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NXP Semiconductors MC9S12GC64MPBE
- Part No.:
- MC9S12GC64MPBE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 52-LQFP
- Datasheet:
-
MC9S12GC64MPBE.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 52TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,041
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Product details
Overview
MC9S12GC64MPBE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 64 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0A/B controller, PWM, 10-bit 8-channel ADC, and BDM debug interface. It operates at up to 25 MHz core frequency with internal PLL clock generation and supports automotive-grade temperature range (−40°C to +125°C) in a 52-pin LQFP package.
For engineers reviewing the MC9S12GC64MPBE datasheet, MC9S12GC64MPBE pinout, MC9S12GC64MPBE application, or MC9S12GC64MPBE equivalent, key selection criteria include its S12 CPU core architecture, CAN bus timing compliance, flash endurance (10k write/erase cycles), low-power STOP/WAIT modes, and legacy automotive software toolchain compatibility (CodeWarrior IDE, P&E Multilink).
Technical Context
The MC9S12GC64MPBE implements the HCS12 CPU12 core with 16-bit data path, 24-bit address space, and instruction set backward-compatible with HC12. It integrates a scalable CAN controller (S12MSCANV2) supporting bit rates up to 1 Mbps, with message buffering, acceptance filtering, and automatic retransmission.
Its clock system includes a PLL-based CRG module (CRGV4) generating core, bus, and peripheral clocks from external crystal (1–8 MHz) or ceramic resonator, with built-in clock monitor and COP watchdog. The device uses a unified memory map with banked paging (PPAGE register) for extended addressing beyond 64 KB.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 CPU12 - 16-bit CISC core with 24-bit addressing, enabling direct access to full 16 MB memory space via PPAGE banking. |
| Flash Memory | 64 KB on-chip Flash (S12FTS64KV4) - supports in-circuit programming, 10k erase/write cycles, and 100 µs typical byte write time. |
| RAM | 4 KB on-chip SRAM - used for stack, variables, and runtime buffers; retains data in WAIT mode with VREG enabled. |
| CAN Interface | S12MSCANV2 module - fully compliant with ISO 11898-1, supports 1 Mbps bit rate, 15 message buffers, and hardware ID filtering. |
| ADC | ATD10B8C - 10-bit, 8-channel SAR ADC with 8 µs conversion time, configurable sample-and-hold, and 0–5 V input range (VRL=0 V, VRH=5 V). |
| Operating Temperature | −40°C to +125°C - qualified for under-hood automotive applications per AEC-Q100 Grade 1 requirements. |
| Package | 52-pin LQFP (MPBE suffix) - 10 mm × 10 mm body, 0.5 mm pitch, thermally enhanced for conduction cooling in motor control modules. |
Pinout & Package
MC9S12GC64MPBE is housed in a 52-pin LQFP (Leadless Quad Flat Package) with exposed thermal pad. Pin assignments follow the MC9S12GC family standard: Port A (8-bit), Port B (8-bit), Port E (8-bit), Port P (8-bit), and dedicated CANRX/CANTX, BKGD, RESET, and oscillator pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input | Asynchronous reset assertion forces CPU into initialization sequence; internal pull-up ensures safe startup without external resistor. |
| BKGD | Background debug serial I/O | Single-wire BDM interface for non-intrusive debugging, flash programming, and real-time register inspection during development. |
| CANRX / CANTX | CAN physical layer interface | Differential receiver and transmitter pins compatible with ISO 11898-2 transceivers; require external 120 Ω termination at network ends. |
| XTAL / EXTAL | Crystal oscillator connection | Drives internal OSCV2 module; supports 1–8 MHz fundamental-mode crystals for stable clock source with ±50 ppm tolerance. |
| VDD, VSS | Main power supply | 5.0 V ±10% operation; dual VDD/VSS pairs (VDD1/VSS1, VDD2/VSS2) reduce noise coupling between analog and digital sections. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0A/B Controller | Enables robust, deterministic communication in distributed automotive ECUs without external protocol ICs or software stack overhead. |
| Background Debug Module (BDM) | Eliminates need for JTAG adapter; allows full flash erase/program, breakpoint insertion, and register read/write via single BKGD pin. |
| PWM with Complementary Outputs | 8-channel PWM8B6CV1 module supports center-aligned and edge-aligned modes, dead-time insertion, and fault protection for motor drive inverters. |
| Dual Voltage Regulator (VREG) | On-chip 3.3 V regulator powers internal logic and ADC reference; reduces external component count and improves supply noise immunity. |
| Low-Power STOP Mode | Current draw <10 µA with RTC running; wake-up via CAN message, interrupt, or reset - critical for battery-powered telematics modules. |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) Subsystem |
|---|---|
Use Scenario: Centralized vehicle lighting, door lock, window lift, and wiper control with LIN/CAN gateway functionality. IC Role / Device Role / Timing Role: Main MCU executing real-time state machines, managing CAN message routing, and driving discrete outputs via GPIO/PWM. Use Value: Integrated CAN and 64 KB Flash enable firmware updates over CAN and support for evolving OEM feature sets without hardware change. |
Use Scenario: Throttle actuator control, idle speed regulation, and sensor signal conditioning in non-critical engine subsystems. IC Role / Device Role / Timing Role: Dedicated subsystem controller interfacing with potentiometers, Hall sensors, and brushed DC motors via ADC and PWM. Use Value: 10-bit ADC resolution and 25 MHz core ensure precise closed-loop position control with <100 µs loop latency. |
| Two-Wheeler Instrument Cluster | Industrial Motor Drive Interface |
Use Scenario: Digital speedometer, fuel gauge, and warning light management for scooters and motorcycles with CAN-connected ABS modules. IC Role / Device Role / Timing Role: Display controller receiving CAN frames from engine and chassis nodes; drives segmented LCD via GPIO and SPI peripherals. Use Value: −40°C to +125°C rating and 52-pin LQFP package ensure reliability in unshrouded, vibration-prone environments. |
Use Scenario: Field-oriented control (FOC) interface board translating commands from host PLC to 3-phase inverter gate drivers. IC Role / Device Role / Timing Role: Real-time PWM generator synchronizing six output channels with ADC-sampled current feedback and encoder inputs. Use Value: Hardware PWM dead-time insertion and CAN-based command reception eliminate timing jitter in safety-critical motion control loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12GC32MPBE | 32 KB Flash, same 52-pin LQFP package and peripheral set; identical pinout and register mapping. | Reduced firmware footprint requirement; suitable for cost-sensitive applications with static code size ≤28 KB. | Select when application logic fits within 32 KB Flash and no future feature expansion is planned. |
| S912XDG128F0MLH | Enhanced XGATE co-processor, 128 KB Flash, 8 KB RAM; pin-compatible but requires updated BDM firmware and linker scripts. | Higher throughput for CAN message filtering and math-intensive tasks; supports AUTOSAR OS abstraction layer. | Choose for new designs requiring >64 KB code space or offloading ISR processing from main CPU. |
Compared with MC9S12GC64MPBE, the MC9S12GC32MPBE offers identical peripheral functionality at lower memory density and cost, while the S912XDG128F0MLH provides architectural scalability via XGATE and larger memory - both require no PCB redesign but differ in toolchain and qualification effort.
Availability
MC9S12GC64MPBE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control interfaces, and two-wheeler instrument clusters requiring stable component supply across extended product lifecycles.
Supply support for MC9S12GC64MPBE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in automotive microcontrollers dating to Motorola's 1980s HC11 lineage.
The MC9S12GC family was designed specifically for cost-optimized, high-reliability automotive sub-systems - delivering CAN, PWM, and ADC integration in a single die while maintaining full CodeWarrior IDE and legacy toolchain compatibility.
FAQ
What is the maximum operating frequency of the MC9S12GC64MPBE?
The MC9S12GC64MPBE achieves a maximum core frequency of 25 MHz using its internal PLL, which multiplies an external 4–8 MHz crystal input. Bus clock runs at half-core speed (12.5 MHz), and peripheral clocks are derived via programmable dividers. This frequency is validated across the full −40°C to +125°C temperature range and 4.5–5.5 V supply.
Does the MC9S12GC64MPBE support in-circuit debugging without external hardware?
Yes, the MC9S12GC64MPBE includes a Background Debug Module (BDM) that enables full in-circuit debugging via a single BKGD pin. Using standard BDM firmware and a P&E Multilink or compatible debugger, engineers can perform flash programming, real-time variable inspection, and breakpoint execution - all without JTAG header or external debug circuitry.
What are the key differences between MC9S12GC64MPBE and MC9S12C128?
The MC9S12GC64MPBE belongs to the GC family (optimized for cost-sensitive automotive), while MC9S12C128 is part of the higher-end C family. Key differences include reduced Flash (64 KB vs. 128 KB), omission of external bus interface (MEBI), and simplified memory mapping - but identical CPU core, CAN module, and peripheral register layout. Both share the same BDM protocol and CodeWarrior toolchain support.
Is the MC9S12GC64MPBE qualified for automotive applications?
Yes, the MC9S12GC64MPBE is AEC-Q100 Grade 1 qualified (−40°C to +125°C), with manufacturing traceability, failure-in-time (FIT) data, and stress test reports available from NXP. Its design includes automotive-specific features: CAN bus fault tolerance, voltage supervisor with hysteresis, and ESD protection exceeding 2 kV HBM - making it suitable for body control, chassis, and powertrain subsystems.
Can the MC9S12GC64MPBE operate from a 3.3 V supply?
No, the MC9S12GC64MPBE requires a nominal 5.0 V ±10% supply (4.5–5.5 V). Its internal 3.3 V regulator (VREG3V3V2) powers only internal logic and ADC reference - it is not intended as an output supply. External 3.3 V peripherals must be powered separately; level-shifting is required for interfacing with 3.3 V I/O devices.
MC9S12GC64MPBE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 52-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- EBI/EMI, SCI, SPI
- Peripherals:
- POR, PWM, WDT
- Number of I/O:
- 35
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12GC64MPBE FAQ
1.How can I place an order for MC9S12GC64MPBE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12GC64MPBE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12GC64MPBE reliable?
The price and inventory of MC9S12GC64MPBE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12GC64MPBE is usually 5 days.
3.What payment methods are accepted for MC9S12GC64MPBE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12GC64MPBE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12GC64MPBE?
MC9S12GC64MPBE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12GC64MPBE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12GC64MPBE?
For technical support, including MC9S12GC64MPBE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12GC64MPBE requirements.
6.How does Aetrix verify that MC9S12GC64MPBE is sourced from the original manufacturer or authorized distributors?
All MC9S12GC64MPBE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12GC64MPBE meets industry standards.
7.What is the process for return or replacement of MC9S12GC64MPBE?
All MC9S12GC64MPBE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12GC64MPBE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12GC64MPBE part is unused and in its original packaging.
Return procedure for MC9S12GC64MPBE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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