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NXP Semiconductors MC9S12KG128VPVE

Part No.:
MC9S12KG128VPVE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-LQFP
Datasheet:
AetrixMC9S12KG128VPVE.pdf
Description:
IC MCU 16BIT 128KB FLASH 112LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,259

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Product details

Overview

MC9S12KG128VPVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 128 KB on-chip ECC Flash, 8 KB RAM, and integrated CAN 2.0B controller, ATD10B16C 10-bit 16-channel ADC, and dual SCI/IIC/SPI interfaces. It operates at up to 50 MHz core frequency with internal PLL, supports automotive-grade temperature range (−40°C to +105°C), and targets engine control units, body electronics, and industrial motor controllers.

For engineers reviewing the MC9S12KG128VPVE datasheet, MC9S12KG128VPVE pinout, MC9S12KG128VPVE application, or MC9S12KG128VPVE equivalent, key selection criteria include CAN bus integration, flash ECC reliability, background debug capability via BDM, and compatibility with legacy S12 toolchains and CodeWarrior IDE.

Technical Context

The MC9S12KG128VPVE implements the CPU12 core with 16-bit data/24-bit address bus, executes instructions in single-cycle for most operations, and uses a Harvard architecture with separate instruction/data buses. Its clock system integrates a Pierce oscillator, PLL with programmable multiplication factor (1–32×), and multiple low-power modes including WAIT and STOP with wake-up on CAN, SCI, or external interrupt.

Peripheral integration includes a scalable MSCAN module supporting full CAN 2.0B protocol with 16 message buffers, an ATD10B16CV3 ADC with configurable sample-and-hold timing and external trigger support, and a PIM module enabling flexible I/O configuration across 96 GPIO pins with programmable pull-ups, slew rate, and polarity inversion.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureCPU12 16-bit CISC core with 24-bit addressing, 16 MB linear memory map
Flash Memory128 KB on-chip ECC Flash (S12FTS128K1ECCV1), supports in-circuit programming and secure boot
RAM8 KB on-chip SRAM (not including 2 KB EEPROM)
ADCATD10B16CV3: 10-bit resolution, 16 input channels, 8 µs conversion time, external trigger capability
CAN InterfaceS12MSCANV2: Full CAN 2.0B compliance, 16 message buffers, programmable bit timing, loopback mode
Max Core Frequency50 MHz (via PLL; crystal input 4–8 MHz, multiplication factor 1–32×)
Operating Temperature−40°C to +105°C, qualified for automotive under AEC-Q100 Grade 2
Debug InterfaceBackground Debug Module (BDMV4) with single-wire interface, supports real-time register access and flash erase/write

Pinout & Package

MC9S12KG128VPVE is housed in a 112-pin LQFP (Low-Profile Quad Flat Package) with 0.4 mm pitch, JEDEC MS-026AC compliant, thermal pad exposed on underside for enhanced heat dissipation in automotive environments.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual 5 V domains: digital (VDD/VSS) and analog (VDDA/VSSA); separate decoupling required
EXTAL / XTALClock input/outputConnects to external crystal (4–8 MHz); enables Pierce oscillator startup and PLL reference
RXCAN / TXCANCAN transceiver interfaceDifferential CAN bus physical layer connection; requires external transceiver (e.g., MC33883)
SCI0TX / SCI0RXAsynchronous serial interfaceFull-duplex UART channel supporting LIN 2.0 framing and auto-baud detection
AN0–AN15Analog inputs16-channel ADC input pins; share multiplexed port pins (e.g., PT0–PT15); support external trigger via ETRIG
RESETActive-low reset inputAsynchronous reset with internal pull-up; debounced by CRG module; initiates cold start sequence
BKGDBackground debug signalSingle-wire BDM interface; used for programming, debugging, and flash security unlock via backdoor key

Key Features

FeatureDesign Value
ECC Flash ProtectionOn-the-fly error correction for all 128 KB Flash; detects and corrects single-bit errors, detects double-bit errors
Integrated CAN 2.0BHardware message buffering (16 buffers), acceptance filtering, automatic retransmission, and bus-off recovery
Flexible Clock SystemConfigurable PLL with fine-grained multiplication (1–32×), clock monitor, and real-time interrupt timer (RTI)
Robust Debug SupportBDMV4 enables non-intrusive debugging, flash programming, and security unlocking without halting CPU execution
Automotive-Grade I/O96 GPIO with programmable drive strength, slew rate control, pull-up/pull-down, and interrupt-on-change capability
EEPROM Emulation2 KB on-chip EEPROM (S12EETS2KV1) with 100K write cycles, sector erase, and wear leveling support

Applications

Engine Control Unit (ECU)Body Control Module (BCM)

Use Scenario: Real-time monitoring of crankshaft position, throttle angle, O2 sensor voltage, and coolant temperature in gasoline/diesel powertrains.

IC Role / Device Role / Timing Role: Primary engine management MCU executing closed-loop fuel injection and spark timing algorithms with sub-millisecond deterministic response.

Use Value: ECC Flash ensures firmware integrity under EMI-rich under-hood conditions; CAN 2.0B enables seamless communication with transmission and ABS modules.

Use Scenario: Centralized control of door locks, window lifts, lighting sequences, and HVAC fan speed in passenger vehicles.

IC Role / Device Role / Timing Role: Main BCM controller managing multi-sensor inputs (switches, ambient light, temperature) and driving relay/LED loads via PWM outputs.

Use Value: 16-channel ADC supports simultaneous analog sensing; 8 KB RAM accommodates complex state machines and LIN gateway logic.

Industrial Motor DriveOff-Highway Vehicle Telematics

Use Scenario: Closed-loop speed and torque control of 3-phase AC induction motors in pumps, compressors, and conveyors.

IC Role / Device Role / Timing Role: Motion controller interfacing with Hall-effect encoders, current shunt amplifiers, and gate drivers via PWM and GPIO.

Use Value: 50 MHz core enables fast PID loop execution (<100 µs); SCI and CAN allow dual-network diagnostics and parameter tuning.

Use Scenario: Data aggregation and wireless reporting for GPS location, engine hours, fault codes, and payload weight in construction/mining equipment.

IC Role / Device Role / Timing Role: Telematics hub collecting J1939 CAN messages, processing sensor data, and formatting payloads for cellular modem interface.

Use Value: AEC-Q100 qualification ensures operation in high-vibration, wide-temperature environments; BDM debug support simplifies field firmware updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12XDP512Higher memory (512 KB Flash, 32 KB RAM), XGATE co-processor for offloading CAN/SCI tasks, same pinout but larger package (144-LQFP)Required for complex real-time tasks like adaptive cruise control where XGATE reduces CPU loadSelect when >128 KB Flash or hardware-accelerated peripheral handling is needed; not drop-in compatible due to package size and pin count
S912ZVL64Successor S12Z core, 64 KB Flash, integrated LINPHY, smaller 64-pin QFP, lower power consumptionTargeted at cost-sensitive, space-constrained nodes like seat control or mirror adjustmentChoose for new designs prioritizing footprint reduction and LIN integration; requires toolchain migration from CodeWarrior to S32DS

Compared with MC9S12KG128VPVE, MC9S12XDP512 offers expanded memory and co-processing for higher-complexity ECUs, while S912ZVL64 provides modern power efficiency and LIN integration in compact form - neither is pin-compatible, but both maintain S12 software heritage for smoother migration paths.

Availability

MC9S12KG128VPVE is available at Aetrix Electronics and suitable for engine control units, body electronics modules, and industrial motor drives requiring stable component supply, long-term automotive lifecycle support, and traceable sourcing.

Supply support for MC9S12KG128VPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in microcontrollers and secure connectivity.

The MC9S12KG128VPVE belongs to the HCS12 family, designed specifically for cost-sensitive, high-reliability automotive applications demanding robust CAN communication, flash safety features, and proven toolchain support.

FAQ

What is the maximum operating frequency of the MC9S12KG128VPVE?

The MC9S12KG128VPVE achieves a maximum core frequency of 50 MHz using its internal PLL. This requires an external crystal (4–8 MHz) connected to EXTAL/XTAL pins, with PLL multiplication factor configured via the SYNR register. The actual achievable frequency depends on VDD stability and ambient temperature, and must remain within the −40°C to +105°C automotive grade specification for MC9S12KG128VPVE.

Does the MC9S12KG128VPVE support CAN FD?

No, the MC9S12KG128VPVE implements the S12MSCANV2 module, which supports only classical CAN 2.0B (ISO 11898-1:2003) with bit rates up to 1 Mbps. It does not support CAN FD features such as flexible data-rate, extended data length, or CRC enhancements. For CAN FD, designers should consider NXP's S32K1xx or S32K3xx families instead of MC9S12KG128VPVE.

How is flash security implemented on the MC9S12KG128VPVE?

The MC9S12KG128VPVE uses a two-tier flash security model: standard security blocks read/write access to Flash and EEPROM unless disabled, and a backdoor key mechanism allowing authorized debug tools to unsecure the device using a 16-byte key written to specific flash locations. Security status is latched at reset and can only be cleared via BDM command or mass erase - critical for protecting firmware IP in MC9S12KG128VPVE deployments.

Can the MC9S12KG128VPVE operate without an external crystal?

Yes, the MC9S12KG128VPVE can operate in self-clock mode using its internal RC oscillator (nominal 2 MHz), but this mode disables PLL operation and limits maximum core frequency to 8 MHz. External crystal is required for full-speed operation (up to 50 MHz), CAN timing accuracy, and production-grade clock stability. Self-clock mode is intended only for debug or fail-safe fallback in MC9S12KG128VPVE systems.

What development tools are officially supported for the MC9S12KG128VPVE?

NXP officially supports CodeWarrior Development Studio for HCS12 (v5.1+), S08/HCS12 Debugger, and standalone P&E Micro BDM interfaces (e.g., USB-ML-12). Third-party tools like IAR Embedded Workbench for HCS12 also provide full MC9S12KG128VPVE support, including flash programming, RTOS integration, and CAN analysis plugins.

MC9S12KG128VPVE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12KG128VPVE FAQ

1.How can I place an order for MC9S12KG128VPVE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12KG128VPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12KG128VPVE reliable?

The price and inventory of MC9S12KG128VPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12KG128VPVE is usually 5 days.

3.What payment methods are accepted for MC9S12KG128VPVE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12KG128VPVE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S12KG128VPVE?

MC9S12KG128VPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12KG128VPVE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12KG128VPVE?

For technical support, including MC9S12KG128VPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12KG128VPVE requirements.

6.How does Aetrix verify that MC9S12KG128VPVE is sourced from the original manufacturer or authorized distributors?

All MC9S12KG128VPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12KG128VPVE meets industry standards.

7.What is the process for return or replacement of MC9S12KG128VPVE?

All MC9S12KG128VPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12KG128VPVE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12KG128VPVE part is unused and in its original packaging.

Return procedure for MC9S12KG128VPVE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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