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NXP Semiconductors MC9S12KG256MPVE
- Part No.:
- MC9S12KG256MPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12KG256MPVE.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 112LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,345
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Product details
Overview
MC9S12KG256MPVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 256 KB on-chip ECC flash memory, 12 KB RAM, and integrated CAN 2.0B controller, designed for automotive body control, powertrain sensor interface, and industrial motor control applications.
For engineers reviewing the MC9S12KG256MPVE datasheet, MC9S12KG256MPVE pinout, MC9S12KG256MPVE application, or MC9S12KG256MPVE equivalent, key selection criteria include its 50 MHz bus speed, 8-channel 10-bit ADC with external trigger support, dual SPI interfaces, and BDM debug capability - all in a 112-pin LQFP package rated for -40°C to +125°C operation.
Technical Context
The MC9S12KG256MPVE implements the HCS12 CPU12 core with 16-bit data path and 24-bit addressing, supporting single-cycle instruction execution for critical timing tasks. Its clock system integrates a PLL with programmable multiplication factor (1–32×), enabling flexible bus frequency derivation from crystal or external clock sources.
Memory subsystem includes 256 KB of ECC-protected flash organized in 2-KB sectors, 4 KB EEPROM with wear-leveling support, and 12 KB of SRAM with configurable wait states. Peripheral integration covers two independent CAN modules (S12MSCANV2), eight PWM channels, and a 16-bit timer module with input capture/output compare functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU12 core with 24-bit address bus and 16-MHz internal clock base |
| Flash Memory | 256 KB ECC-protected flash with sector erase, program/verify cycles, and secure boot protection |
| RAM | 12 KB on-chip SRAM with configurable wait-state control for timing-critical access |
| ADC | 8-channel 10-bit analog-to-digital converter with 8 µs conversion time and external trigger inputs (ETRIG0–ETRIG3) |
| CAN Interface | Dual S12MSCANV2 modules compliant with ISO 11898-1, supporting CAN 2.0B protocol with 32 message buffers per module |
| Operating Temperature | -40°C to +125°C ambient range, qualified for automotive underhood and industrial harsh environments |
| Package | 112-pin LQFP (20 × 20 mm, 0.65 mm pitch) with exposed thermal pad for enhanced thermal dissipation |
Pinout & Package
MC9S12KG256MPVE is housed in a 112-pin LQFP package (20 × 20 mm, 0.65 mm pitch) with exposed thermal pad (EPAD) connected to VSS for improved thermal performance in high-duty-cycle automotive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Separate analog/digital supply domains (VDDA/VSSA, VDDD/VSSD) enable noise isolation for ADC and digital logic |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external watchdog and clock monitor reset assertion |
| EXTAL / XTAL | Crystal oscillator input/output | Supports 4–32 MHz crystal or external clock source for PLL reference; low-power Pierce oscillator mode available |
| CAN0_TX / CAN0_RX | CAN 2.0B differential signal pair | Direct connection to external CAN transceiver; supports bit rates up to 1 Mbps with programmable timing registers |
| AN0–AN7 | Analog input channels | Eight single-ended or four differential ADC inputs with selectable reference (VRH/VRL) and hardware-triggered sampling |
| PORT P0–P7 | General-purpose I/O with interrupt capability | Configurable as input/output with pull-up enable, polarity inversion, and reduced-drive mode for EMI-sensitive routing |
Key Features
| Feature | Design Value |
|---|---|
| ECC Flash Protection | Single-bit error correction and double-bit error detection across full 256 KB flash array prevents silent data corruption in safety-critical firmware storage |
| Dual CAN Controllers | Two independent S12MSCANV2 modules allow concurrent communication on separate CAN buses - essential for gateway or multi-domain vehicle architectures |
| Background Debug Module (BDM) | On-chip BDMV4 enables real-time debugging, flash programming, and breakpoint insertion without dedicated JTAG pins or external emulator hardware |
| Low-Power Modes | Four operational modes (Run, Wait, Stop, and Special Single-Chip) with configurable wake-up sources including CAN message, RTC, and external interrupts |
| Integrated Voltage Regulator | VREG3V3V2 provides regulated 3.3 V output for internal logic and external peripherals, reducing external component count in compact designs |
Applications
| Automotive Body Control Unit (BCU) | Industrial Motor Drive Interface |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, lighting, and HVAC actuators in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing real-time control algorithms, managing LIN/CAN subnetworks, and interfacing with analog sensors and PWM-driven loads. Use Value: Dual CAN modules enable simultaneous communication with powertrain and infotainment networks; 256 KB ECC flash ensures reliable over-the-air update storage. |
Use Scenario: Sensor and feedback interface for 3-phase BLDC motor drives in factory automation equipment. IC Role / Device Role / Timing Role: Real-time acquisition of current/voltage feedback via 10-bit ADC, generation of synchronized PWM signals, and CAN-based command reception from PLC master. Use Value: 8 µs ADC conversion time and hardware-triggered sampling align precisely with motor commutation timing; 12 KB RAM buffers encoder position data during high-speed motion profiles. |
| Off-Highway Vehicle Telematics Gateway | Heavy-Duty Battery Management System (BMS) |
Use Scenario: Aggregation and translation of J1939, CANopen, and proprietary CAN messages in construction and agricultural machinery. IC Role / Device Role / Timing Role: Protocol gateway bridging multiple CAN buses, performing message filtering, prioritization, and diagnostics logging to EEPROM. Use Value: Two independent CAN controllers eliminate need for external bridge ICs; 4 KB EEPROM supports non-volatile storage of fault logs and calibration data across 100k+ write cycles. |
Use Scenario: Cell voltage monitoring, temperature sensing, and balancing control for 12–24 cell lithium-ion battery packs in energy storage systems. IC Role / Device Role / Timing Role: Analog front-end controller acquiring up to 8 cell voltages and thermistor readings, executing balancing logic, and reporting status via CAN. Use Value: Dedicated ADC reference pins (VRH/VRL) enable ratiometric measurement accuracy better than ±1% over temperature; ECC flash secures firmware against corruption during high-noise battery switching events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XDP512J0VLQ | 512 KB flash, 32 KB RAM, enhanced XGATE co-processor, same 112-pin LQFP package | Higher code density and real-time offload capability for complex control loops or protocol stacks | Select when future firmware expansion or deterministic interrupt latency below 1 µs is required |
| MC9S12XEP100MAL | 1 MB flash, 64 KB RAM, dual CAN + FlexRay, 112-pin LQFP, extended temp (-40°C to +125°C) | Supports next-generation automotive domain controllers requiring mixed network protocols and larger OTA image storage | Choose for new designs targeting ASIL-B compliance paths or multi-protocol gateway requirements |
Compared with MC9S12KG256MPVE, the S912XDP512J0VLQ offers scalable memory and co-processing for evolving control complexity, while the MC9S12XEP100MAL adds FlexRay and larger memory for higher-integration domain controllers - both retain pin-compatible footprint but require software adaptation for peripheral register mapping.
Availability
MC9S12KG256MPVE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and off-highway telematics requiring stable component supply across extended product lifecycles.
Supply support for MC9S12KG256MPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive microcontrollers dating back to Motorola and Freescale.
The MC9S12KG256MPVE belongs to the HCS12 family, engineered specifically for cost-sensitive, high-reliability automotive and industrial control applications where functional safety, long-term availability, and robust EMC performance are mandatory.
FAQ
What is the maximum bus frequency supported by the MC9S12KG256MPVE?
The MC9S12KG256MPVE supports a maximum bus frequency of 50 MHz, achieved via its integrated PLL with programmable multiplication factor (1–32×) and external crystal reference (4–32 MHz). This allows deterministic real-time response in motor control and sensor fusion applications where cycle-accurate timing is critical. The MC9S12KG256MPVE's PLL lock time and stability meet automotive qualification standards for rapid startup and transient immunity.
Does the MC9S12KG256MPVE include hardware error correction for flash memory?
Yes, the MC9S12KG256MPVE integrates ECC (Error Correction Code) protection across its entire 256 KB flash memory array, providing single-bit error correction and double-bit error detection. This feature is enabled by default and requires no software overhead, making the MC9S12KG256MPVE suitable for ASIL-B–level automotive applications where silent firmware corruption must be prevented. The ECC logic operates transparently during read/write/erase operations.
Can the MC9S12KG256MPVE operate in extended temperature environments?
Yes, the MC9S12KG256MPVE is rated for operation from -40°C to +125°C ambient temperature and is qualified per AEC-Q100 Grade 1 standards. Its thermal design includes an exposed EPAD in the 112-pin LQFP package and internal voltage regulation optimized for wide-range supply stability, enabling reliable deployment in engine bay, transmission control, and industrial drive enclosures.
How many CAN interfaces does the MC9S12KG256MPVE support?
The MC9S12KG256MPVE integrates two independent S12MSCANV2 modules, each compliant with ISO 11898-1 and supporting CAN 2.0B protocol with 32 message buffers. This dual-CAN capability allows the MC9S12KG256MPVE to serve as a gateway between powertrain and body networks or manage redundant communication paths in safety-critical systems without external CAN controllers.
Is background debug supported on the MC9S12KG256MPVE without additional hardware?
Yes, the MC9S12KG256MPVE includes an on-chip Background Debug Module (BDMV4) accessible via a single-wire BDM interface. This enables full in-circuit debugging, flash programming, and real-time variable inspection using only a standard BDM pod - no JTAG adapter or external emulator is required. The MC9S12KG256MPVE's BDM supports secure unsecuring via backdoor key access when flash protection is enabled.
MC9S12KG256MPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12KG256MPVE FAQ
1.How can I place an order for MC9S12KG256MPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12KG256MPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12KG256MPVE reliable?
The price and inventory of MC9S12KG256MPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12KG256MPVE is usually 5 days.
3.What payment methods are accepted for MC9S12KG256MPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12KG256MPVE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12KG256MPVE?
MC9S12KG256MPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12KG256MPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12KG256MPVE?
For technical support, including MC9S12KG256MPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12KG256MPVE requirements.
6.How does Aetrix verify that MC9S12KG256MPVE is sourced from the original manufacturer or authorized distributors?
All MC9S12KG256MPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12KG256MPVE meets industry standards.
7.What is the process for return or replacement of MC9S12KG256MPVE?
All MC9S12KG256MPVE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12KG256MPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12KG256MPVE part is unused and in its original packaging.
Return procedure for MC9S12KG256MPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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