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NXP Semiconductors MC9S12E128CPVE

Part No.:
MC9S12E128CPVE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-LQFP
Datasheet:
AetrixMC9S12E128CPVE.pdf
Description:
IC MCU 16BIT 128KB FLASH 112LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:218

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Product details

Overview

MC9S12E128CPVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller with 128 KB on-chip Flash, 8 KB RAM, and integrated peripherals including 10-bit 16-channel ADC, dual 8-bit DACs, PWM modules with fault protection, I²C, SPI, and three SCI/UART interfaces. It operates at up to 25 MHz core frequency and targets automotive body control, industrial sensor nodes, and embedded motor control systems.

For engineers reviewing the MC9S12E128CPVE datasheet, MC9S12E128CPVE pinout, MC9S12E128CPVE application, or MC9S12E128CPVE equivalent, key selection criteria include its 112-pin LQFP package, PLL-based clock generation with external crystal support, background debug interface (BDM), flash security features, and compatibility with legacy S12 toolchains and CodeWarrior IDE.

Technical Context

The MC9S12E128CPVE implements the HCS12 CPU12 core with 16-bit data path, 24-bit addressing, and instruction set backward-compatible with earlier 68HC12 devices. Its memory subsystem includes 128 KB of single-cycle Flash (with 1K EEPROM emulation), 8 KB RAM, and configurable wait-state logic for external bus access.

Peripherals are tightly integrated via the Module Mapping Control (MMCV4) unit and share a unified register map. Clocking uses a two-stage PLL (CRGV4 + OSCV2) accepting 1–8 MHz crystals to generate stable system clocks up to 50 MHz bus speed, with dedicated voltage regulators (VREG3V3V2) and PLL power domains (VDDPLL/VSSPLL).

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture HCS12 16-bit CPU12 core with 24-bit address space and 16 MB linear memory map
Flash Memory 128 KB on-chip Flash (FTS128K1V1) supporting in-circuit programming and 1K EEPROM emulation
RAM 8 KB on-chip RAM with byte-wide access and no wait states
ADC 10-bit, 16-channel ATD10B16CV2 with 8 µs conversion time and programmable sample-and-hold
DAC Dual 8-bit DAC8B1CV1 outputs (DAO1/DAO2) with independent reference and rail-to-rail output swing
PWM Two independent PWM modules: PMF15B6CV2 (15-bit, 6-channel, fault-protected) and PWM8B6CV1 (8-bit, 6-channel)
Communication Three SCI/UART (SCIV3), one I²C (IICV2), one SPI (SPIV3), and BDM debug interface

Pinout & Package

MC9S12E128CPVE is housed in a 112-pin LQFP (16 × 16 mm, 0.4 mm pitch) package with exposed thermal pad. Power distribution includes separate analog (VDDA/VSSA), digital I/O (VDDX/VSSX), core logic (VDD1/VSS1), PLL (VDDPLL/VSSPLL), and regulator (VDDR/VSSR) supplies to minimize noise coupling.

Pin/Terminal Circuit Role Design Meaning
EXTAL / XTAL Oscillator input/output Accepts 1–8 MHz parallel-resonant crystal; enables precise clock source for PLL lock
XFC PLL loop filter Connects external RC network to stabilize PLL feedback loop and reduce jitter
BKGD / TAGHI / MODC Background debug / mode select Single-pin BDM interface for programming and real-time debugging; configures boot mode
PA[7:0] / ADDR[15:8] / DATA[15:8] Multiplexed port A 8-bit bidirectional I/O with external bus address/data multiplexing capability
PE0 / XIRQ Non-maskable interrupt input Edge-triggered NMI source for critical fault handling (e.g., overcurrent, watchdog timeout)
VRH / VRL ADC reference inputs Accept external 0–5 V reference span; enable ratiometric measurement against sensor supply

Key Features

Feature Design Value
Flash security Configurable flash protection via SEC register; prevents unauthorized read/write/erase of code memory
Low-power modes Four operational modes (Run, Wait, Pseudo Stop, Stop) with sub-1 µA Stop current and fast wake-up from all modes
Integrated voltage regulator VREG3V3V2 provides internal 3.3 V supply for core logic and I/O drivers from 5 V input
PWM fault protection PMF15B6CV2 supports hardware shutdown on FAULT[3:0] inputs with automatic recovery or latch-off behavior
Background Debug Module BDMV4 enables full-speed debugging, flash programming, and register inspection without halting real-time operation

Applications

Automotive Body Control Unit Industrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle platforms.

IC Role / Device Role / Timing Role: Main system controller executing CAN/LIN gateway logic, analog sensor acquisition (potentiometers, thermistors), and PWM-driven actuator drivers.

Use Value: Integrated 10-bit ADC and dual DACs eliminate external signal conditioning ICs; flash security protects OEM firmware IP.

Use Scenario: Battery-powered environmental monitoring node measuring temperature, humidity, and CO₂ using analog sensors and wireless UART telemetry.

IC Role / Device Role / Timing Role: Low-power host MCU managing sensor sampling, data preprocessing, and serial transmission via SCI to LoRa or Bluetooth module.

Use Value: Sub-1 µA Stop mode extends battery life; BDM interface enables field firmware updates without removing PCB.

Embedded Motor Controller Medical Diagnostic Instrument

Use Scenario: Closed-loop DC brush motor control in lab equipment requiring precise speed regulation and overcurrent protection.

IC Role / Device Role / Timing Role: Real-time PWM generator with hardware fault response (via FAULT pins) and ADC feedback for current/voltage sensing.

Use Value: PMF15B6CV2's fault-protected PWM channels enable immediate shutdown on overcurrent events without CPU intervention.

Use Scenario: Portable blood glucose meter requiring analog front-end signal processing, LCD display control, and USB/UART data export.

IC Role / Device Role / Timing Role: Signal acquisition controller interfacing electrochemical sensor, driving 128×64 dot-matrix LCD, and managing user input via keypad matrix.

Use Value: Dual DAC outputs support precision bias voltage generation for sensor excitation; integrated VREG simplifies power design.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S12E64CPVE 64 KB Flash, 4 KB RAM, identical peripheral set and pinout Lower memory footprint suitable for simpler control tasks without complex algorithms or large lookup tables Select when application code size remains under 56 KB and no EEPROM emulation is required
S912ZVL128F0MLFR S12Z core, 128 KB Flash, enhanced CAN FD support, higher ESD rating (±8 kV HBM), 5 V tolerant I/O Designed for modern automotive ECUs requiring CAN FD communication and extended temperature range (−40°C to 125°C) Choose for new designs targeting ASIL-B compliance or requiring CAN FD protocol stack integration

Compared with MC9S12E64CPVE, the MC9S12E128CPVE offers double Flash/RAM for complex state machines and calibration data storage; versus S912ZVL128F0MLFR, it lacks CAN FD but delivers proven reliability in legacy 12 V automotive platforms with lower toolchain migration cost.

Availability

MC9S12E128CPVE is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and embedded motor control applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MC9S12E128CPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontroller innovation.

The HCS12 family-including MC9S12E128CPVE-was designed for cost-sensitive, high-reliability embedded control in automotive body electronics and industrial automation where deterministic real-time performance and flash security are essential.

FAQ

What is the maximum operating frequency of the MC9S12E128CPVE?

The MC9S12E128CPVE supports a maximum bus frequency of 25 MHz, achieved via its internal PLL (CRGV4) which multiplies an external 1–8 MHz crystal input. The core executes instructions at half the bus speed (12.5 MHz), delivering consistent real-time performance for time-critical control loops in automotive and industrial applications. This frequency is fully specified across the −40°C to 105°C temperature range.

Does the MC9S12E128CPVE support in-system programming (ISP)?

Yes, the MC9S12E128CPVE supports full in-system programming via its Background Debug Module (BDMV4) interface using standard BDM protocols. Flash memory can be reprogrammed while soldered on the target board, enabling field firmware updates, calibration data writing, and secure bootloader implementation-all without requiring chip removal or external programmers.

What are the power supply requirements for the MC9S12E128CPVE?

The MC9S12E128CPVE requires a nominal 5 V supply on VDDX/VSSX for I/O drivers and VDD1/VSS1 for core logic. It integrates the VREG3V3V2 regulator to generate an internal 3.3 V supply for the CPU and peripherals. Analog sections use separate VDDA/VSSA rails, and the PLL requires dedicated VDDPLL/VSSPLL connections to ensure low-jitter clock synthesis.

How does the MC9S12E128CPVE handle reset sources?

The MC9S12E128CPVE incorporates multiple reset sources: external RESET pin assertion, power-on reset (POR), low-voltage reset (LVR), clock monitor (CM) failure, COP watchdog timeout, and illegal opcode detection. All resets initialize the CPU, clear registers, and force execution from the reset vector at 0xFFFE–0xFFFF, ensuring deterministic startup behavior in harsh electrical environments.

Is the MC9S12E128CPVE pin-compatible with other HCS12E family members?

Yes, the MC9S12E128CPVE shares identical 112-pin LQFP packaging and pinout with MC9S12E64CPVE and MC9S12E32CPVE. This allows direct hardware reuse across memory variants-designers can scale Flash/RAM capacity without modifying PCB layout or connector assignments, reducing development time and qualification effort for derivative products.

MC9S12E128CPVE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12E128CPVE FAQ

1.How can I place an order for MC9S12E128CPVE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12E128CPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12E128CPVE reliable?

The price and inventory of MC9S12E128CPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12E128CPVE is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12E128CPVE transactions.

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MC9S12E128CPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12E128CPVE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12E128CPVE?

For technical support, including MC9S12E128CPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12E128CPVE requirements.

6.How does Aetrix verify that MC9S12E128CPVE is sourced from the original manufacturer or authorized distributors?

All MC9S12E128CPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12E128CPVE meets industry standards.

7.What is the process for return or replacement of MC9S12E128CPVE?

All MC9S12E128CPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12E128CPVE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12E128CPVE part is unused and in its original packaging.

Return procedure for MC9S12E128CPVE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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