NXP Semiconductors MC9S12E64MPVE
- Part No.:
- MC9S12E64MPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12E64MPVE.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 112LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S12E64MPVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 64 KB on-chip Flash, 4 KB RAM, and integrated peripherals including 10-bit 16-channel ADC, dual 8-bit DACs, 8-channel PWM, SPI, I²C, three SCI interfaces, and background debug module. It operates at up to 25 MHz core frequency with internal voltage regulator and supports automotive-grade temperature range (–40°C to +105°C).
For engineers reviewing the MC9S12E64MPVE datasheet, MC9S12E64MPVE pinout, MC9S12E64MPVE application, or MC9S12E64MPVE equivalent, this page delivers verified technical context, package mapping, functional pin roles, real-world use cases in engine control and body electronics, and validated alternative options for legacy design continuity.
Technical Context
The MC9S12E64MPVE implements the HCS12 CPU12 core with 16-bit data path, Harvard architecture, and 24-bit addressing. It integrates a PLL-based clock generator supporting crystal or external clock input, configurable system clocks (BUSCLK up to 25 MHz), and multiple low-power modes (Stop, Wait, Pseudo-Stop).
Its peripheral set includes ATD10B16CV2 (10-bit, 16-channel ADC with 8 µs conversion time), DAC8B1CV1 (dual 8-bit DACs), PMF15B6CV2 (15-bit PWM with fault protection), and SCIV3 (three full-duplex UARTs). All modules are memory-mapped and support interrupt-driven operation with priority-based vectoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 CPU12 - 16-bit CISC core with 24-bit address bus and 16-bit data bus; enables deterministic real-time control in safety-critical automotive subsystems. |
| Flash Memory | 64 KB on-chip Flash (FTS128K1V1 derivative) - supports in-application programming (IAP), block erase, and flash security lock for firmware IP protection. |
| RAM | 4 KB on-chip RAM - used for stack, variables, and buffer storage; retains data during Wait mode but not Stop mode without backup supply. |
| ADC | 10-bit, 16-channel ATD10B16CV2 - 8 µs max conversion time per channel; supports scan mode, external trigger, and selectable reference (VRH/VRL). |
| PWM | 8-channel PWM8B6CV1 + 7-channel PMF15B6CV2 - 8-bit and 15-bit resolution respectively; includes dead-time insertion, fault shutdown, and center-aligned modes for motor control. |
| Communication | 3 × SCI (UART), 1 × SPI, 1 × I²C - full-duplex asynchronous serial, synchronous master/slave, and multi-master serial bus support for sensor networks and actuator interfaces. |
| Operating Temp | –40°C to +105°C - qualified for under-hood automotive applications per AEC-Q100 Grade 2 requirements. |
Pinout & Package
MC9S12E64MPVE is housed in a 112-pin LQFP (Low-Profile Quad Flat Package) with 0.4 mm pitch, RoHS-compliant lead finish, and thermal pad exposed on underside for enhanced heat dissipation in high-duty-cycle applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDX / VSSX | I/O Power / Ground | Supplies 5 V to all digital I/O ports; decoupling required within 1 cm of pins to maintain signal integrity in noisy automotive environments. |
| VDDA / VSSA | Analog Power / Ground | Isolated 5 V supply for ADC and DAC; must be filtered separately from digital rails to achieve ≤1 LSB noise performance. |
| VRH / VRL | ADC Reference Inputs | Accept external precision reference (e.g., 5 V or 2.5 V); defines full-scale range for 10-bit conversions - critical for sensor linearization accuracy. |
| EXTAL / XTAL | Crystal Oscillator Inputs | Supports 4–8 MHz fundamental-mode crystals; determines base clock source for PLL multiplication to generate BUSCLK up to 25 MHz. |
| RESET | Active-Low Reset Input | Asynchronous reset assertion clears CPU registers and initializes peripheral modules; compatible with external watchdog or power-monitor ICs. |
| BKGD | Background Debug Pin | Single-wire BDM interface for non-intrusive debugging, flash programming, and real-time register inspection without halting execution. |
| PA[7:0] | Port A Multiplexed I/O | Configurable as general-purpose I/O or upper address bus (ADDR[15:8]) in expanded multiplexed bus mode for external memory interfacing. |
| PS[7:0] | Port S Serial I/O | Hosts SCI0 (TXD0/RXD0), SCI1 (TXD1/RXD1), and SPI signals (SS/SCK/MOSI/MISO); enables daisy-chained diagnostics and sensor telemetry. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Voltage Regulator (VREG3V3V2) | On-chip 3.3 V regulator supplies internal logic; eliminates need for external LDO in cost-sensitive ECU designs while maintaining ±2% output tolerance over temp. |
| Flash Security Module | Prevents unauthorized read-out of Flash contents via BDM or boot-mode access; essential for protecting proprietary calibration maps and firmware algorithms. |
| Real-Time Interrupt (RTI) | Programmable periodic interrupt source (1.024 ms to 16.384 s) derived from oscillator/PLL clock; replaces external timer ICs in idle-loop scheduling and diagnostic timing. |
| Computer Operating Properly (COP) Watchdog | Independent free-running counter requiring periodic service; triggers hardware reset if software hangs - mandatory for ISO 26262 ASIL-B compliance in engine management. |
| Low-Power Stop Mode | Reduces current consumption to <10 µA while retaining RAM content and wake-up capability on IRQ, XIRQ, or RTC event; extends battery life in always-on vehicle modules. |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
|
Use Scenario: Real-time sampling of throttle position, coolant temperature, and oxygen sensor signals in gasoline engine management. IC Role / Device Role / Timing Role: Primary controller executing fuel injection timing, spark advance calculation, and closed-loop air-fuel ratio correction at 10 ms intervals. Use Value: 10-bit ADC with hardware-triggered scan mode ensures synchronized sampling across 16 sensors; 25 MHz BUSCLK guarantees sub-100 µs interrupt latency for misfire detection. |
Use Scenario: Centralized control of door locks, window lifts, interior lighting, and HVAC fan speed in passenger vehicles. IC Role / Device Role / Timing Role: System coordinator managing CAN message routing, PWM dimming, and discrete I/O state monitoring via Port P/Q/S. Use Value: Dual 8-bit DACs drive analog HVAC actuators; 3× SCI interfaces enable simultaneous communication with instrument cluster, radio, and telematics gateway. |
| Transmission Control Unit (TCU) | Advanced Driver Assistance Systems (ADAS) Sensor Interface |
|
Use Scenario: Closed-loop solenoid control for automatic transmission shift timing and pressure regulation. IC Role / Device Role / Timing Role: High-reliability actuator driver using PMF15B6CV2 PWM with fault shutdown to disable outputs on overcurrent or short-circuit events. Use Value: Fault-protected 15-bit PWM provides 32,768-step resolution for precise hydraulic pressure modulation; BDM debug port enables field calibration updates. |
Use Scenario: Signal conditioning and preprocessing of analog radar or camera sensor outputs before CAN/FlexRay transmission. IC Role / Device Role / Timing Role: Front-end analog interface converting sensor outputs to digital values and packaging them into standardized CAN frames. Use Value: 16-channel ADC supports simultaneous sampling of multiple sensor inputs; internal voltage regulator ensures stable analog performance despite battery voltage fluctuations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XEQ512F0VAG | 16-bit S12X core, 512 KB Flash, 32 KB RAM, enhanced CAN FD support, higher BUSCLK (50 MHz), but larger 144-pin LQFP package. | Targets next-generation ECUs requiring CAN FD, larger code footprint, and faster math operations; not drop-in compatible due to pin count and memory map changes. | Select when upgrading legacy MC9S12E64MPVE designs to meet evolving OEM communication protocols and computational demands. |
| MC9S12XEP100MALR | 16-bit S12XE core, 1 MB Flash, 64 KB RAM, dual CAN, Ethernet MAC, and enhanced debug (BDM+JTAG); 112-pin LQFP same footprint but different pin assignment. | Designed for high-end powertrain and chassis control with Ethernet diagnostics and dual-CAN redundancy; requires PCB redesign due to incompatible pinout. | Choose for new designs needing future-proof connectivity and scalability beyond MC9S12E64MPVE's capabilities, accepting layout revision. |
Compared with MC9S12E64MPVE, S912XEQ512F0VAG offers 8× more Flash and CAN FD but requires mechanical and signal rework, while MC9S12XEP100MALR delivers Ethernet and dual CAN in the same 112-pin form factor but with non-compatible pin mapping - both serve as functional upgrades rather than direct replacements.
Availability
MC9S12E64MPVE is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control systems requiring stable component supply and long-term industrial lifecycle support.
Supply support for MC9S12E64MPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's automotive MCU heritage.
The MC9S12E64MPVE belongs to the HCS12 family designed specifically for cost-sensitive, high-reliability automotive electronic control units where deterministic real-time response, flash security, and AEC-Q100 qualification are mandatory.
FAQ
What is the maximum operating frequency of the MC9S12E64MPVE core?
The MC9S12E64MPVE features an HCS12 CPU12 core with a maximum BUSCLK frequency of 25 MHz, achieved via its internal PLL multiplying a 4–8 MHz crystal input. This corresponds to a typical instruction execution rate of ~12.5 million instructions per second (MIPS), sufficient for real-time engine control loops with sub-10 ms cycle times. The core itself does not run at a separate "core clock" - BUSCLK is the primary timing reference for all peripherals and CPU fetch/execute cycles in the MC9S12E64MPVE.
Does the MC9S12E64MPVE support CAN bus communication?
No, the MC9S12E64MPVE does not include a built-in CAN controller. Its communication peripherals consist of three SCI (UART) modules, one SPI interface, and one I²C module. CAN functionality requires external CAN transceivers paired with SCI-based software-implemented protocols (e.g., LIN or custom UART-to-CAN bridges), or migration to later S12X-family devices like the MC9S12XEP100 which integrate native CAN controllers. This absence is explicitly confirmed in the MC9S12E128/E64/E32 data sheet Rev. 1.07.
What debug interface does the MC9S12E64MPVE provide?
The MC9S12E64MPVE uses the Background Debug Mode (BDM) interface via the BKGD pin, supporting single-wire, non-intrusive debugging, flash programming, and real-time register inspection. It is compatible with standard BDM tools such as the P&E Micro USB-ML-12 and older Freescale DEMO9S12E128 evaluation boards. JTAG is not supported - only BDMv4 as specified in Chapter 15 of the MC9S12E128 data sheet, which applies to MC9S12E64MPVE.
Is the MC9S12E64MPVE pin-compatible with the MC9S12E128 series?
Yes, the MC9S12E64MPVE shares identical pinout, package (112-pin LQFP), and electrical characteristics with the MC9S12E128 and MC9S12E32 variants. All three belong to the same HCS12E family and use the same die substrate with mask-programmed Flash size differentiation. This allows hardware reuse across variants - a board designed for MC9S12E128 can run MC9S12E64MPVE firmware without modification, provided software accounts for reduced Flash and RAM resources.
What is the purpose of the VREG3V3V2 module in the MC9S12E64MPVE?
The VREG3V3V2 is an integrated 3.3 V voltage regulator that powers the internal logic circuitry of the MC9S12E64MPVE, eliminating the need for an external LDO in many automotive applications. It accepts a 5 V input (VDD1/VDD2) and delivers regulated 3.3 V ±2% output across –40°C to +105°C, enabling simplified power design and reduced BOM cost. It does not supply I/O banks (handled by VDDX) or analog circuits (supplied by VDDA), preserving noise isolation for ADC/DAC operation.
MC9S12E64MPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- EBI/EMI, I2C, SCI, SPI
- Peripherals:
- POR, PWM, WDT
- Number of I/O:
- 92
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 2.75V
- Data Converters:
- A/D 16x10b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12E64MPVE FAQ
1.How can I place an order for MC9S12E64MPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12E64MPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12E64MPVE reliable?
The price and inventory of MC9S12E64MPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12E64MPVE is usually 5 days.
3.What payment methods are accepted for MC9S12E64MPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12E64MPVE transactions.
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4.How is shipping managed for MC9S12E64MPVE?
MC9S12E64MPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12E64MPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12E64MPVE?
For technical support, including MC9S12E64MPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12E64MPVE requirements.
6.How does Aetrix verify that MC9S12E64MPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12E64MPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12E64MPVE meets industry standards.
7.What is the process for return or replacement of MC9S12E64MPVE?
All MC9S12E64MPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12E64MPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12E64MPVE part is unused and in its original packaging.
Return procedure for MC9S12E64MPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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