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NXP Semiconductors MC9S12GC16VFAE
- Part No.:
- MC9S12GC16VFAE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
MC9S12GC16VFAE.pdf
- Description:
- IC MCU 16BIT 16KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,023
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Product details
Overview
MC9S12GC16VFAE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 16 KB on-chip Flash memory, 1 KB RAM, and a 25 MHz maximum bus frequency. It integrates an 8-channel 10-bit ADC, CAN 2.0A/B controller, PWM module, and background debug interface. Designed for automotive body electronics and industrial control, it operates across –40°C to +105°C with single 5 V supply.
For engineers reviewing the MC9S12GC16VFAE datasheet, MC9S12GC16VFAE pinout, MC9S12GC16VFAE application, or MC9S12GC16VFAE equivalent, key selection criteria include its 48-pin LQFP package, S12 CPU core compatibility, CAN interface support, Flash endurance (10k erase/write cycles), and qualification per AEC-Q100 Grade 2.
Technical Context
The MC9S12GC16VFAE implements the S12 CPU core with 16-bit data path and von Neumann architecture, executing instructions at up to 25 MHz bus speed via internal PLL clock generation. Its memory subsystem includes 16 KB of user-programmable Flash with EEPROM emulation capability and 1 KB of SRAM.
Peripheral integration includes a full-featured MSCAN module compliant with ISO 11898-1, 8-channel 10-bit ATD converter with configurable sample-and-hold, 8-bit PWM with 6 independent channels, and a 16-bit timer module with input capture/output compare functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S12 16-bit CPU with 25 MHz max bus frequency - enables deterministic real-time control in automotive ECU designs. |
| Flash Memory | 16 KB on-chip Flash - supports field firmware updates and retains code without external memory. |
| RAM | 1 KB on-chip SRAM - sufficient for stack, variables, and small buffers in embedded control loops. |
| ADC | 8-channel 10-bit ATD converter - provides precision analog sensing for temperature, voltage, and sensor inputs. |
| CAN Interface | Scalable Controller Area Network (MSCAN) module - enables robust serial communication in vehicle networks per ISO 11898. |
| Operating Temperature | –40°C to +105°C - qualified for under-hood automotive applications and industrial environments. |
| Supply Voltage | Single 4.5 V to 5.5 V supply - simplifies power design with no auxiliary rails required. |
Pinout & Package
MC9S12GC16VFAE is housed in a 48-pin LQFP (7 mm × 7 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments follow the MC9S12GC family standard layout, supporting multiplexed I/O, dedicated CAN transceiver interface pins, and background debug (BKGD) signaling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual VDD/VSS pairs ensure stable core and I/O rail decoupling; mandatory 100 nF ceramic capacitors per pair. |
| RESET | Active-low reset input | Asynchronous reset assertion clears registers and forces boot vector fetch; internal pull-up enabled by default. |
| BKGD | Background debug interface | Single-wire BDM channel for non-intrusive flash programming and real-time debugging without halting execution. |
| RX/TX (CAN) | CAN differential transceiver interface | Direct connection to external CAN transceiver (e.g., TJA1040); requires termination resistor and common-mode choke. |
| AD0–AD7 | Analog input channels | Multiplexed with Port AD pins; support 0–5 V input range with internal reference (VRH/VRL). |
| PT0–PT7 | General-purpose I/O port | Configurable as digital input/output or peripheral function (e.g., PWM output, timer input capture). |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash with EEPROM emulation | Enables parameter storage and wear-leveling without external EEPROM, reducing BOM count and board space. |
| MSCAN module (ISO 11898-1 compliant) | Supports both standard (11-bit) and extended (29-bit) CAN identifiers with message buffering and error handling. |
| Background Debug Module (BDM) | Allows in-circuit flash programming, breakpoint setting, and register inspection using only BKGD and RESET pins. |
| 10-bit 8-channel ADC with configurable sampling | Provides 100 ksps conversion rate and flexible trigger sources (software, timer, or external event). |
| Low-power STOP/WAIT modes | Reduces current consumption to <10 µA in STOP mode, enabling battery-backed operation in sleep-state applications. |
Applications
| Automotive Door Module | Industrial Motor Control |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main system controller executing LIN/CAN gateway logic, sensor polling, and actuator drive sequencing. Use Value: Integrated CAN and 10-bit ADC eliminate need for external transceivers and signal conditioning ICs, reducing component count by ≥3. |
Use Scenario: Closed-loop speed and position control of BLDC motors in HVAC blowers and conveyor systems. IC Role / Device Role / Timing Role: Real-time PWM generation, current sensing via ADC, and fault monitoring with fast interrupt response. Use Value: 25 MHz bus speed ensures sub-10 µs loop timing resolution; built-in PWM dead-time insertion prevents shoot-through in half-bridge drivers. |
| Body Control Module (BCM) | Smart Lighting Controller |
Use Scenario: Power distribution, diagnostics, and communication hub managing lighting, wipers, and horn functions. IC Role / Device Role / Timing Role: CAN network node with message filtering, wake-on-CAN capability, and GPIO-driven load switching. Use Value: AEC-Q100 Grade 2 qualification ensures reliability in high-vibration, thermally stressed environments over 15-year vehicle life. |
Use Scenario: Adaptive LED headlight dimming and dynamic rear lighting with ambient light and vehicle-speed input. IC Role / Device Role / Timing Role: Sensor fusion processor aggregating ADC readings (ALS, temperature) and generating PWM-dimmed outputs. Use Value: On-chip Flash allows over-the-air calibration updates; 1 KB RAM supports real-time brightness curve interpolation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12GC32VFAE | 32 KB Flash, same 48-pin LQFP package and peripheral set - no PCB change required. | Supports larger firmware images and more complex state machines; suitable for future-proofing. | Select when >16 KB code space is needed or when migrating from legacy MC9S12C128 designs. |
| S9S12G128F0MLH | NXP's pin-compatible successor with enhanced CAN FD support, 128 KB Flash, and improved ESD immunity (±8 kV HBM). | Required for next-gen automotive platforms needing higher bandwidth or functional safety extensions. | Choose for new designs targeting long-term availability and CAN FD readiness; not drop-in for existing MC9S12GC16VFAE layouts due to different package marking and thermal pad design. |
Compared with MC9S12GC32VFAE, the MC9S12GC16VFAE offers lower cost and smaller footprint for resource-constrained applications; compared with S9S12G128F0MLH, it lacks CAN FD and has reduced Flash but maintains full software compatibility within the S12GC family toolchain.
Availability
MC9S12GC16VFAE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor controllers, and smart lighting systems requiring stable component supply and long-lifecycle support.
Supply support for MC9S12GC16VFAE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in microcontrollers and automotive-grade silicon.
The MC9S12GC family was engineered specifically for cost-sensitive automotive body electronics, delivering AEC-Q100 qualified performance, integrated CAN, and robust debug capabilities in compact packages.
FAQ
What is the maximum operating frequency of the MC9S12GC16VFAE?
The MC9S12GC16VFAE supports a maximum bus frequency of 25 MHz, achieved via its internal Phase-Locked Loop (PLL) that multiplies the external crystal or oscillator input. This frequency governs instruction execution, peripheral timing, and interrupt latency - critical for real-time automotive control tasks. The S12 CPU core executes most instructions in 1–3 bus cycles at this rate.
Does the MC9S12GC16VFAE include a CAN controller?
Yes, the MC9S12GC16VFAE integrates the Scalable Controller Area Network (MSCAN) module, compliant with ISO 11898-1 for CAN 2.0A/B protocols. It supports both standard (11-bit) and extended (29-bit) identifiers, has three message buffers, and includes automatic retransmission, error detection, and wake-on-CAN functionality - all essential for automotive network nodes.
What debug interface does the MC9S12GC16VFAE support?
The MC9S12GC16VFAE uses the Background Debug Module (BDM) interface, accessed via a single BKGD pin and RESET. This allows non-intrusive flash programming, real-time variable inspection, and breakpoint-based debugging without requiring JTAG hardware. BDM is fully supported by CodeWarrior Development Studio and compatible third-party tools.
Is the MC9S12GC16VFAE qualified for automotive use?
Yes, the MC9S12GC16VFAE is AEC-Q100 qualified to Grade 2 (–40°C to +105°C), making it suitable for under-hood and cabin-mounted automotive applications. It meets stringent requirements for thermal cycling, humidity resistance, and electromagnetic compatibility - validated through NXP's automotive qualification program.
What is the Flash endurance specification for the MC9S12GC16VFAE?
The MC9S12GC16VFAE specifies 10,000 erase/write cycles for its 16 KB on-chip Flash memory, with data retention guaranteed for 10 years at +85°C. This endurance enables reliable firmware updates and EEPROM-emulation usage in field-deployed systems such as door modules and lighting controllers.
MC9S12GC16VFAE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- EBI/EMI, SCI, SPI
- Peripherals:
- POR, PWM, WDT
- Number of I/O:
- 31
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12GC16VFAE FAQ
1.How can I place an order for MC9S12GC16VFAE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12GC16VFAE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12GC16VFAE reliable?
The price and inventory of MC9S12GC16VFAE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12GC16VFAE is usually 5 days.
3.What payment methods are accepted for MC9S12GC16VFAE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12GC16VFAE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12GC16VFAE?
MC9S12GC16VFAE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12GC16VFAE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12GC16VFAE?
For technical support, including MC9S12GC16VFAE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12GC16VFAE requirements.
6.How does Aetrix verify that MC9S12GC16VFAE is sourced from the original manufacturer or authorized distributors?
All MC9S12GC16VFAE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12GC16VFAE meets industry standards.
7.What is the process for return or replacement of MC9S12GC16VFAE?
All MC9S12GC16VFAE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12GC16VFAE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12GC16VFAE part is unused and in its original packaging.
Return procedure for MC9S12GC16VFAE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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