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NXP Semiconductors MC9S12GC128MFUE

Part No.:
MC9S12GC128MFUE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
80-QFP
Datasheet:
AetrixMC9S12GC128MFUE.pdf
Description:
IC MCU 16BIT 128KB FLASH 80QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,244

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Product details

Overview

MC9S12GC128MFUE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 128 KB on-chip Flash, 8 KB RAM, and integrated CAN 2.0A/B controller, PWM, ATD10B8C 10-bit ADC (8-channel), and BDM debug interface. It operates at up to 25 MHz core frequency with internal PLL, supports automotive-grade temperature range (–40°C to +125°C), and targets engine control units, body electronics, and industrial motor control.

For engineers reviewing the MC9S12GC128MFUE datasheet, MC9S12GC128MFUE pinout, MC9S12GC128MFUE application, or MC9S12GC128MFUE equivalent, key selection criteria include its 80-pin LQFP package, S12 CPU core compatibility, CAN bus integration, Flash endurance (10k erase/write cycles), and qualification per AEC-Q100 Grade 1.

Technical Context

The MC9S12GC128MFUE implements the S12 CPU core with 16-bit data path and 24-bit address space, executing instructions in single-cycle (most) or two-cycle (indexed) modes. Its memory subsystem includes 128 KB of user-programmable Flash organized in 1-KB sectors, 8 KB of SRAM, and 512 bytes of EEPROM emulation via Flash.

Peripheral integration follows the HCS12 architecture: scalable CAN controller (MSCAN), 16-bit timer module (TIM16B8CV1) with 8 input-capture/output-compare channels, 8-channel 10-bit ATD converter with configurable sample-and-hold, and dual-voltage regulator (VREG3V3V2) supporting 5 V supply with internal 3.3 V generation for core and I/O.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture S12 16-bit CPU with 24-bit addressing, upward-compatible with HC12 instruction set
Flash Memory 128 KB on-chip Flash with 1-KB sector erase, 10k program/erase cycles, 128-byte page programming
RAM 8 KB on-chip SRAM, byte-addressable, no wait states at full speed
CAN Interface One S12MSCANV2 module supporting CAN 2.0A/B protocol, 32 message buffers, programmable bit timing
ADC ATD10B8C: 10-bit resolution, 8 analog inputs, 8 µs conversion time, software/hardware trigger support
Package 80-pin LQFP (12 × 12 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3
Operating Temperature –40°C to +125°C, qualified per AEC-Q100 Grade 1 for automotive applications

Pinout & Package

MC9S12GC128MFUE is housed in an 80-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad. Pin functions are defined per MC9S12C/GC Family Reference Manual Rev 01.24, Chapter 1.3.1 (Device Pinouts) and Appendix C (Package Information).

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dual 5 V supply domains: VDDA/VSSA for analog peripherals, VDD/VSS for digital core and I/O
RESET Active-low reset input Asynchronous reset assertion clears CPU registers and initiates boot sequence from vector table
BKGD Background debug pin Single-wire BDM interface for non-intrusive debugging, flash programming, and real-time trace
CANRX / CANTX CAN physical layer interface Differential receive and transmit pins for direct connection to ISO 11898-compliant transceiver
PORTA[7:0] General-purpose I/O port 8-bit bidirectional port with pull-up enable, interrupt-on-change capability, and peripheral multiplexing
XTAL / EXTAL Crystal oscillator connections Supports 4–8 MHz crystal; internal PLL generates system clock up to 25 MHz

Key Features

Feature Design Value
On-chip Flash security Memory protection via FLASHSEC register prevents unauthorized read/write access to Flash and EEPROM emulation area
Low-power operation Three low-power modes (WAIT, STOP, Pseudo-STOP) with wake-up via interrupt, reset, or BDM activity
Integrated voltage regulator VREG3V3V2 provides regulated 3.3 V for core logic and internal peripherals from 5 V supply, eliminating external LDO
Scalable CAN controller MSCAN supports both standard (11-bit) and extended (29-bit) identifiers, automatic retransmission, and error confinement
Background Debug Module BDMV4 enables full-speed debugging, flash erase/program, and real-time variable monitoring without halting CPU execution

Applications

Engine Control Unit (ECU) Body Control Module (BCM)

Use Scenario: Real-time monitoring of throttle position, coolant temperature, and oxygen sensor signals in gasoline/diesel powertrain systems.

IC Role / Device Role / Timing Role: Primary MCU executing closed-loop fuel injection and ignition timing algorithms with sub-millisecond deterministic response.

Use Value: Integrated 10-bit ATD and CAN controller reduce BOM count and PCB footprint while meeting ASIL-B functional safety requirements via hardware CRC and watchdog timers.

Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC in passenger vehicles.

IC Role / Device Role / Timing Role: System coordinator communicating over CAN bus with distributed sensors and actuators using standardized message protocols.

Use Value: AEC-Q100 Grade 1 qualification ensures reliability across extended temperature ranges; 128 KB Flash accommodates firmware updates and diagnostics stack.

Industrial Motor Drive Off-Highway Vehicle Telematics

Use Scenario: Closed-loop speed and torque control of 3-phase BLDC motors in pumps, compressors, and conveyors.

IC Role / Device Role / Timing Role: Real-time PWM generation (via PWM8B6CV1) synchronized with ADC sampling for current sensing and field-oriented control.

Use Value: Hardware timer capture/compare and 8-channel ADC enable precise phase current measurement and commutation timing without CPU overhead.

Use Scenario: Data aggregation and wireless transmission of engine health, GPS location, and payload metrics in construction and agricultural equipment.

IC Role / Device Role / Timing Role: Edge node processor interfacing with GNSS modules, CAN networks, and cellular modems via UART/SPI interfaces.

Use Value: Dual-voltage regulator and robust ESD tolerance (±4 kV HBM) ensure stable operation in electrically noisy off-road environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S12XEP100MAG Enhanced S12X core, 1 MB Flash, 64 KB RAM, dual CAN, LIN, and enhanced PWM; larger package (112-pin MAPBGA) Higher integration for complex powertrain or chassis control requiring multiple CAN buses and advanced math acceleration Select when needing >128 KB Flash, S12X instruction extensions, or additional CAN/LIN channels - not drop-in compatible
S912ZVL12F0MLFR Z-series 16-bit core, 128 KB Flash, 8 KB RAM, CAN, 12-bit ADC (12 ch), LIN, and enhanced BIST; 64-pin LQFP Optimized for cost-sensitive body electronics with higher-resolution ADC and built-in self-test for functional safety compliance Prefer for new designs targeting ISO 26262 ASIL-A/B where diagnostic coverage and smaller footprint are critical

Compared with MC9S12GC128MFUE, MC9S12XEP100MAG offers significantly higher memory and peripheral density but requires PCB redesign, while S912ZVL12F0MLFR delivers modern safety features and ADC precision in a smaller package-neither is pin-compatible, but both serve adjacent automotive MCU roles.

Availability

MC9S12GC128MFUE is available at Aetrix Electronics and suitable for engine control units, body control modules, and industrial motor drives requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.

Supply support for MC9S12GC128MFUE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontroller innovation dating back to Motorola and Freescale.

The MC9S12GC family was designed specifically for cost-optimized automotive body electronics and entry-level powertrain applications, balancing performance, peripheral integration, and AEC-Q100 compliance in compact packages.

FAQ

What is the maximum operating frequency of the MC9S12GC128MFUE?

The MC9S12GC128MFUE achieves a maximum core clock frequency of 25 MHz using its internal Phase-Locked Loop (PLL), which multiplies an external 4–8 MHz crystal input. This frequency is sustained across the full –40°C to +125°C operating range and supports deterministic real-time execution for automotive control loops.

Does the MC9S12GC128MFUE support in-circuit debugging?

Yes, the MC9S12GC128MFUE integrates the Background Debug Module (BDMV4), enabling full-speed in-circuit debugging, flash programming, and real-time variable inspection via a single BKGD pin. No external JTAG adapter is required, and debugging does not halt CPU execution during background memory access.

What type of CAN protocol does the MC9S12GC128MFUE implement?

The MC9S12GC128MFUE implements the S12MSCANV2 module, which fully supports CAN 2.0A (standard frame) and CAN 2.0B (extended frame) protocols. It includes 32 message buffers, programmable bit timing, automatic retransmission, and error confinement-meeting ISO 11898-1 requirements for automotive network communication.

Is the MC9S12GC128MFUE qualified for automotive use?

Yes, the MC9S12GC128MFUE is qualified per AEC-Q100 Grade 1 (–40°C to +125°C), including stress testing for HTOL, TCT, ESD, and latch-up. It is widely deployed in production automotive ECUs and BCMs, with documentation confirming compliance in Freescale's Automotive Qualification Report for the MC9S12GC family.

How much user-accessible Flash memory does the MC9S12GC128MFUE provide?

The MC9S12GC128MFUE provides 128 KB of user-programmable Flash memory, organized in uniform 1-KB sectors. All sectors are individually erasable and support up to 10,000 erase/write cycles. The Flash includes security features such as block protection and mass erase lockout to prevent unauthorized firmware access.

MC9S12GC128MFUE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
80-QFP
Series:
HCS12
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12GC128MFUE FAQ

1.How can I place an order for MC9S12GC128MFUE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12GC128MFUE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12GC128MFUE reliable?

The price and inventory of MC9S12GC128MFUE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12GC128MFUE is usually 5 days.

3.What payment methods are accepted for MC9S12GC128MFUE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12GC128MFUE transactions.

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MC9S12GC128MFUE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12GC128MFUE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12GC128MFUE?

For technical support, including MC9S12GC128MFUE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12GC128MFUE requirements.

6.How does Aetrix verify that MC9S12GC128MFUE is sourced from the original manufacturer or authorized distributors?

All MC9S12GC128MFUE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12GC128MFUE meets industry standards.

7.What is the process for return or replacement of MC9S12GC128MFUE?

All MC9S12GC128MFUE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12GC128MFUE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12GC128MFUE part is unused and in its original packaging.

Return procedure for MC9S12GC128MFUE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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