NXP Semiconductors MC9S12GC96MPBE
- Part No.:
- MC9S12GC96MPBE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 52-LQFP
- Datasheet:
-
MC9S12GC96MPBE.pdf
- Description:
- IC MCU 16BIT 96KB FLASH 52TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,057
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Product details
Overview
MC9S12GC96MPBE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 96 KB on-chip Flash, 4 KB RAM, and a 25 MHz bus speed. It integrates CAN 2.0A/B controller, 10-bit 8-channel ADC, 8-channel PWM, and background debug module (BDM). Designed for automotive body electronics and industrial control, it operates across –40°C to +105°C with 5 V supply.
For engineers reviewing the MC9S12GC96MPBE datasheet, MC9S12GC96MPBE pinout, MC9S12GC96MPBE application, or MC9S12GC96MPBE equivalent, key selection criteria include its 80-pin LQFP package, S12 CPU core, integrated MSCAN interface, Flash reprogrammability in-system, and qualification for automotive temperature and EMC requirements.
Technical Context
The MC9S12GC96MPBE implements the S12 CPU core with 16-bit data path, 24-bit address space, and Harvard architecture. It supports multiple low-power modes (WAIT/STOP), includes a PLL-based clock generator with selectable dividers, and features memory protection via security byte and BDM lock.
Its peripheral set includes a scalable CAN controller (MSCAN), 16-bit timer module (TIM), serial communication interfaces (SCI, SPI), and analog subsystem with internal voltage reference and sample-and-hold. All modules are memory-mapped and accessible via standard register reads/writes without external glue logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S12 16-bit CPU with 24-bit addressing and 16 MB linear address space |
| Flash Memory | 96 KB on-chip Flash with in-circuit programmability and 100K erase/write cycles |
| RAM | 4 KB on-chip RAM with retention in STOP mode |
| Max Bus Frequency | 25 MHz - determines instruction throughput and peripheral timing margins |
| CAN Interface | One S12MSCANV2 module supporting CAN 2.0A/B protocol with 15 message buffers |
| ADC | 10-bit ATD10B8C with 8 input channels, 8 µs conversion time, and configurable sample rate |
| PWM | 8-channel PWM8B6CV1 with independent duty-cycle and period control per channel |
| Operating Temperature | –40°C to +105°C - qualified for under-hood automotive applications |
Pinout & Package
MC9S12GC96MPBE is housed in an 80-pin LQFP (12 × 12 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions follow the MC9S12GC family signal mapping defined in Chapter 1.3.1 of the Reference Manual (Rev 01.24).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5 V supply domains (VDD1/VDD2) with separate analog/digital grounds for noise isolation |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; initiates cold start or recovery from fault condition |
| BKGD | Background debug interface | Single-wire BDM interface for programming, breakpointing, and real-time register access |
| RX/TX (SCI) | Serial communication I/O | Full-duplex UART interface supporting LIN physical layer compliance at 19.2 kbps |
| CANH/CANL | CAN differential bus interface | Direct connection to ISO 11898-compliant transceiver; supports high-speed (1 Mbps) operation |
| AD0–AD7 | Analog input channels | Eight multiplexed inputs shared with port pins; support single-ended or differential acquisition |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash security | Programmable security byte prevents unauthorized read-out of Flash contents via BDM |
| Integrated voltage regulator | VREG3V3V2 provides regulated 3.3 V for internal logic, reducing external component count |
| Flexible clock generation | CRGV4 supports crystal, ceramic resonator, or external clock input with PLL multiplication up to 50 MHz core clock |
| Hardware COP watchdog | Computer Operating Properly timer with windowed enable/disable prevents runaway code execution |
| Low-power STOP mode | Current draw < 10 µA with RAM retention and wake-up via interrupt or reset - extends battery life |
| Emulation support | BDMV4 enables real-time debugging without ICE hardware; supports instruction tracing and tagging |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) Subsystem |
|---|---|
Use Scenario: Centralized management of lighting, door locks, wipers, and HVAC in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing real-time control tasks, coordinating CAN messages with other ECUs, and managing analog sensor inputs (e.g., ambient temperature, humidity). Use Value: Integrated MSCAN and 10-bit ADC eliminate need for discrete CAN transceivers and external A/D converters, reducing BOM cost and PCB area. |
Use Scenario: Secondary control node monitoring throttle position, coolant temperature, and fan speed in non-critical engine subsystems. IC Role / Device Role / Timing Role: Standalone timing-critical controller interfacing with potentiometers, thermistors, and PWM-driven cooling fans. Use Value: 25 MHz bus speed ensures sub-100 µs response to sensor events; 8-channel PWM enables precise fan speed regulation. |
| Industrial Motor Drive Interface | Commercial HVAC Controller |
Use Scenario: Closed-loop motor control in conveyor systems using hall-effect feedback and current sensing. IC Role / Device Role / Timing Role: Real-time motion controller generating synchronized PWM outputs while sampling analog current and position signals. Use Value: Hardware timer capture/compare registers and dedicated PWM module allow deterministic timing without CPU intervention. |
Use Scenario: Zone-based climate control in office buildings with multi-sensor input and damper actuation. IC Role / Device Role / Timing Role: System coordinator collecting temperature/humidity data over I²C/SPI, running PID algorithms, and driving stepper motors via GPIO/PWM. Use Value: 4 KB RAM supports multiple concurrent PID loops; Flash endurance allows field firmware updates over CAN. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12GC64MPBE | 64 KB Flash, same 80-pin LQFP package and peripheral set | Lower memory capacity limits complex state machines or large lookup tables | Select when application firmware fits within 64 KB and cost sensitivity outweighs future scalability needs |
| S9S12G128F0MLH | NXP's newer S12G derivative with 128 KB Flash, enhanced CAN FD readiness, and improved ESD rating | Not pin-compatible; requires PCB redesign but offers extended lifecycle and toolchain support | Choose for new designs requiring longer product support, higher Flash margin, or migration path toward CAN FD |
Compared with MC9S12GC96MPBE, the MC9S12GC64MPBE reduces Flash by 32 KB while maintaining identical peripherals and package - suitable for cost-optimized legacy upgrades; the S9S12G128F0MLH increases Flash and adds CAN FD preparation but requires layout changes and updated software abstraction layers.
Availability
MC9S12GC96MPBE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and commercial HVAC systems requiring stable component supply, long-term availability, and AEC-Q100-aligned reliability.
Supply support for MC9S12GC96MPBE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors develops high-reliability microcontrollers for automotive, industrial, and IoT applications, with deep expertise in safety-critical embedded systems and functional safety (ISO 26262).
The MC9S12GC family was designed for cost-sensitive automotive body electronics and industrial control applications where robustness, CAN integration, and extended temperature operation are mandatory.
FAQ
What is the maximum operating frequency of the MC9S12GC96MPBE?
The MC9S12GC96MPBE supports a maximum bus frequency of 25 MHz, achieved via its internal PLL clock generator. This corresponds to a 50 MHz core clock when using a 2× PLL multiplier. The actual system performance depends on memory wait states and peripheral clock dividers configured in the CRG module. MC9S12GC96MPBE maintains timing integrity across its full –40°C to +105°C operating range.
Does the MC9S12GC96MPBE support in-circuit debugging?
Yes, the MC9S12GC96MPBE includes a Background Debug Module (BDMV4) accessible through the BKGD pin. This enables full in-circuit programming, real-time register inspection, breakpoint setting, and instruction tracing without requiring external JTAG hardware. MC9S12GC96MPBE supports both single-wire BDM communication and optional TAGHI/TAGLO pins for advanced trace capabilities.
Is the MC9S12GC96MPBE qualified for automotive applications?
Yes, the MC9S12GC96MPBE is manufactured and tested to meet AEC-Q100 Grade 2 requirements (–40°C to +105°C ambient), with design features including enhanced ESD protection, built-in clock monitor, COP watchdog, and Flash security. MC9S12GC96MPBE is widely deployed in production automotive body control modules and meets ISO/TS 16949 manufacturing standards.
Can the MC9S12GC96MPBE operate without an external crystal?
Yes, the MC9S12GC96MPBE can operate using an external clock source applied to the EXTAL pin, or with an internal RC oscillator during initialization. However, for production use with CAN or precise timing, an external crystal (typically 4–8 MHz) is required to feed the PLL for stable, low-jitter system clocks. MC9S12GC96MPBE's OSCV2 module supports crystal, ceramic resonator, or external clock input configurations.
What development tools are supported for the MC9S12GC96MPBE?
MC9S12GC96MPBE is supported by NXP's CodeWarrior Development Studio for HCS12 (v5.1+), S32DS for S12 (legacy mode), and open-source tools like GNU GCC for S12 with appropriate linker scripts. Evaluation boards such as the DEMO9S12GC family provide hardware reference designs, CAN transceivers, and BDM interfaces. MC9S12GC96MPBE firmware can be programmed via BDM using P&E Micro or Segger J-Link adapters with S12 firmware add-ons.
MC9S12GC96MPBE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 52-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- EBI/EMI, SCI, SPI
- Peripherals:
- POR, PWM, WDT
- Number of I/O:
- 35
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12GC96MPBE FAQ
1.How can I place an order for MC9S12GC96MPBE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12GC96MPBE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12GC96MPBE reliable?
The price and inventory of MC9S12GC96MPBE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12GC96MPBE is usually 5 days.
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4.How is shipping managed for MC9S12GC96MPBE?
MC9S12GC96MPBE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12GC96MPBE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12GC96MPBE?
For technical support, including MC9S12GC96MPBE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12GC96MPBE requirements.
6.How does Aetrix verify that MC9S12GC96MPBE is sourced from the original manufacturer or authorized distributors?
All MC9S12GC96MPBE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12GC96MPBE meets industry standards.
7.What is the process for return or replacement of MC9S12GC96MPBE?
All MC9S12GC96MPBE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12GC96MPBE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12GC96MPBE part is unused and in its original packaging.
Return procedure for MC9S12GC96MPBE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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