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NXP Semiconductors MC9S12GC96MFAE

Part No.:
MC9S12GC96MFAE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixMC9S12GC96MFAE.pdf
Description:
IC MCU 16BIT 96KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,250

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Product details

Overview

MC9S12GC96MFAE from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 96 KB on-chip Flash memory, 4 KB RAM, and integrated CAN 2.0A/B controller. It operates at up to 25 MHz core frequency with a 5V tolerant I/O interface and supports background debug via single-wire BKGD pin. It targets automotive body control modules requiring robust real-time control, sensor interfacing, and CAN network communication.

For engineers reviewing the MC9S12GC96MFAE datasheet, MC9S12GC96MFAE pinout, MC9S12GC96MFAE application, or MC9S12GC96MFAE equivalent, key selection criteria include its 80-pin LQFP package, 96 KB Flash/4 KB RAM memory configuration, integrated MSCAN module, 10-bit 8-channel ADC, and support for BDM-based in-circuit debugging without external JTAG hardware.

Technical Context

The MC9S12GC96MFAE implements the S12 CPU core with 16-bit data path and 24-bit address bus, executing instructions in single-cycle or multi-cycle modes depending on addressing. Its memory map includes paged Flash and RAM, managed by PPAGE and RPAGE registers, enabling code banking beyond 64 KB linear space.

It integrates a full-featured Scalable Controller Area Network (S12MSCANV2) module compliant with ISO 11898-1, supporting both standard and extended frames, programmable bit timing, and three dedicated message buffers. Clock generation uses a PLL-based system with selectable oscillator modes (crystal, ceramic resonator, or external clock), and reset management includes power-on, low-voltage, and watchdog-triggered sources.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture S12 16-bit CPU with 24-bit addressing, enabling >64 KB memory access via paging
Flash Memory 96 KB on-chip Flash (S12FTS96KV1 module), supporting in-application programming and EEPROM emulation
RAM 4 KB on-chip RAM, mapped in zero-page and general-purpose regions for fast variable access
CAN Interface Integrated S12MSCANV2 controller with three message buffers, bit-rate up to 1 Mbps, and full ISO 11898-1 compliance
ADC 10-bit, 8-channel ATD10B8C converter with configurable sample-and-hold, scan mode, and interrupt-on-conversion
Debug Interface Background Debug Module (BDMV4) with single-wire BKGD pin, enabling flash programming and real-time debugging without JTAG
Package 80-pin LQFP (12 × 12 mm, 0.5 mm pitch), RoHS-compliant, with dedicated VDD/VSS pairs for analog/digital domains

Pinout & Package

MC9S12GC96MFAE is housed in an 80-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, optimized for automotive PCB layouts requiring EMI resilience and thermal stability. Pin functions follow HCS12 family conventions with multiplexed I/O, dedicated CANH/CANL differential pair, and separate analog/digital supply pins.

Pin/Terminal Circuit Role Design Meaning
BKGD Background Debug Data Single-wire serial interface for BDM programming, debugging, and flash erase - requires pull-up resistor and no external transceiver
CANH / CANL CAN Bus Differential Pair Direct connection to ISO 11898-compliant physical layer; supports 120 Ω termination and common-mode choke integration
RESET Active-Low Reset Input Asynchronous reset assertion clears CPU registers and initializes peripheral modules; debounced externally or via internal LVI circuit
XTAL / EXTAL Crystal Oscillator Inputs Supports 4–8 MHz fundamental-mode crystals; enables PLL multiplication to 25 MHz system clock with stable jitter performance
VDDA / VSSA Analog Power Supply Dedicated 5 V analog domain for ADC reference and oscillator circuitry - must be filtered separately from digital VDD

Key Features

Feature Design Value
On-chip Flash with EEPROM Emulation 96 KB Flash supports wear-leveling algorithms and data retention >10 years; enables field firmware updates without external nonvolatile memory
Integrated CAN 2.0B Controller S12MSCANV2 provides hardware message filtering, automatic retransmission, and error confinement - reduces host CPU load in automotive networks
10-bit 8-Channel ADC with Trigger Flexibility ATD10B8C supports software, timer, or external trigger initiation; 8 µs conversion time at 25 MHz bus speed enables real-time sensor sampling
Background Debug via Single Wire BDMV4 eliminates need for JTAG header or boundary-scan infrastructure - simplifies production test and field diagnostics
Low-Power STOP/WAIT Modes STOP mode draws <10 µA typical; wake-up sources include CAN activity, external interrupt, or RTI - extends battery life in always-on modules

Applications

Body Control Module Door Module

Use Scenario: Centralized control of lighting, window lifts, mirror adjustment, and door lock actuators in passenger vehicles.

IC Role / Device Role / Timing Role: Main system controller executing real-time PWM for motor drives, polling switches, and managing CAN messages with other ECUs.

Use Value: Integrated 96 KB Flash stores complex logic and calibration tables; MSCAN handles priority-based message arbitration without CPU overhead.

Use Scenario: Local intelligence in vehicle door assemblies for anti-pinch detection, keyless entry response, and status reporting.

IC Role / Device Role / Timing Role: Sensor fusion hub processing Hall-effect and potentiometer inputs while driving brushed DC motors via PWM outputs.

Use Value: 10-bit ADC resolves position feedback with ±1 LSB accuracy; BDM debug port enables post-deployment firmware patching.

Seat Control Unit Roof Module

Use Scenario: Motorized seat adjustment with memory presets, heating element control, and occupant detection integration.

IC Role / Device Role / Timing Role: Real-time coordinator of multi-axis motion profiles, thermal monitoring, and CAN-based seat position synchronization.

Use Value: 4 KB RAM accommodates multiple seat position buffers and PID loop variables; dual VDDA/VDD separation ensures ADC stability during motor commutation noise.

Use Scenario: Sunroof, panoramic roof, and interior lighting control with rain sensor input and ambient light adaptation.

IC Role / Device Role / Timing Role: Event-driven controller responding to LIN/CAN commands, managing stepper motor sequencing, and dimming LED arrays.

Use Value: 80-pin LQFP provides sufficient I/O for motor drivers, sensors, and communication interfaces; STOP mode enables ultra-low standby current during vehicle sleep.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S12GC64MFAE 64 KB Flash, 4 KB RAM, identical peripheral set and pinout Lower firmware footprint requirement; suitable for cost-sensitive modules with fixed feature sets Select when application code size remains under 64 KB and future feature expansion is unlikely
S9S12G128F0MLH NXP's pin-compatible successor with 128 KB Flash, enhanced CAN FD readiness, and updated BDM protocol Supports longer-term design continuity and higher bandwidth communication in next-gen platforms Choose for new designs requiring extended memory headroom and roadmap alignment with S12G series evolution

Compared with MC9S12GC64MFAE, the MC9S12GC96MFAE provides 32 KB additional Flash for larger application logic or OTA update partitions; versus S9S12G128F0MLH, it lacks CAN FD but offers proven qualification for legacy automotive programs with mature toolchain support.

Availability

MC9S12GC96MFAE is available at Aetrix Electronics and suitable for automotive body electronics, industrial control panels, and embedded CAN gateway applications requiring stable component supply across long product lifecycles.

Supply support for MC9S12GC96MFAE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in microcontrollers and automotive-grade reliability.

The MC9S12GC96MFAE belongs to the HCS12GC family - engineered specifically for cost-optimized automotive body electronics where functional safety (ASIL-B capable via system-level design), CAN networking, and long-term supply stability are critical.

FAQ

What is the maximum operating frequency of the MC9S12GC96MFAE?

The MC9S12GC96MFAE achieves a maximum core frequency of 25 MHz using its internal PLL, which multiplies an external 4–8 MHz crystal input. This yields a 50 MHz bus clock in certain configurations, though the standard rated bus speed is 25 MHz for guaranteed timing compliance across temperature and voltage ranges. The MC9S12GC96MFAE datasheet specifies AC electrical characteristics up to this speed.

Does the MC9S12GC96MFAE support CAN FD?

No, the MC9S12GC96MFAE integrates the S12MSCANV2 module, which supports only Classical CAN (ISO 11898-1) up to 1 Mbps. It does not implement CAN FD features such as flexible data-rate, extended data length, or CRC enhancements. For CAN FD capability, designers should consider NXP's later S12Z or S32K families. The MC9S12GC96MFAE remains fully compatible with existing CAN 2.0A/B networks.

How is debugging performed on the MC9S12GC96MFAE?

Debugging is implemented via the Background Debug Module (BDMV4) using the single-wire BKGD pin, eliminating the need for JTAG headers or external debug probes. The MC9S12GC96MFAE supports flash programming, register inspection, breakpoint insertion, and real-time variable monitoring through standard BDM firmware commands. This interface operates at TTL levels and requires only a simple level-shifter for USB-to-BKGD adapters.

What are the power supply requirements for the MC9S12GC96MFAE?

The MC9S12GC96MFAE requires two independent 5 V supplies: VDD (digital core and I/O) and VDDA (analog subsystem including ADC and oscillator). VDDA must be filtered separately with ≥10 µF ceramic + 1 µF tantalum capacitance near the pin to ensure ADC accuracy and oscillator stability. The MC9S12GC96MFAE specifies operation from 4.5 V to 5.5 V with total supply current up to 100 mA in active mode.

Is the MC9S12GC96MFAE qualified for automotive applications?

Yes, the MC9S12GC96MFAE is AEC-Q100 qualified for Grade 2 (−40 °C to +105 °C) operation and designed to meet automotive EMC and reliability standards. It includes built-in features such as clock monitor, COP watchdog, low-voltage detection, and ESD protection aligned with ISO 11452 and ISO 7637 requirements. The MC9S12GC96MFAE has been widely deployed in production automotive body control units since its introduction.

MC9S12GC96MFAE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12GC96MFAE FAQ

1.How can I place an order for MC9S12GC96MFAE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12GC96MFAE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12GC96MFAE reliable?

The price and inventory of MC9S12GC96MFAE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12GC96MFAE is usually 5 days.

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MC9S12GC96MFAE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12GC96MFAE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12GC96MFAE?

For technical support, including MC9S12GC96MFAE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12GC96MFAE requirements.

6.How does Aetrix verify that MC9S12GC96MFAE is sourced from the original manufacturer or authorized distributors?

All MC9S12GC96MFAE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12GC96MFAE meets industry standards.

7.What is the process for return or replacement of MC9S12GC96MFAE?

All MC9S12GC96MFAE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12GC96MFAE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12GC96MFAE part is unused and in its original packaging.

Return procedure for MC9S12GC96MFAE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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