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NXP Semiconductors MC9S12GC16MPBE

Part No.:
MC9S12GC16MPBE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
52-LQFP
Datasheet:
AetrixMC9S12GC16MPBE.pdf
Description:
IC MCU 16BIT 16KB FLASH 52TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,262

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Product details

Overview

MC9S12GC16MPBE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 16 KB on-chip Flash, 1 KB RAM, and a 25 MHz maximum bus frequency. It integrates an 8-channel 10-bit ADC, dual CAN 2.0A/B controllers, PWM, SPI, SCI, and BDM debug interface. Designed for automotive body electronics and industrial control, it operates across –40°C to +105°C with single 5 V supply.

For engineers reviewing the MC9S12GC16MPBE datasheet, MC9S12GC16MPBE pinout, MC9S12GC16MPBE application, or MC9S12GC16MPBE equivalent, key selection criteria include its 5 V tolerant I/O, integrated CAN transceivers (via external drivers), background debug capability, and qualification for automotive AEC-Q100 Grade 2 temperature operation.

Technical Context

The MC9S12GC16MPBE implements the S12 CPU core with 16-bit data path, von Neumann architecture, and 64 KB linear address space. Its memory subsystem includes 16 KB Flash (with EEPROM emulation), 1 KB RAM, and configurable register banking via PPAGE. The device supports multiple low-power modes (WAIT, STOP, Pseudo-STOP) controlled by the Clocks and Reset Generator (CRGV4) module.

Peripheral integration follows the HCS12 modular design: the Port Integration Module (PIM) configures up to 40 GPIO pins with pull-up enable and interrupt capability; the Scalable CAN (MSCAN) modules support message buffering, ID filtering, and loopback self-test; and the ATD10B8C ADC provides 8 analog inputs with software/hardware trigger options and configurable sample-and-hold timing.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture S12 16-bit CPU with 64 KB address space and 16-level stack
Flash Memory 16 KB on-chip Flash with 100K write/erase cycles and EEPROM emulation capability
RAM 1 KB on-chip RAM with retention in WAIT mode
Max Bus Frequency 25 MHz - determines instruction throughput and peripheral timing margins
ADC Resolution & Channels 10-bit resolution, 8 input channels with programmable conversion sequence and 8 µs typical conversion time
CAN Controllers Dual S12MSCAN modules supporting CAN 2.0A/B protocol, 16 message buffers each, and bit rates up to 1 Mbps
Operating Temperature –40°C to +105°C - qualified per AEC-Q100 Grade 2 for under-hood automotive use
Supply Voltage Single 4.5 V to 5.5 V supply - eliminates need for multi-rail power design

Pinout & Package

MC9S12GC16MPBE is housed in a 52-pin LQFP (7 mm × 7 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined per the MC9S12GC Family Reference Manual Rev 01.24, Section 1.3.1 (Device Pinouts) and Appendix C (Package Information).

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dedicated pairs for analog (VDDA/VSSA) and digital (VDD/VSS) domains; decoupling required per layout guidelines
RESET Active-low reset input Asynchronous reset with internal pull-up; initiates hardware reset sequence and clears all registers
BKGD Background debug serial interface Single-wire BDM interface for non-intrusive debugging, flash programming, and real-time register access
PORTA[7:0] General-purpose I/O port 8-bit bidirectional port with individual direction control and optional internal pull-ups; supports interrupt-on-change
CAN0TX / CAN0RX CAN controller 0 differential signal interface Open-drain outputs requiring external CAN transceiver (e.g., TJA1042) for physical layer compliance
AD0–AD7 Analog input channels Shared with PORTA/PORTB pins; configured via MODRR register; support 0–5 V input range with internal reference

Key Features

Feature Design Value
Integrated BDM Interface Enables in-circuit debugging and flash programming without external JTAG adapter - reduces development tool cost and board space
Dual CAN 2.0A/B Controllers Supports distributed vehicle networks with independent message buffering, ID masking, and error confinement - essential for body control modules
EEPROM Emulation in Flash Allows reliable parameter storage (e.g., calibration data, odometer) using Flash sectors with wear-leveling firmware - avoids external EEPROM BOM cost
5 V Tolerant I/O All GPIO pins tolerate 5 V regardless of supply voltage - simplifies interfacing with legacy sensors and actuators in 5 V systems
AEC-Q100 Grade 2 Qualification Validated for operation from –40°C to +105°C with HTOL and TC testing - meets automotive body electronics reliability requirements

Applications

Body Control Module (BCM) Engine Control Unit (ECU) Subsystem

Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC in entry-level vehicles.

IC Role / Device Role / Timing Role: Main system controller executing real-time task scheduling, CAN message routing, and analog sensor acquisition (e.g., ambient temperature, battery voltage).

Use Value: Integrated dual CAN eliminates need for external CAN controllers; 16 KB Flash accommodates bootloader + application firmware; 5 V I/O directly interfaces with mechanical switches and relays.

Use Scenario: Auxiliary engine subsystem for throttle actuator control, fuel pump monitoring, or turbocharger boost regulation.

IC Role / Device Role / Timing Role: Safety-relevant node communicating via CAN with main ECU while performing closed-loop PWM control and fault detection.

Use Value: Dual CAN enables redundant communication paths; built-in COP watchdog and clock monitor ensure fail-safe behavior; AEC-Q100 Grade 2 ensures operation at under-hood temperatures.

Industrial Motor Drive Controller Commercial Vehicle Telematics Gateway

Use Scenario: Low-cost variable-speed drive for pumps, fans, or conveyors in HVAC and building automation.

IC Role / Device Role / Timing Role: Real-time motor commutation logic using PWM outputs, current sensing via ADC, and thermal protection monitoring.

Use Value: 8-channel 10-bit ADC samples multiple analog feedback signals simultaneously; 25 MHz bus speed supports fast PID loop execution; LQFP package enables compact PCB layout.

Use Scenario: Data aggregation unit collecting GPS, CAN bus diagnostics, and driver behavior metrics for fleet management.

IC Role / Device Role / Timing Role: Protocol translator bridging GPS UART, cellular modem UART, and vehicle CAN networks with local data buffering.

Use Value: Dual CAN ports allow simultaneous connection to chassis and powertrain networks; SCI and SPI interfaces support modem and SD card expansion; 1 KB RAM suffices for packet buffering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S12GC32MPBE 32 KB Flash, same 52-pin LQFP package and peripheral set Supports larger firmware images (e.g., OTA update stack + full diagnostics) Select when future firmware growth or enhanced feature sets require >16 KB code space
S9S12G128F0MLH NXP's pin-compatible successor with 128 KB Flash, enhanced CAN FD support, and improved ESD immunity Targets next-generation designs requiring higher bandwidth or longer product lifecycle Choose for new designs needing extended longevity, CAN FD readiness, or higher memory headroom

Compared with MC9S12GC16MPBE, the MC9S12GC32MPBE offers immediate memory scalability within identical footprint and toolchain, while the S9S12G128F0MLH delivers architectural evolution-enabling CAN FD migration and longer design-in horizon-without PCB redesign.

Availability

MC9S12GC16MPBE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and commercial telematics requiring stable component supply and long-term manufacturing continuity.

Supply support for MC9S12GC16MPBE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S12GC family was engineered specifically for cost-sensitive, high-reliability automotive body electronics and industrial control, emphasizing robustness, integrated peripherals, and AEC-Q100 compliance.

FAQ

What is the maximum operating frequency of the MC9S12GC16MPBE?

The MC9S12GC16MPBE supports a maximum bus frequency of 25 MHz, achieved via its on-chip Phase-Locked Loop (PLL) that multiplies the external crystal or oscillator input. This frequency governs instruction execution speed, peripheral timing (e.g., SCI baud rate generation), and ADC sampling rate - all verified under worst-case voltage and temperature conditions per AEC-Q100 Grade 2 test limits.

Does the MC9S12GC16MPBE include a built-in CAN transceiver?

No, the MC9S12GC16MPBE integrates dual CAN protocol controllers (MSCAN modules) but requires external CAN transceivers (e.g., TJA1042 or SN65HVD230) to drive the physical bus. Its CAN0TX/CAN0RX and CAN1TX/CAN1RX pins provide CMOS-level signals compliant with ISO 11898-1, not ISO 11898-2 physical layer output.

How is flash programming performed on the MC9S12GC16MPBE?

Flash programming on the MC9S12GC16MPBE is performed via the single-wire Background Debug Mode (BDM) interface using standard Freescale/NXP BDM tools (e.g., PEMicro Multilink). The device supports in-system programming without removing it from the target board, and the Flash module includes security features such as mass erase protection and block write protection.

What ADC capabilities does the MC9S12GC16MPBE provide?

The MC9S12GC16MPBE integrates the ATD10B8C module: an 8-channel, 10-bit successive-approximation ADC with programmable sample time, software/hardware triggering, and configurable conversion sequences. It supports 0–5 V input range using internal 5 V reference, achieves ≤8 µs conversion time, and allows channel scanning without CPU intervention via queue mode.

Is the MC9S12GC16MPBE qualified for automotive applications?

Yes, the MC9S12GC16MPBE is AEC-Q100 qualified to Grade 2 (–40°C to +105°C), with full test reports covering HTOL, TC, ESD, and EMC performance. It is widely deployed in automotive body control modules, lighting systems, and auxiliary ECUs where functional safety (ASIL-B capable with proper software architecture) and long-term supply stability are required.

MC9S12GC16MPBE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
52-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12GC16MPBE FAQ

1.How can I place an order for MC9S12GC16MPBE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12GC16MPBE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12GC16MPBE reliable?

The price and inventory of MC9S12GC16MPBE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12GC16MPBE is usually 5 days.

3.What payment methods are accepted for MC9S12GC16MPBE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12GC16MPBE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S12GC16MPBE?

MC9S12GC16MPBE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12GC16MPBE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12GC16MPBE?

For technical support, including MC9S12GC16MPBE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12GC16MPBE requirements.

6.How does Aetrix verify that MC9S12GC16MPBE is sourced from the original manufacturer or authorized distributors?

All MC9S12GC16MPBE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12GC16MPBE meets industry standards.

7.What is the process for return or replacement of MC9S12GC16MPBE?

All MC9S12GC16MPBE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12GC16MPBE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12GC16MPBE part is unused and in its original packaging.

Return procedure for MC9S12GC16MPBE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S12GC16MPBE Tags

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