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NXP Semiconductors MC9S12GC64MFUE

Part No.:
MC9S12GC64MFUE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
80-QFP
Datasheet:
AetrixMC9S12GC64MFUE.pdf
Description:
IC MCU 16BIT 64KB FLASH 80QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,948

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Product details

Overview

MC9S12GC64MFUE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 64 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0A/B controller, designed for automotive body electronics and industrial control applications requiring deterministic real-time response and robust communication.

For engineers reviewing the MC9S12GC64MFUE datasheet, MC9S12GC64MFUE pinout, MC9S12GC64MFUE application, or MC9S12GC64MFUE equivalent, key selection criteria include its 50 MHz bus speed, 8-channel 10-bit ADC, 8-channel PWM with center-aligned mode, background debug interface (BDM), and 80-pin LQFP package with automotive-grade temperature range (–40°C to +125°C).

Technical Context

The MC9S12GC64MFUE implements the S12 CPU core with 16-bit data path, 24-bit address space, and Harvard architecture with separate instruction and data buses. It integrates a scalable CAN controller (S12MSCANV2), 16-bit timer module (TIM16B8CV1), and dual-output voltage regulator (VREG3V3V2) supporting internal 3.3 V I/O and 5 V analog supply.

Its memory subsystem includes 64 KB Flash (S12FTS64KV4), 4 KB RAM, and configurable PPAGE banking for extended addressing. Clock generation uses an internal PLL (CRGV4) with external crystal or ceramic resonator input, supporting multiple low-power modes (WAIT, STOP, Pseudo-STOP) with wake-up via CAN, timer, or interrupt sources.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture S12 16-bit CPU with 24-bit addressing, 50 MHz maximum bus speed - enables deterministic real-time execution in safety-critical automotive functions.
Flash Memory 64 KB on-chip Flash (S12FTS64KV4) with EEPROM emulation and 100K erase/write cycles - supports field firmware updates without external memory.
RAM 4 KB on-chip RAM - sufficient for real-time task stacks, CAN message buffers, and sensor data processing in embedded control loops.
CAN Interface One S12MSCANV2 module compliant with ISO 11898-1 (CAN 2.0A/B) - provides robust multi-node vehicle network communication with hardware message filtering and FIFO buffering.
ADC 8-channel 10-bit ATD10B8C with 7 µs conversion time and programmable sample-and-hold - suitable for battery voltage monitoring, temperature sensing, and throttle position feedback.
PWM 8-channel 8-bit PWM8B6CV1 with center-aligned and edge-aligned modes, dead-time insertion, and independent channel control - ideal for motor control and LED dimming in body electronics.
Package 80-pin LQFP (12 × 12 mm, 0.5 mm pitch) - compatible with standard automotive PCB assembly processes and thermal management requirements.

Pinout & Package

MC9S12GC64MFUE is housed in an 80-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, rated for –40°C to +125°C operation and qualified per AEC-Q100 Grade 2. Pin assignments follow the MC9S12GC family pinout defined in Chapter 1.3.1 of the Reference Manual (Rev 01.24).

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dual 5 V domains: VDD/VSS for digital core and I/O; VDDA/VSSA for analog peripherals - enables noise isolation between digital switching and precision ADC operation.
RESET Active-low reset input Asynchronous reset with internal pull-up; accepts external watchdog or power monitor assertion - ensures safe initialization after brownout or system fault.
BKGD Background debug serial interface Single-wire BDM interface (BKGD) with TAGHI/TAGLO optional tracing - allows in-circuit debugging and flash programming without JTAG header.
CANH / CANL CAN differential bus terminals Direct connection to ISO 11898-compliant transceiver (e.g., MC33883); supports 1 Mbit/s at 40 m - meets automotive CAN physical layer requirements.
PORTA[7:0] General-purpose I/O with interrupt capability 8-bit port with configurable pull-ups, slew rate control, and edge-triggered interrupts - used for switch inputs, status LEDs, and wake-up detection.
PORTB[7:0] General-purpose I/O with PWM/ADC multiplexing Shared with PWM outputs and ADC inputs; software-selectable function per pin - enables flexible peripheral mapping in space-constrained designs.

Key Features

Feature Design Value
Scalable CAN Controller (S12MSCANV2) Hardware message buffering (15 mailboxes), acceptance filtering, and automatic retransmission - reduces CPU load during high-traffic network events.
Background Debug Module (BDMV4) Single-wire debug interface with flash erase/program, register read/write, and breakpoint support - eliminates need for dedicated debug headers in production boards.
Dual Output Voltage Regulator (VREG3V3V2) On-chip 3.3 V I/O regulator and 5 V analog regulator from single 5 V supply - simplifies power design and improves system-level EMI performance.
Real-Time Interrupt (RTI) and COP Watchdog Configurable RTI period (0.5 ms to 1.0 s) and COP timeout (0.5 ms to 1.0 s) with windowed enable - supports ASIL-B functional safety monitoring per ISO 26262.
Low-Power STOP Mode Current draw < 10 µA with CAN wake-up enabled - extends battery life in always-on vehicle modules such as door controllers and seat memory systems.

Applications

Body Control Module (BCM) Engine Control Unit (ECU) Subsystem

Use Scenario: Centralized control of lighting, wipers, door locks, and mirrors in modern passenger vehicles.

IC Role / Device Role / Timing Role: Primary MCU managing CAN-based command arbitration, PWM-driven LED drivers, and ADC-monitored switch states.

Use Value: Integrated CAN, 8-channel PWM, and 8-channel ADC eliminate need for discrete interface ICs, reducing BOM count and PCB area by ~30% versus 8-bit alternatives.

Use Scenario: Auxiliary engine subsystem for throttle actuator control, coolant fan regulation, and diagnostic reporting.

IC Role / Device Role / Timing Role: Real-time closed-loop controller executing PID algorithms at 10 kHz using TIM16B8CV1 and ATD10B8C.

Use Value: Deterministic 50 MHz bus timing and hardware PWM dead-time insertion ensure precise motor phase alignment and prevent shoot-through faults.

Industrial Motor Drive Commercial Vehicle Telematics Gateway

Use Scenario: Compact BLDC motor controller for HVAC blowers and power steering assist in off-highway equipment.

IC Role / Device Role / Timing Role: Sensorless commutation controller using ADC current sampling, PWM output modulation, and CAN-based fault reporting.

Use Value: On-chip 3.3 V/5 V regulators and CAN PHY compatibility reduce external component count, enabling IP65-rated enclosure integration.

Use Scenario: Data aggregation node collecting J1939 messages from engine, transmission, and ABS ECUs for fleet telematics upload.

IC Role / Device Role / Timing Role: CAN gateway with message routing, filtering, and protocol translation between J1939 and proprietary CAN networks.

Use Value: Hardware mailbox filtering and 15-message FIFO minimize CPU overhead, sustaining >95% message throughput at 500 kbit/s under full bus load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S12XEP100MALR Enhanced S12X core, 1 MB Flash, dual CAN, LIN, and enhanced PWM - larger footprint (112-pin LQFP) and higher cost. Targeted at high-end powertrain and chassis control where extended memory and dual-CAN redundancy are required. Select when future scalability, LIN support, or >64 KB code space is needed; not drop-in due to pinout and voltage regulator differences.
S9S12G64F0MLF NXP's pin-compatible S12G successor with same 80-pin LQFP, 64 KB Flash, but added EEPROM, improved ADC linearity, and enhanced BDM security. Drop-in replacement for new designs requiring longer product lifecycle, AEC-Q100 Grade 1 qualification, or secure boot features. Preferred for new designs seeking long-term availability and enhanced diagnostics; requires minor software adaptation for EEPROM and security registers.

Compared with MC9S12GC64MFUE, MC9S12XEP100MALR offers greater memory and peripheral integration at the cost of layout redesign, while S9S12G64F0MLF delivers true pin-to-pin compatibility with upgraded reliability and embedded EEPROM - making it the optimal migration path for volume production continuity.

Availability

MC9S12GC64MFUE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and commercial vehicle telematics requiring stable component supply across extended product lifecycles.

Supply support for MC9S12GC64MFUE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in microcontrollers and secure connectivity.

The MC9S12GC family was engineered specifically for cost-sensitive automotive body control and industrial automation applications, balancing performance, integration, and AEC-Q100 compliance in a compact 80-pin package.

FAQ

What is the maximum operating frequency of the MC9S12GC64MFUE?

The MC9S12GC64MFUE operates with a maximum bus clock frequency of 50 MHz, achieved via its internal PLL (CRGV4) locked to an external crystal or ceramic resonator. This frequency governs instruction execution, peripheral timing, and CAN bit rate generation. The S12 CPU core executes instructions at one bus cycle per instruction for most operations, delivering predictable real-time performance critical for automotive control loops. The MC9S12GC64MFUE datasheet specifies this limit under all valid VDD and temperature conditions.

Does the MC9S12GC64MFUE support CAN FD?

No, the MC9S12GC64MFUE implements the S12MSCANV2 module, which is compliant only with ISO 11898-1 (Classical CAN 2.0A/B) up to 1 Mbit/s. It does not support CAN FD features such as flexible data-rate, extended data length, or CRC enhancements. For CAN FD capability, designers should consider NXP's S32K1xx or newer S12ZVM families. The MC9S12GC64MFUE remains widely deployed in legacy and cost-optimized CAN networks where Classical CAN suffices.

What debug interface does the MC9S12GC64MFUE use?

The MC9S12GC64MFUE uses the Background Debug Module (BDMV4) with a single-wire BKGD interface, supported by standard Freescale/NXP BDM debuggers (e.g., USB-ML-12). It does not include JTAG or SWD. Debug capabilities include flash programming, register inspection, memory read/write, and hardware breakpoints. The BKGD pin also supports optional TAGHI/TAGLO instruction tracing. This interface is fully documented in Chapter 6 of the MC9S12GC Family Reference Manual (Rev 01.24).

Is the MC9S12GC64MFUE pin-compatible with other MC9S12GC variants?

Yes, the MC9S12GC64MFUE shares the identical 80-pin LQFP package and pinout with other MC9S12GC family members including MC9S12GC32MFUE and MC9S12GC128MFUE. Differences are limited to Flash/RAM size and certain fuse-configured features - allowing hardware reuse across variants. However, software must be validated for memory map and peripheral enable settings specific to each part. This compatibility is confirmed in Appendix D (Derivative Differences) and Appendix C (Package Information) of the reference manual.

What is the qualified temperature range for the MC9S12GC64MFUE?

The MC9S12GC64MFUE is qualified for operation from –40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 2 requirements for automotive applications. This rating applies to the full electrical specification, including Flash endurance, ADC accuracy, and CAN timing margins. The device uses automotive-grade packaging (80-pin LQFP with moisture sensitivity level 3) and undergoes rigorous qualification testing per JEDEC standards. Full thermal derating curves and test conditions are provided in Appendix A (Electrical Characteristics) of the reference manual.

MC9S12GC64MFUE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
80-QFP
Series:
HCS12
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12GC64MFUE FAQ

1.How can I place an order for MC9S12GC64MFUE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12GC64MFUE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12GC64MFUE reliable?

The price and inventory of MC9S12GC64MFUE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12GC64MFUE is usually 5 days.

3.What payment methods are accepted for MC9S12GC64MFUE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12GC64MFUE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S12GC64MFUE?

MC9S12GC64MFUE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12GC64MFUE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12GC64MFUE?

For technical support, including MC9S12GC64MFUE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12GC64MFUE requirements.

6.How does Aetrix verify that MC9S12GC64MFUE is sourced from the original manufacturer or authorized distributors?

All MC9S12GC64MFUE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12GC64MFUE meets industry standards.

7.What is the process for return or replacement of MC9S12GC64MFUE?

All MC9S12GC64MFUE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12GC64MFUE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12GC64MFUE part is unused and in its original packaging.

Return procedure for MC9S12GC64MFUE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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