NXP Semiconductors MC9S12E64CFUE
- Part No.:
- MC9S12E64CFUE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-QFP
- Datasheet:
-
MC9S12E64CFUE.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 80QFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,139
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S12E64CFUE from Freescale Semiconductor is a 16-bit HCS12 microcontroller featuring 64 KB on-chip Flash, 4 KB RAM, and integrated peripherals including 10-bit 16-channel ADC, 8-bit DAC, dual SCI, SPI, I²C, PWM, and BDM debug interface. It operates at up to 25 MHz core frequency with internal voltage regulator and supports automotive-grade temperature range (–40°C to +105°C) in a 112-pin LQFP package.
For engineers reviewing the MC9S12E64CFUE datasheet, MC9S12E64CFUE pinout, MC9S12E64CFUE application, or MC9S12E64CFUE equivalent, this page provides verified technical context, validated pin functions, real-world use cases in engine control and body electronics, and confirmed alternative parts for design continuity and supply resilience.
Technical Context
The MC9S12E64CFUE implements the HCS12 CPU12 core with 16-bit data path, 24-bit addressing, and instruction set backward-compatible with HC12. It integrates a PLL-based clock system supporting crystal or external clock input, programmable prescalers, and multiple low-power modes (Stop, Wait, Pseudo-Stop).
Its peripheral suite includes a 10-bit ATD converter with hardware-triggered conversion sequencing, an 8-bit DAC with buffered output, dual full-duplex SCI modules supporting LIN protocol, and a 16-bit timer module with input capture/output compare capabilities - all mapped into a unified memory space with bank-switching support via MMC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit address bus and 16 MB linear address space |
| Flash Memory | 64 KB on-chip Flash with EEPROM emulation and security lock capability |
| RAM | 4 KB on-chip RAM with retention in Stop mode |
| ADC | 10-bit, 16-channel ATD with 8 µs conversion time and configurable sample/hold |
| DAC | 8-bit, single-channel DAC with buffered voltage output and independent reference |
| Communication | Dual SCI (LIN-capable), SPI, I²C, and CAN not supported - no CAN controller present |
| Operating Voltage | 4.5 V to 5.5 V supply; internal 3.3 V regulator powers core logic and I/O drivers |
| Temperature Range | –40°C to +105°C ambient, qualified for automotive under AEC-Q100 Grade 2 |
Pinout & Package
MC9S12E64CFUE is housed in a 112-pin LQFP (16 × 16 mm, 0.4 mm pitch) package with exposed thermal pad. Power distribution includes dedicated analog (VDDA/VSSA), core (VDD1/VSS1), I/O (VDDX/VSSX), PLL (VDDPLL/VSSPLL), and regulator (VDDR/VSSR) supplies.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PA[7:0] | Port A bidirectional I/O / Address[15:8] / Data[15:8] | Multiplexed external bus interface pins usable as general-purpose I/O or 16-bit data/address lines |
| PB[7:0] | Port B bidirectional I/O / Address[7:0] / Data[7:0] | Lower byte of external bus; supports 8-bit or 16-bit memory-mapped peripheral access |
| PE0–PE7 | Port E I/O with IRQ/XIRQ, R/W, ECLK, LSTRB, MODA/B/C | Interrupt inputs, external bus control signals, and mode configuration pins for boot selection |
| PK[7:0] | Port K I/O / XADDR[19:14], ROMCTL, ECS, XCS | Extended address bus support up to 20 bits and chip select generation for external memory |
| PM0–PM7 | Port M I/O / SDA/SCL, TXD2/RXD2, DAO1/DAO2 | I²C interface, second SCI channel, and dual DAC outputs - shared function mapping |
| PS0–PS7 | Port S I/O / SCI0/SCI1, SPI, MISO/MOSI/SCK | Primary serial interface bank supporting simultaneous SCI, SPI, and LIN physical layer |
| VDDA/VSSA | Analog power/ground | Isolated supply domain for ATD and DAC to minimize noise coupling into analog circuits |
| BKGD | Background Debug pin | Single-wire BDM interface for flash programming and real-time debugging without JTAG |
Key Features
| Feature | Design Value |
|---|---|
| On-chip voltage regulator | Internal 3.3 V regulator eliminates need for external LDO, simplifying power tree in automotive ECUs |
| Background Debug Module (BDM) | Single-pin debug interface enables in-circuit flash programming and breakpoint debugging without emulator hardware |
| Hardware ADC sequencing | ATD supports automatic scan of up to 16 channels with trigger synchronization to PWM or timer events |
| Security protection | Flash security byte prevents unauthorized read-out; unsecuring requires full chip erase |
| Low-power modes | Stop mode draws <10 µA; Wake-up via IRQ, XIRQ, or reset - critical for battery-backed systems |
| External bus interface | Full 16-bit multiplexed bus with programmable wait states supports external EPROM, RAM, or ASIC expansion |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
|
Use Scenario: Real-time monitoring of throttle position, coolant temperature, and oxygen sensor signals in gasoline engine management. IC Role / Device Role / Timing Role: Central controller executing fuel injection timing, spark advance, and idle speed control algorithms at 10 ms intervals. Use Value: Integrated 10-bit ATD with hardware-triggered sampling ensures deterministic sensor acquisition synchronized to crankshaft position pulses. |
Use Scenario: Managing door locks, window lifts, lighting dimming, and mirror adjustment in mid-tier passenger vehicles. IC Role / Device Role / Timing Role: Main MCU coordinating LIN slave nodes and driving discrete power FETs via PWM outputs. Use Value: Dual SCI interfaces enable master-slave LIN communication while PS port SPI controls LED driver ICs. |
| Instrument Cluster | Heating/Ventilation Control |
|
Use Scenario: Driving analog gauges and digital LCD segments while processing vehicle speed, RPM, and warning lamp inputs. IC Role / Device Role / Timing Role: Mixed-signal controller converting sensor data to analog outputs (via DAC) and updating display buffers via external bus. Use Value: On-chip 8-bit DAC generates precise 0–5 V gauge drive signals; 112-pin LQFP allows dense layout with minimal routing congestion. |
Use Scenario: Regulating blower motor speed, blend door actuation, and cabin temperature feedback in HVAC subsystems. IC Role / Device Role / Timing Role: Closed-loop controller using ATD inputs from NTC thermistors and PWM outputs to TRIAC or MOSFET drivers. Use Value: Hardware PWM fault protection disables outputs during overcurrent detection - preventing actuator damage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12E128CFUE | 128 KB Flash, 8 KB RAM, identical pinout and peripheral set; higher memory for complex diagnostics or bootloader space | Supports larger firmware images and dual-bank OTA updates - suitable for Tier-1 ECU platforms requiring field reprogramming | Select when future firmware growth or ASAM-compliant calibration support is required; same PCB layout and toolchain |
| S912ZVL64F0MLFR | 16-bit S12Z core, 64 KB Flash, 6 KB RAM, enhanced CAN 2.0B controller, and improved EMI immunity per ISO 11898-2 | Enables direct CAN network integration without external transceiver; meets stricter automotive EMC requirements | Choose for new designs targeting CAN-based architectures or needing upgraded ESD/EMC performance beyond legacy HCS12 spec |
Compared with MC9S12E128CFUE, the MC9S12E64CFUE offers sufficient memory for cost-sensitive body electronics but lacks headroom for advanced diagnostics; versus S912ZVL64F0MLFR, it lacks native CAN and modern safety features, making it appropriate only for LIN-only or legacy replacement programs.
Availability
MC9S12E64CFUE is available at Aetrix Electronics and suitable for engine control units, body control modules, instrument clusters, and HVAC controllers requiring stable component supply across extended product lifecycles.
Supply support for MC9S12E64CFUE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) pioneered automotive microcontrollers with robust qualification, long-term supply commitment, and broad ecosystem support.
The HCS12 family, including MC9S12E64CFUE, was designed specifically for cost-effective, high-reliability automotive body and powertrain applications requiring deterministic real-time response and extended temperature operation.
FAQ
What is the maximum operating frequency of the MC9S12E64CFUE?
The MC9S12E64CFUE supports a maximum core frequency of 25 MHz, achieved using its internal PLL with external crystal (typically 4 MHz or 8 MHz) or oscillator input. The PLL multiplies the input clock and divides the resulting frequency to generate the core clock, bus clock, and peripheral clocks - all configurable via register settings in the CRG module.
Does the MC9S12E64CFUE include a CAN controller?
No, the MC9S12E64CFUE does not include an on-chip CAN controller. Its communication peripherals consist of two SCI modules (supporting LIN), one SPI, and one I²C interface. CAN functionality requires an external transceiver and software protocol stack - unlike later S12X or S12Z derivatives which integrate native CAN modules.
How is flash memory secured on the MC9S12E64CFUE?
Flash security on the MC9S12E64CFUE is controlled by a dedicated security byte located in the last Flash block. When programmed to 0x00, the device enters secured mode, disabling background debug access and preventing Flash read-out. Unsecuring requires a mass erase command issued via BDM, which clears all Flash and EEPROM contents - no partial unlock is possible.
What power supply domains does the MC9S12E64CFUE require?
The MC9S12E64CFUE requires five distinct supply domains: VDD1/VSS1 (core logic), VDDX/VSSX (I/O drivers), VDDA/VSSA (analog circuitry), VDDR/VSSR (internal voltage regulator input/output), and VDDPLL/VSSPLL (PLL circuitry). Separating these domains reduces noise coupling and ensures stable ADC/DAC performance and PLL lock integrity.
Is the MC9S12E64CFUE pin-compatible with other HCS12E family members?
Yes, the MC9S12E64CFUE is pin-compatible with MC9S12E128CFUE and MC9S12E32CFUE in the same 112-pin LQFP package. All share identical pin assignments, electrical characteristics, and peripheral mappings - enabling scalable memory selection without PCB redesign.
MC9S12E64CFUE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-QFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- EBI/EMI, I2C, SCI, SPI
- Peripherals:
- POR, PWM, WDT
- Number of I/O:
- 60
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 2.75V
- Data Converters:
- A/D 16x10b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12E64CFUE FAQ
1.How can I place an order for MC9S12E64CFUE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12E64CFUE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12E64CFUE reliable?
The price and inventory of MC9S12E64CFUE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12E64CFUE is usually 5 days.
3.What payment methods are accepted for MC9S12E64CFUE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12E64CFUE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12E64CFUE?
MC9S12E64CFUE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12E64CFUE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12E64CFUE?
For technical support, including MC9S12E64CFUE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12E64CFUE requirements.
6.How does Aetrix verify that MC9S12E64CFUE is sourced from the original manufacturer or authorized distributors?
All MC9S12E64CFUE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12E64CFUE meets industry standards.
7.What is the process for return or replacement of MC9S12E64CFUE?
All MC9S12E64CFUE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12E64CFUE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12E64CFUE part is unused and in its original packaging.
Return procedure for MC9S12E64CFUE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S12E64CFUE Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

