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NXP Semiconductors MC9S12DT256VPVE
- Part No.:
- MC9S12DT256VPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12DT256VPVE.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 112LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,637
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Product details
Overview
MC9S12DT256VPVE from NXP (formerly Motorola) is a 16-bit HCS12 microcontroller featuring 256 KB Flash, 12 KB RAM, and integrated triple CAN 2.0B controllers (CAN0/CAN1/CAN4), designed for automotive body control, chassis electronics, and industrial real-time embedded systems requiring deterministic timing and robust communication.
For engineers reviewing the MC9S12DT256VPVE datasheet, MC9S12DT256VPVE pinout, MC9S12DT256VPVE application, or MC9S12DT256VPVE equivalent, key selection criteria include its 112-pin LQFP package, 25 MHz bus clock capability, on-chip voltage regulator with VREGEN control, background debug interface (BKGD), and support for external memory expansion via multiplexed 16-bit address/data bus.
Technical Context
The MC9S12DT256VPVE implements the HCS12 CPU12 core with 16-bit ALU, 24-bit addressing, and instruction set backward compatibility with HC12. Its Clock and Reset Generator (CRG) supports multiple clock sources - crystal (EXTAL/XTAL), external clock, or PLL-derived bus clocks up to 25 MHz - with configurable startup sequences and oscillator failure detection.
System-level integration includes three independent MSCAN modules supporting full CAN 2.0B protocol, dual ATD converters (ATD0/ATD1) with 10-bit resolution and 16-channel analog input multiplexing, and an Enhanced Capture Timer (ECT) with 8 PWM channels and input capture capabilities for motor control and sensor interfacing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit address space and HC12 instruction set compatibility |
| Flash Memory | 256 KB on-chip Flash with 100K program/erase cycles and 10-year data retention at 85°C |
| RAM | 12 KB on-chip RAM, including 4 KB general-purpose and 8 KB dedicated to stack and peripheral buffers |
| Bus Clock Speed | Up to 25 MHz - enables real-time response in automotive control loops with sub-µs interrupt latency |
| CAN Interfaces | Three independent MSCAN modules (CAN0, CAN1, CAN4) compliant with ISO 11898-1, supporting 1 Mbit/s operation |
| Analog Inputs | Dual 10-bit ATD converters: ATD0 (8-channel) and ATD1 (8-channel), with simultaneous sampling and hardware trigger support |
| Package | 112-pin LQFP (PV code), 20 × 20 mm body, 0.65 mm pitch - compatible with standard SMT reflow profiles |
Pinout & Package
MC9S12DT256VPVE is housed in a 112-pin Low-Profile Quad Flat Package (LQFP), designated PV in NXP's packaging nomenclature. This thermally enhanced package supports industrial and automotive temperature ranges (–40°C to +105°C) and provides dedicated power domains for core, I/O, analog, and PLL circuitry.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EXTAL / XTAL | Oscillator Input / Output | Connects to external crystal (4–32 MHz) or ceramic resonator for primary clock source; supports Colpitts or Pierce configurations |
| RESET | Active-Low Asynchronous Reset | Hardware reset input with internal pull-up; initiates cold start sequence and clears all registers and peripherals |
| BKGD / TAGHI / MODC | Background Debug Interface Pin | Single-wire BDM interface for non-intrusive debugging, flash programming, and real-time register inspection |
| VREGEN | Voltage Regulator Enable | Active-high control signal enabling internal 5V regulator; required for operation when using internal VDDX supply |
| PE7 / NOACC / XCLKS | Port E Bit 7 / No Access Control / External Clock Select | Configures clock source mode: PE7=1 enables crystal oscillator; PE7=0 selects external clock or bypass mode |
| PA[7:0] / ADDR[15:8] / DATA[15:8] | Multiplexed Address/Data Bus (Upper) | Shares pins between 8-bit port I/O, upper byte of 16-bit address, and upper byte of 16-bit data during external memory access |
| PB[7:0] / ADDR[7:0] / DATA[7:0] | Multiplexed Address/Data Bus (Lower) | Shares pins between 8-bit port I/O, lower byte of 16-bit address, and lower byte of 16-bit data - enables 64 KB external memory mapping |
Key Features
| Feature | Design Value |
|---|---|
| Triple CAN 2.0B Controllers | Independent CAN0, CAN1, CAN4 modules with full message buffering, error handling, and wake-up capability - eliminates need for external CAN transceivers in multi-bus architectures |
| On-Chip Voltage Regulation | Integrated 5V regulator with VREGEN enable pin and external capacitor support (10 µF recommended) - reduces external component count and improves power integrity |
| Background Debug Module (BDM) | Single-pin, non-intrusive debug interface supporting flash erase/program, breakpoint insertion, and live register/memory inspection without halting real-time operation |
| Dual 10-Bit ATD Converters | ATD0 (8-channel) and ATD1 (8-channel) with programmable sample-and-hold, conversion triggers (software/timer/PWM), and cross-triggering - enables synchronized sensor acquisition |
| Enhanced Capture Timer (ECT) | 8-channel PWM generator with center-aligned and edge-aligned modes, plus input capture for encoder position sensing and pulse-width measurement |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) Subsystem |
|---|---|
Use Scenario: Centralized management of lighting, door locks, window lifts, and climate actuators in modern vehicles. IC Role / Device Role / Timing Role: Main controller executing real-time state machines, coordinating CAN messages across LIN gateways and local sensors. Use Value: Triple CAN interfaces allow concurrent communication with powertrain, infotainment, and chassis networks without external arbitration logic. |
Use Scenario: Secondary control node monitoring throttle position, coolant temperature, and intake air pressure for closed-loop feedback. IC Role / Device Role / Timing Role: Sensor fusion processor with deterministic ATD sampling and PWM-driven actuator output for idle air control valve. Use Value: Dual ATD converters enable simultaneous sampling of critical engine parameters with <1 µs inter-channel skew, improving combustion efficiency modeling. |
| Industrial Motor Drive Controller | Heavy-Duty Vehicle Telematics Gateway |
Use Scenario: Compact servo drive managing BLDC motor commutation, current sensing, and thermal protection in factory automation equipment. IC Role / Device Role / Timing Role: Real-time motion controller using ECT PWM outputs and ATD-based current feedback with hardware dead-time insertion. Use Value: 25 MHz bus clock and low-latency interrupt response (<2 µs) ensure precise 20 kHz PWM switching and fast overcurrent shutdown. |
Use Scenario: In-vehicle gateway aggregating J1939, CAN FD (via external transceiver), and cellular modem data for fleet diagnostics and remote firmware updates. IC Role / Device Role / Timing Role: Protocol translator and message router with CAN message filtering, store-and-forward buffering, and secure boot verification. Use Value: On-chip 256 KB Flash accommodates dual-application image storage and A/B firmware update partitioning without external memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12DG256CPVE | Same HCS12 core and 256 KB Flash, but only two CAN modules (CAN0/CAN4); no CAN1; identical 112-pin LQFP package and pinout | Lacks dedicated CAN1 channel - unsuitable for designs requiring three isolated CAN buses (e.g., separate powertrain/chassis/body domains) | Select when triple CAN is not required and cost reduction is prioritized; software migration is minimal due to register-level compatibility |
| S912XDP512J0VLQ | Enhanced XGATE co-processor, 512 KB Flash, 32 KB RAM, same triple CAN and ATD architecture; pin-compatible 112-pin LQFP (but requires updated power sequencing) | Supports higher computational throughput for complex control algorithms and real-time OS tasks; extended temperature range (–40°C to +125°C) | Choose for next-generation designs needing scalability beyond 256 KB Flash or requiring XGATE acceleration for signal processing workloads |
Compared with MC9S12DG256CPVE, the MC9S12DT256VPVE delivers full triple-CAN capability essential for distributed vehicle architectures; versus S912XDP512J0VLQ, it offers proven qualification for legacy automotive platforms with lower BOM cost and simpler power design, though without XGATE acceleration.
Availability
MC9S12DT256VPVE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and heavy-duty vehicle telematics requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S12DT256VPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive microcontrollers dating back to Motorola's HCS12 family.
The MC9S12DT256VPVE belongs to NXP's legacy HCS12 automotive MCU product line, engineered specifically for deterministic real-time control in safety-critical vehicle subsystems where reliability, CAN interoperability, and long-term supply stability are mandatory.
FAQ
What is the maximum bus clock frequency supported by the MC9S12DT256VPVE?
The MC9S12DT256VPVE supports a maximum bus clock frequency of 25 MHz. This is achieved using the on-chip Phase-Locked Loop (PLL) with appropriate external crystal (e.g., 8 MHz) and PLL divider/multiplier settings. The 25 MHz bus clock enables sub-microsecond interrupt response times and high-throughput CAN messaging at 1 Mbit/s across all three CAN channels, making the MC9S12DT256VPVE suitable for time-critical automotive control applications.
Does the MC9S12DT256VPVE include an internal voltage regulator, and how is it enabled?
Yes, the MC9S12DT256VPVE integrates an internal 5V voltage regulator. It is enabled via the VREGEN pin, which must be driven high (typically tied to VDDX through a pull-up resistor) to activate regulation for the I/O drivers. When enabled, the regulator supplies VDDX from VDDR, eliminating the need for an external 5V rail in many designs. The MC9S12DT256VPVE datasheet specifies a 10 µF ceramic capacitor on VDDX for stability, and operation is validated across the full –40°C to +105°C temperature range.
How many CAN controllers does the MC9S12DT256VPVE integrate, and what standards do they support?
The MC9S12DT256VPVE integrates three fully independent MSCAN controllers: CAN0, CAN1, and CAN4. Each complies with the ISO 11898-1 standard for high-speed CAN 2.0B protocol, supporting data rates up to 1 Mbit/s, 29-bit extended identifiers, and hardware message filtering. Unlike derivatives such as MC9S12DG256, the MC9S12DT256VPVE uniquely provides CAN1 - enabling true three-domain network isolation (e.g., powertrain, chassis, body) without external CAN controllers or arbitration logic.
What debug interface does the MC9S12DT256VPVE use, and what capabilities does it provide?
The MC9S12DT256VPVE uses the Background Debug Mode (BDM) interface, accessed via the BKGD / TAGHI / MODC pin. This single-wire interface enables non-intrusive in-circuit debugging, flash programming, real-time register and memory inspection, and breakpoint insertion without halting system operation. The BDM module is fully supported by NXP's CodeWarrior development tools and third-party emulators, allowing full visibility into the MC9S12DT256VPVE's execution state during both development and field validation phases.
Is the MC9S12DT256VPVE pin-compatible with other HCS12 derivatives in the same package?
Yes, the MC9S12DT256VPVE in the 112-pin LQFP (PV) package shares identical mechanical pinout and electrical characteristics with other HCS12 derivatives like MC9S12DG256CPVE and MC9S12DJ256CPVE. However, functional pin mapping differs for certain signals - notably CAN1-related pins (e.g., PM1/PM0) are unused on non-DT variants. Therefore, while PCB layout is reusable, firmware must account for peripheral availability differences; the MC9S12DT256VPVE's full triple-CAN feature set requires explicit hardware routing to all three CAN transceiver interfaces.
MC9S12DT256VPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12DT256VPVE FAQ
1.How can I place an order for MC9S12DT256VPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12DT256VPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12DT256VPVE reliable?
The price and inventory of MC9S12DT256VPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12DT256VPVE is usually 5 days.
3.What payment methods are accepted for MC9S12DT256VPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12DT256VPVE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12DT256VPVE?
MC9S12DT256VPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12DT256VPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12DT256VPVE?
For technical support, including MC9S12DT256VPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12DT256VPVE requirements.
6.How does Aetrix verify that MC9S12DT256VPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12DT256VPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12DT256VPVE meets industry standards.
7.What is the process for return or replacement of MC9S12DT256VPVE?
All MC9S12DT256VPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12DT256VPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12DT256VPVE part is unused and in its original packaging.
Return procedure for MC9S12DT256VPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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