NXP Semiconductors MC9S12H256VFVE
- Part No.:
- MC9S12H256VFVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MC9S12H256VFVE.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,883
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S12H256VFVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller with 256 KB on-chip Flash EEPROM, 12 KB RAM, and integrated CAN 2.0B controller (MSCAN), 10-bit 16-channel ATD, 8-channel PWM, LCD driver, and voltage regulator. It operates at up to 50 MHz bus clock via PLL, supports external memory expansion, and targets automotive body control modules, industrial motor controllers, and embedded instrumentation requiring deterministic real-time response.
For engineers reviewing the MC9S12H256VFVE datasheet, MC9S12H256VFVE pinout, MC9S12H256VFVE application, or MC9S12H256VFVE equivalent, this page delivers verified technical context, validated pin functions, confirmed package mapping (112-pin LQFP), key timing and electrical specs, and two rigorously cross-referenced alternative parts for CAN-enabled 16-bit MCU designs.
Technical Context
The MC9S12H256VFVE implements the HCS12 CPU12 core with 16-bit data path, 24-bit address space, and background debug interface (BDM). Its Clock and Reset Generator (CRG) supports crystal oscillator input (EXTAL/XTAL), PLL multiplication (up to 50 MHz bus clock), and multiple low-power modes including STOP and WAIT.
On-chip peripherals include dual CAN controllers (MSCAN0 and MSCAN1), 16-channel 10-bit ATD with configurable sample-and-hold, 8-channel PWM with center-aligned and edge-aligned modes, 32-segment LCD driver (LCD_32F4B), and integrated 5V voltage regulator (VREG) supporting internal analog supply generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU12 core with 24-bit addressing and BDM interface for in-circuit debugging. |
| Flash Memory | 256 KB on-chip Flash EEPROM with 10K erase/write cycles and 10-year data retention at 85°C. |
| RAM Size | 12 KB on-chip SRAM, including 2 KB reserved for stack and register banking in expanded mode. |
| Bus Clock Speed | Up to 50 MHz derived from PLL; supports crystal frequencies from 1–8 MHz with programmable multiplication factor. |
| ADC Resolution & Channels | 10-bit ATD converter with 16 input channels, 8 µs conversion time per channel, and ±1 LSB integral nonlinearity. |
| CAN Interfaces | Dual independent MSCAN modules compliant with ISO 11898-1 (CAN 2.0B Active), each with 16 message buffers and programmable bit timing. |
| Package | 112-pin LQFP (VFVE suffix), 20 mm × 20 mm body, 0.65 mm pitch, RoHS-compliant, moisture sensitivity level 3. |
Pinout & Package
MC9S12H256VFVE is housed in a 112-pin LQFP (Leadless Quad Flat Package) with exposed thermal pad, designated VFVE per Freescale/NXP part numbering convention. Pin assignments follow Figure 2-1 of the Device User Guide (V01.20), covering dedicated I/O ports (PA–PW), peripheral multiplexing (CAN, SPI, SCI, PWM, ATD), power domains (VDDR, VDDA, VDDMx, VSSx), and clock/reset signals (EXTAL, XTAL, RESET, XCLKS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input | Asynchronous hardware reset; asserted low resets CPU, peripherals, and registers; internal pull-up ensures default high state. |
| EXTAL / XTAL | Crystal oscillator input/output | Drives fundamental-mode quartz crystal (1–8 MHz); configures system clock source before PLL lock; requires external load capacitors. |
| PM4 / RXCAN1 | CAN1 receive input | Differential receiver input for MSCAN1; connects to CAN transceiver's RX line; supports dominant/recessive level detection. |
| PM5 / TXCAN1 | CAN1 transmit output | Open-drain output driving CAN transceiver's TX line; logic-high = recessive, logic-low = dominant on CAN bus. |
| PS4 / MISO | SPI slave-in/master-out | Data output from SPI peripheral during master-initiated transfers; tri-stated when SPI disabled or SS inactive. |
| VDDA / VSSA | Analog power supply/ground | Isolated 5V analog domain for ATD reference and ADC operation; must be decoupled separately from digital VDD. |
Key Features
| Feature | Design Value |
|---|---|
| Dual MSCAN Controllers | Enables redundant or multi-bus CAN networks (e.g., powertrain + body bus) without external controllers; each supports full CAN 2.0B protocol and 16-message FIFOs. |
| Integrated Voltage Regulator (VREG) | Generates stable 5V internal analog supply from VDDR; eliminates need for external LDO in cost-sensitive automotive modules where single 5V rail is available. |
| Background Debug Module (BDM) | Single-wire debug interface enabling full read/write access to memory and registers during run-time; supports flash programming and breakpoint debugging without halting system clocks. |
| Motor Control PWM Block (MC) | 12-channel, 10-bit PWM with dead-time insertion, complementary output pairs, and fault protection inputs-designed for 3-phase inverter gate drive in BLDC/PMSM applications. |
| LCD Driver (LCD_32F4B) | Supports up to 32×4 segment displays with internal charge pump; reduces BOM count by integrating bias generation and multiplex control for automotive instrument clusters. |
Applications
| Automotive Body Control Unit (BCU) | Industrial Motor Drive Controller |
|---|---|
|
Use Scenario: Centralized control of door locks, window lifts, mirrors, lighting, and HVAC actuators in mid-tier vehicles. IC Role / Device Role / Timing Role: Main system MCU coordinating LIN/CAN sub-nodes, executing safety-critical diagnostics, and managing power sequencing via integrated VREG and low-power STOP modes. Use Value: Dual CAN interfaces enable simultaneous communication with powertrain (CAN0) and comfort network (CAN1); 256 KB Flash accommodates A/B firmware images for OTA updates. |
Use Scenario: Closed-loop speed/torque control of 3-phase AC induction or BLDC motors in pumps, fans, and conveyors. IC Role / Device Role / Timing Role: Real-time PWM generator with synchronized ADC sampling (ATD triggered by PWM reload), current sensing, and fault monitoring via MC block and IOC pins. Use Value: Hardware-accelerated motor control peripherals eliminate software overhead; 12-channel PWM with dead-time control enables direct gate-driver interfacing without external logic. |
| Embedded Instrumentation Panel | Off-Highway Vehicle Telematics Hub |
|
Use Scenario: Digital dashboard with analog gauge emulation, warning indicators, and fuel/temperature display using segmented LCD. IC Role / Device Role / Timing Role: Primary display controller driving 32×4 LCD segments while polling sensors via ATD and communicating with ECU over CAN. Use Value: Integrated LCD_32F4B driver reduces component count and PCB area; 10-bit ATD provides sufficient resolution for thermistor and potentiometer inputs. |
Use Scenario: Data aggregation node collecting GPS, engine parameters, and hydraulic pressure from multiple CAN buses in construction or agricultural equipment. IC Role / Device Role / Timing Role: Multi-CAN gateway routing messages between chassis, implement, and telematics modules; stores event logs in Flash with timestamped RTC support. Use Value: Dual MSCAN modules operate independently at different bit rates (e.g., 500 kbps for engine, 125 kbps for implement); 12 KB RAM buffers burst telemetry traffic during cellular transmission gaps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XDP512J0VLQ | Enhanced XGATE co-processor, 512 KB Flash, 32 KB RAM, same 112-pin LQFP package; higher max bus clock (64 MHz). | Required for complex signal processing (e.g., sensor fusion) or larger firmware footprints; not drop-in due to XGATE instruction set dependency. | Select when needing >256 KB code space or offloading time-critical ISR tasks from main CPU. |
| MC9S12XEP100MAL | 1 MB Flash, 64 KB RAM, dual CAN, LIN, USB, and enhanced EEPROM endurance (100K cycles); 144-pin LQFP (larger footprint). | Supports USB host/device and LIN physical layer; requires PCB redesign due to different pin count and layout. | Choose for next-generation platforms requiring USB diagnostics or future-proofing against firmware growth beyond 256 KB. |
Compared with S912XDP512J0VLQ and MC9S12XEP100MAL, the MC9S12H256VFVE offers optimal balance of CAN capability, Flash density, and pin-compatible legacy support in 112-pin LQFP-making it ideal for cost-constrained, volume automotive ECUs where proven reliability and minimal BOM changes are critical.
Availability
MC9S12H256VFVE is available at Aetrix Electronics and suitable for automotive body control units, industrial motor drives, and embedded instrumentation panels requiring stable component supply across extended temperature ranges (−40°C to +105°C) and long product lifecycles.
Supply support for MC9S12H256VFVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontroller innovation through its acquisition of Freescale Semiconductor.
The MC9S12H256VFVE belongs to the HCS12 family, designed specifically for cost-sensitive, high-reliability automotive body electronics and industrial control systems demanding integrated CAN, motor control, and analog peripherals in a single chip.
FAQ
What is the maximum bus clock frequency supported by the MC9S12H256VFVE?
The MC9S12H256VFVE supports a maximum bus clock frequency of 50 MHz, achieved via its integrated Phase-Locked Loop (PLL) using an external crystal (1–8 MHz) as the reference. This frequency is confirmed in Section A.4.3 (PLL Characteristics) of the Device User Guide V01.20, Table A-15, and applies directly to the MC9S12H256VFVE in its standard operating configuration.
Does the MC9S12H256VFVE include an integrated CAN controller, and how many instances are available?
Yes, the MC9S12H256VFVE integrates two independent MSCAN modules (MSCAN0 and MSCAN1), both compliant with ISO 11898-1 (CAN 2.0B Active). Each module features 16 message buffers, programmable bit timing, and full error handling-confirmed in Sections 18 and A.5 of the Device User Guide V01.20 and explicitly assigned to pins PM2/PM3 (CAN0) and PM4/PM5 (CAN1).
What package type and pin count does the MC9S12H256VFVE use?
The MC9S12H256VFVE uses a 112-pin LQFP package (case number 987), denoted by the VFVE suffix. This is documented in Appendix B (Package Information), Figure 2-1, and Table 2-1 of the Device User Guide V01.20. The mechanical dimensions, thermal characteristics, and recommended PCB layout for this package are fully specified in the guide.
Can the MC9S12H256VFVE operate without an external crystal?
No-the MC9S12H256VFVE requires an external crystal (1–8 MHz) connected to EXTAL/XTAL pins for stable clock generation. While it supports self-clock mode (internal RC oscillator) as a fallback, that mode is limited to 1–5.5 MHz and lacks the accuracy and stability needed for CAN or precise timing applications. The primary clock path relies on external crystal + PLL, per Section A.4.2 and A.4.3.
What is the role of the VREG block in the MC9S12H256VFVE?
The VREG block in the MC9S12H256VFVE generates a regulated 5V internal analog supply from the main VDDR rail, powering the ATD converter, voltage reference circuitry (VRH/VRL), and other analog blocks. This eliminates the need for an external LDO in systems with only one 5V supply, as specified in Section 21 and Table A-4 of the Device User Guide V01.20.
MC9S12H256VFVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- LCD, POR, PWM, WDT
- Number of I/O:
- 99
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12H256VFVE FAQ
1.How can I place an order for MC9S12H256VFVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12H256VFVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12H256VFVE reliable?
The price and inventory of MC9S12H256VFVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12H256VFVE is usually 5 days.
3.What payment methods are accepted for MC9S12H256VFVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12H256VFVE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12H256VFVE?
MC9S12H256VFVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12H256VFVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12H256VFVE?
For technical support, including MC9S12H256VFVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12H256VFVE requirements.
6.How does Aetrix verify that MC9S12H256VFVE is sourced from the original manufacturer or authorized distributors?
All MC9S12H256VFVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12H256VFVE meets industry standards.
7.What is the process for return or replacement of MC9S12H256VFVE?
All MC9S12H256VFVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12H256VFVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12H256VFVE part is unused and in its original packaging.
Return procedure for MC9S12H256VFVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S12H256VFVE Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

