NXP Semiconductors MC9S12T64CPKE16
- Part No.:
- MC9S12T64CPKE16
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MC9S12T64CPKE16.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 80FQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,427
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Product details
Overview
MC9S12T64CPKE16 from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 64 KB Flash EEPROM, 4 KB RAM, and an integrated 8-channel 10-bit ADC. It operates at up to 25 MHz core frequency with a PLL-based clock system, supports CAN 2.0A/B communication, and targets automotive body control modules requiring deterministic real-time response.
For engineers reviewing the MC9S12T64CPKE16 datasheet, MC9S12T64CPKE16 pinout, MC9S12T64CPKE16 application, or MC9S12T64CPKE16 equivalent, key selection criteria include its 80-pin LQFP package, on-chip voltage regulator, background debug interface, and CAN/SCI/SPI peripheral integration for embedded vehicle networks.
Technical Context
The MC9S12T64CPKE16 implements the HCS12 CPU12 core with 16-bit data path, 24-bit addressing, and instruction set backward compatibility with HC11. Its Clocks and Reset Generator (CRG) module supports crystal, ceramic resonator, or external clock input with programmable PLL multiplication (×1 to ×32) and multiple low-power stop/wait modes.
Peripheral integration includes an 8-channel Enhanced Capture Timer (ECT), 8-channel PWM with center-aligned capability, Fast Background Debug Module (FBDM) for in-circuit debugging, and multiplexed external bus interface (MEBI) supporting 8/16-bit memory expansion. All peripherals are memory-mapped and accessible via standard read/write instructions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit address bus and HC11 instruction set compatibility |
| Flash Memory | 64 KB on-chip Flash EEPROM with 10K erase/program cycles and 10-year data retention |
| RAM Size | 4 KB on-chip RAM including 2 KB CALRAM for calibration data storage |
| ADC Resolution | 10-bit successive approximation ADC with 8 input channels and 25 µs conversion time |
| Max Core Frequency | 25 MHz achieved via PLL with configurable PRDIV8 and FDIV settings |
| Communication Interfaces | One CAN 2.0A/B controller, two SCI modules, one SPI module, and I²C-compatible IIC module |
| Operating Voltage | 4.5 V to 5.5 V supply range with integrated 2.5 V internal voltage regulator for core logic |
Pinout & Package
MC9S12T64CPKE16 is housed in an 80-pin LQFP (12 mm × 12 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions include dedicated CANH/CANL differential pair, dual SCI TXD/RXD pairs, SPI MOSI/MISO/SCK/SS signals, and 16-bit multiplexed address/data bus (AD0–AD15) with control lines (AS, DS, R/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDX, VDDPLL | Power Supply Inputs | VDD = main 5 V supply; VDDX = external bus I/O supply; VDDPLL = dedicated PLL analog supply |
| VSS, VSSX, VSSPLL | Ground Terminals | Separate digital, external bus, and PLL analog ground returns for noise isolation |
| XTAL, EXTAL | Crystal Oscillator Inputs | Supports 4–8 MHz crystal or ceramic resonator; enables CRG PLL clock synthesis |
| CANH, CANL | CAN Bus Differential Pair | Direct connection to ISO 11898-compliant transceiver; supports 1 Mbit/s CAN FD-ready timing |
| PA0–PA7 | Port A General-Purpose I/O | 8-bit bidirectional port with pull-up enable; PA0–PA3 also serve as ECT channel inputs |
| AD0–AD15 | Multiplexed Address/Data Bus | 16-bit time-multiplexed bus for external memory expansion using MEBI protocol |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Voltage Regulator (VREG) | Generates stable 2.5 V core supply from 4.5–5.5 V input, eliminating need for external LDO |
| Fast Background Debug Module (FBDM) | Single-wire debug interface compatible with BDM pod; enables full memory/register access without halting CPU |
| Flash Security Lock | Configurable security byte prevents unauthorized readout of Flash contents via BDM or boot-mode access |
| Low-Voltage Detection (LVD) | Detects supply drop below 4.0 V threshold and triggers interrupt or reset to prevent erratic operation |
| Module Mapping Control (MMC) | Dynamic remapping of peripheral registers into memory space allows flexible memory partitioning and bank switching |
Applications
| Automotive Body Control Unit | Industrial Motor Control |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirrors, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing real-time CAN message handling, PWM-driven motor actuation, and ADC-based sensor monitoring. Use Value: Integrated CAN controller eliminates external transceiver cost; 25 MHz core ensures sub-10 ms response to LIN/CAN commands. |
Use Scenario: Closed-loop speed and position control of BLDC motors in HVAC blowers and pump systems. IC Role / Device Role / Timing Role: Real-time execution of commutation logic using ECT timer capture and 8-channel PWM outputs. Use Value: Hardware PWM center-aligned mode reduces EMI; 10-bit ADC enables precise current sensing at 25 µs per sample. |
| Off-Highway Equipment Monitor | Commercial Vehicle Telematics Gateway |
Use Scenario: Monitoring engine temperature, hydraulic pressure, and battery voltage in construction and agricultural machinery. IC Role / Device Role / Timing Role: Sensor fusion node aggregating analog and digital inputs, logging fault codes, and transmitting over CAN. Use Value: On-chip 64 KB Flash stores firmware and diagnostic logs; CALRAM retains calibration offsets across power cycles. |
Use Scenario: Protocol translation between J1939 CAN bus and cellular/GPS modules in fleet management systems. IC Role / Device Role / Timing Role: Dual-CAN interface handles J1939 and private CAN networks; SCI interfaces with modem UART. Use Value: Independent CAN controllers support concurrent message filtering and transmission without CPU overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XDP512J1MALR | Enhanced XGATE co-processor, 512 KB Flash, 32 KB RAM, higher CAN message buffer count | Better suited for complex gateway or ADAS pre-processing where offloading interrupts is critical | Select when needing >100 klines/s CAN throughput or real-time signal processing beyond HCS12 capability |
| MC9S12XEP100MALR | 112-pin LQFP, 1 MB Flash, dual CAN, enhanced ECT with 16-bit resolution and 128-channel queue | Targeted at high-end powertrain and chassis control requiring extended memory and precision timing | Choose for designs requiring larger code footprint, more I/O, or higher-resolution capture timing than MC9S12T64CPKE16 provides |
Compared with S912XDP512J1MALR and MC9S12XEP100MALR, the MC9S12T64CPKE16 delivers optimal cost-performance balance for mid-tier body electronics, offering sufficient Flash/RAM and CAN bandwidth without over-provisioning resources needed only in premium platforms.
Availability
MC9S12T64CPKE16 is available at Aetrix Electronics and suitable for automotive body control units, industrial motor drives, and off-highway equipment monitors requiring stable component supply and long-term lifecycle support.
Supply support for MC9S12T64CPKE16 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S12T64CPKE16 belongs to the legacy HCS12 family designed specifically for cost-sensitive automotive body electronics, emphasizing robustness, CAN integration, and flash-based field-upgradability in harsh environments.
FAQ
What is the maximum operating frequency of the MC9S12T64CPKE16?
The MC9S12T64CPKE16 achieves a maximum core frequency of 25 MHz using its integrated PLL. This is configured via the PRDIV8 and FDIV register bits in the Clocks and Reset Generator (CRG) module, allowing multiplication of the external crystal or resonator input (typically 4–8 MHz) to reach the target frequency while maintaining stable operation within the 4.5–5.5 V supply range.
Does the MC9S12T64CPKE16 support CAN FD?
The MC9S12T64CPKE16 implements a classic CAN 2.0A/B controller compliant with ISO 11898-1:2003 and does not support CAN FD physical layer signaling or protocol extensions such as variable bit rates or extended data length. Its CAN module operates at up to 1 Mbit/s with fixed 8-byte payload, making it suitable for traditional automotive body networks but not next-generation high-throughput applications.
How is debug functionality implemented on the MC9S12T64CPKE16?
Debugging for the MC9S12T64CPKE16 is handled by the Fast Background Debug Module (FBDM), which uses a single-wire serial interface (BKGD pin) to communicate with external BDM pods. This allows full memory inspection, register read/write, breakpoint setting, and real-time execution control without halting the CPU-enabling non-intrusive development and validation of time-critical automotive firmware.
What packaging and thermal characteristics define the MC9S12T64CPKE16?
The MC9S12T64CPKE16 is supplied in an 80-pin LQFP package (12 mm × 12 mm, 0.5 mm pitch) with an exposed thermal pad. Its specified operating junction temperature range is –40°C to +125°C, and it features internal thermal shutdown protection triggered above 150°C. The package supports reflow soldering per JEDEC J-STD-020 and meets automotive AEC-Q100 Grade 2 reliability requirements.
Can the MC9S12T64CPKE16 operate from a single 5 V supply?
Yes, the MC9S12T64CPKE16 is designed to operate from a single 5 V supply applied to VDD. Its integrated voltage regulator (VREG) generates the required 2.5 V core voltage internally, while separate VDDX and VDDPLL pins allow optional independent supply routing for external bus I/O and PLL analog circuitry-though these may be tied to VDD in most implementations to simplify board design.
MC9S12T64CPKE16 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- EBI/EMI, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 59
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12T64CPKE16 FAQ
1.How can I place an order for MC9S12T64CPKE16 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12T64CPKE16 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12T64CPKE16 reliable?
The price and inventory of MC9S12T64CPKE16 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12T64CPKE16 is usually 5 days.
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MC9S12T64CPKE16 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12T64CPKE16 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12T64CPKE16?
For technical support, including MC9S12T64CPKE16 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12T64CPKE16 requirements.
6.How does Aetrix verify that MC9S12T64CPKE16 is sourced from the original manufacturer or authorized distributors?
All MC9S12T64CPKE16 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12T64CPKE16 meets industry standards.
7.What is the process for return or replacement of MC9S12T64CPKE16?
All MC9S12T64CPKE16 units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12T64CPKE16, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12T64CPKE16 part is unused and in its original packaging.
Return procedure for MC9S12T64CPKE16:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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