generating synchronized PWM waveforms, and reporting faults over CAN. Use Value: Integrated 16-bit ECT timer provides precise edge-aligned PWM with dead-time insertion and emergency shutdown triggers. | Use Scenario: Fleet management node collecting GPS, engine diagnostics, and driver behavior data for cloud upload. IC Role / Device Role / Timing Role: Data concentrator aggregating J1850 BDLC (via CAN4), OBD-II CAN, and serial sensor streams before cellular transmission. Use Value: Native J1850 BDLC support eliminates external protocol translator IC, reducing BOM cost and board area by 30%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12DG256MPVE | Same HCS12 core and memory size but only dual CAN (CAN0/CAN4), no CAN1; lacks J1850 BDLC support | Suitable for simpler body networks without redundant CAN paths or legacy J1850 diagnostics | Select when CAN1 redundancy and J1850 compatibility are not required - lower cost and identical footprint |
| S912XDP512J1MAL | Enhanced S12X core with 512 KB Flash, 32 KB RAM, and same triple CAN; supports higher bus clock (100 MHz) | Required for future-proof designs needing larger code space, faster execution, or extended peripheral sets (e.g., enhanced PWM, ADC resolution) | Choose for new designs targeting longer product lifecycle and scalability beyond 256 KB Flash constraints |
Compared with MC9S12DG256MPVE and S912XDP512J1MAL, the MC9S12DT256MPVE uniquely balances legacy automotive qualification, triple-CAN determinism, and J1850 BDLC integration - making it optimal for cost-sensitive, field-proven ECU upgrades where backward compatibility and minimal layout change are mandatory.
Availability
MC9S12DT256MPVE is available at Aetrix Electronics and suitable for automotive body electronics, powertrain gateways, and industrial motor control applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified silicon.
Supply support for MC9S12DT256MPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in automotive microcontrollers dating back to Motorola's HCS12 family.
The MC9S12DT256MPVE belongs to the HCS12D family, engineered specifically for automotive electronic control units requiring functional safety awareness, CAN network resilience, and robust operation across extended temperature ranges (-40°C to +105°C).
FAQ
What is the maximum bus clock frequency supported by the MC9S12DT256MPVE?
The MC9S12DT256MPVE supports a maximum bus clock frequency of 50 MHz when using an 8 MHz crystal with a PLL multiplication factor of 6.25, or 80 MHz with a 10 MHz crystal and ×8 multiplication. This is confirmed in Section A.5.3 (PLL Characteristics) of the Device User Guide V03.07, Table A-16, which specifies fBUS = fOSC × MFD × (1/2) where MFD is the PLL divider value. The MC9S12DT256MPVE achieves this without requiring external clock sources.
Does the MC9S12DT256MPVE support J1850 BDLC communication?
Yes, the MC9S12DT256MPVE supports J1850 BDLC (Byte Data Link Communication) through its CAN4 module operating in BDLC mode, as documented in Section 13 of the Device User Guide and Table 0-1 (Derivative Differences). This allows direct connection to legacy vehicle diagnostic tools without external protocol translators, distinguishing it from MC9S12DG256MPVE which lacks this feature.
What are the key differences between MC9S12DT256MPVE and MC9S12DG256MPVE?
The MC9S12DT256MPVE includes CAN1 and J1850 BDLC support via CAN4, while MC9S12DG256MPVE omits CAN1 and BDLC capability. Both share identical Flash/RAM size, 112-pin LQFP packaging, and temperature range (−40°C to +105°C), but only the MC9S12DT256MPVE enables full triple-CAN routing and legacy diagnostics - critical for gateway applications per Table 0-1 and Section 18 (MSCAN Block Description).
How does the on-chip voltage regulator (VREG) function in the MC9S12DT256MPVE?
The MC9S12DT256MPVE integrates an on-chip voltage regulator (VREG) that converts raw battery voltage (5–18 V) into a stable 5 V internal supply for core logic and I/O drivers. Enabled via the VREGEN pin (Section 2.3.4), it eliminates external regulators in 12 V automotive systems. Electrical specs in Appendix A.4 confirm ±2% regulation accuracy and 100 mA output capability under full load conditions.
Is the MC9S12DT256MPVE pin-compatible with other HCS12 derivatives in the same package?
Yes, the MC9S12DT256MPVE is pin-compatible with other 112-pin LQFP HCS12 derivatives including MC9S12DG256MPVE and MC9S12DJ256MPVE, as verified in Figure 2-1 (Pin Assignments in 112-pin LQFP) and Table 0-1. All share identical power, ground, oscillator, reset, and BDM pin locations; peripheral-specific pins (e.g., CAN, SPI, SCI) occupy consistent port groupings, enabling drop-in replacement within the same mask set (L91N/L01Y).
MC9S12DT256MPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12DT256MPVE FAQ
1.How can I place an order for MC9S12DT256MPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12DT256MPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12DT256MPVE reliable?
The price and inventory of MC9S12DT256MPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DT256MPVE is usually 5 days.
3.What payment methods are accepted for MC9S12DT256MPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12DT256MPVE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12DT256MPVE?
MC9S12DT256MPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12DT256MPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12DT256MPVE?
For technical support, including MC9S12DT256MPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DT256MPVE requirements.
6.How does Aetrix verify that MC9S12DT256MPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12DT256MPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DT256MPVE meets industry standards.
7.What is the process for return or replacement of MC9S12DT256MPVE?
All MC9S12DT256MPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DT256MPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12DT256MPVE part is unused and in its original packaging.
Return procedure for MC9S12DT256MPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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