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NXP Semiconductors MC9S12T64MPKE16
- Part No.:
- MC9S12T64MPKE16
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MC9S12T64MPKE16.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 80FQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,760
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Product details
Overview
MC9S12T64MPKE16 from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring a 25 MHz CPU, 64 KB on-chip Flash EEPROM, 2 KB CALRAM, and integrated peripherals including 8-channel PWM, 8-channel 10-bit ATD, SCI, SPI, ECT, and FBDM debug interface. It operates from 4.5–5.5 V and targets automotive body control modules requiring deterministic real-time response.
For engineers reviewing the MC9S12T64MPKE16 datasheet, MC9S12T64MPKE16 pinout, MC9S12T64MPKE16 application, or MC9S12T64MPKE16 equivalent, key selection criteria include its 80-pin LQFP package, 25 MHz bus speed, Flash security features, background debug capability, and compliance with automotive-grade temperature range (–40°C to +105°C).
Technical Context
The MC9S12T64MPKE16 implements the HCS12 CPU core with 16-bit data path and 24-bit addressing, supporting single-cycle 16-bit multiply and indexed addressing modes. Its memory subsystem includes 64 KB Flash with 1K block erase granularity and 2 KB CALRAM mapped over Flash for runtime calibration storage.
Peripherals are managed via Module Mapping Control (MMC), enabling dynamic remapping of register spaces. The Clocks and Reset Generator (CRG) supports PLL-based clock synthesis with selectable dividers (PRDIV8/FDIV), delivering stable 25 MHz bus frequency from external crystal or oscillator input.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS12 16-bit CISC core with 25 MHz maximum bus speed and single-cycle 16×16 multiply. |
| Flash Memory | 64 KB on-chip Flash EEPROM with 1K-block erase, 2K-word program buffer, and flash security lock. |
| CALRAM | 2 KB on-chip RAM mapped over Flash address space for calibration data storage and runtime patching. |
| ADC | 8-channel 10-bit Analog-to-Digital Converter with 8 µs conversion time and configurable sample-and-hold. |
| PWM | 8-channel 8-bit PWM module with center-aligned/edge-aligned modes, dead-time insertion, and independent channel control. |
| Debug Interface | Fast Background Debug Module (FBDM) supporting real-time register/memory access and breakpoint debugging via single-wire BDM pin. |
| Operating Voltage | 4.5 V to 5.5 V supply range, qualified for automotive battery environments with load dump tolerance. |
| Temperature Range | –40°C to +105°C ambient operating range, meeting AEC-Q100 Grade 2 requirements. |
Pinout & Package
MC9S12T64MPKE16 is housed in an 80-pin Low-Profile Quad Flat Package (LQFP) with 0.5 mm pitch, compliant with JEDEC MO-207AB. Thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input | Asynchronous hardware reset with internal pull-up; initiates full register initialization and Flash security check. |
| BDM | Background Debug Module pin | Single-wire serial interface for non-intrusive debugging, flash programming, and real-time memory inspection. |
| VDD, VDDA, VDDPLL | Power supply inputs | Separate analog (VDDA), digital (VDD), and PLL (VDDPLL) supplies reduce noise coupling into sensitive ADC and clock circuits. |
| XTAL, EXTAL | Crystal oscillator terminals | Supports 4–8 MHz fundamental-mode crystals; internal oscillator circuit enables PLL multiplication to 25 MHz bus clock. |
| PORTA[7:0] | General-purpose I/O port | 8-bit bidirectional port with programmable pull-ups, interrupt-on-change capability, and peripheral multiplexing (SCI, SPI, PWM). |
| PORTB[7:0] | General-purpose I/O port | 8-bit bidirectional port supporting ECT timer capture/compare, ATD trigger, and PWM output functions. |
Key Features
| Feature | Design Value |
|---|---|
| Flash Security | Configurable security byte prevents unauthorized read-out of Flash contents and disables BDM access when enabled. |
| CALRAM Mapping | 2 KB RAM dynamically overlays Flash address space (0x2000–0x27FF), enabling runtime calibration updates without Flash reprogramming. |
| Enhanced Capture Timer (ECT) | 8-channel input capture/output compare unit with quadrature decoding, pulse accumulation, and gated time measurement. |
| Low-Voltage Detection (LVD) | Programmable threshold (4.25 V / 4.5 V) with interrupt and reset options ensures safe operation during brown-out conditions. |
| Module Mapping Control (MMC) | Dynamic remapping of peripheral register blocks allows flexible memory layout and efficient use of limited address space. |
| MEBI Interface | Multiplexed External Bus Interface supports up to 1 MB external memory expansion with programmable wait states and burst mode. |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized control of lighting, power windows, locks, and mirrors in passenger vehicles. IC Role / Device Role / Timing Role: Main system controller executing real-time CAN messaging, PWM dimming, and ATD-based sensor monitoring. Use Value: Integrated 64 KB Flash and CALRAM enable field-upgradable firmware and vehicle-specific calibration without external memory. | Use Scenario: Local door electronics managing window lift, mirror adjustment, and anti-pinch detection. IC Role / Device Role / Timing Role: Dedicated motor control node using ECT for position sensing and PWM for bidirectional DC motor drive. Use Value: 8-channel PWM with dead-time insertion and 10-bit ATD support precise motor current feedback and thermal monitoring. |
| Roof Module (Sunroof/Convertibles) | Seat Control Unit |
Use Scenario: Sunroof actuation, tilt control, and pinch protection in premium roof systems. IC Role / Device Role / Timing Role: Safety-critical motion controller using ECT quadrature decoding and LVD-triggered emergency stop. Use Value: Automotive-grade temperature range and built-in LVD ensure reliable operation in extreme cabin temperatures and voltage transients. | Use Scenario: Power seat positioning with memory recall, heating, and lumbar adjustment. IC Role / Device Role / Timing Role: Multi-peripheral coordinator interfacing with potentiometers (ATD), switches (PORTB), motors (PWM), and CAN network. Use Value: On-chip 2 KB CALRAM stores user seat profiles and motor limit positions, eliminating need for external EEPROM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XDP512J1MALR | 32-bit S12X core, 512 KB Flash, higher performance but larger footprint and higher cost. | Targeted at next-generation BCMs requiring CAN FD, more complex diagnostics, and larger code size. | Select when migrating to S12X architecture for scalability; not pin-compatible with MC9S12T64MPKE16. |
| MC9S12XEP100MALR | 16-bit S12X core, 1 MB Flash, enhanced ECT/PWM, but requires different toolchain and layout. | Suitable for high-end seat or chassis modules needing extended memory and advanced timing features. | Choose for new designs requiring future-proofing; incompatible register map and pinout vs. MC9S12T64MPKE16. |
Compared with S912XDP512J1MALR and MC9S12XEP100MALR, the MC9S12T64MPKE16 offers optimal balance of proven reliability, compact 80-pin LQFP packaging, and sufficient Flash/CALRAM for mature automotive body electronics-without requiring architectural migration or PCB redesign.
Availability
MC9S12T64MPKE16 is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, sunroof actuators, and seat control units requiring stable component supply across long production lifecycles.
Supply support for MC9S12T64MPKE16 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontroller innovation.
The MC9S12T64MPKE16 belongs to the HCS12 family, designed specifically for cost-sensitive, safety-aware automotive body electronics where deterministic real-time control, Flash security, and robust debug capability are essential.
FAQ
What is the maximum bus frequency supported by the MC9S12T64MPKE16?
The MC9S12T64MPKE16 supports a maximum bus frequency of 25 MHz, achieved via its internal Phase-Locked Loop (PLL) using external crystal inputs between 4–8 MHz. This frequency is fixed for the MPKE16 variant and verified across the full –40°C to +105°C operating range per the datasheet's electrical characteristics section.
Does the MC9S12T64MPKE16 include hardware security features?
Yes, the MC9S12T64MPKE16 includes Flash security via a dedicated security byte that, when programmed, disables both external read access to Flash contents and BDM debug interface functionality. This prevents unauthorized firmware extraction and protects intellectual property in deployed automotive ECUs.
Can the CALRAM in the MC9S12T64MPKE16 be used as general-purpose RAM?
No-the 2 KB CALRAM in the MC9S12T64MPKE16 is architecturally mapped over the Flash address range (0x2000–0x27FF) and is intended exclusively for calibration data storage and runtime patching. It cannot be used as general-purpose RAM outside this overlay configuration, and its access is controlled by the MMC registers.
What debug interface does the MC9S12T64MPKE16 support?
The MC9S12T64MPKE16 supports the Fast Background Debug Module (FBDM) via a single dedicated BDM pin. This interface enables non-intrusive real-time debugging, Flash programming, register inspection, and breakpoint setting without halting CPU execution-critical for validating timing-critical automotive software.
Is the MC9S12T64MPKE16 qualified for automotive applications?
Yes, the MC9S12T64MPKE16 is qualified to AEC-Q100 Grade 2 (–40°C to +105°C) and designed for automotive body electronics. Its electrical specifications-including voltage regulator behavior, LVD thresholds, and Flash endurance-are validated across this extended temperature range and automotive supply conditions.
MC9S12T64MPKE16 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- EBI/EMI, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 59
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12T64MPKE16 FAQ
1.How can I place an order for MC9S12T64MPKE16 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12T64MPKE16 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12T64MPKE16 reliable?
The price and inventory of MC9S12T64MPKE16 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12T64MPKE16 is usually 5 days.
3.What payment methods are accepted for MC9S12T64MPKE16?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12T64MPKE16 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12T64MPKE16?
MC9S12T64MPKE16 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12T64MPKE16 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12T64MPKE16?
For technical support, including MC9S12T64MPKE16 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12T64MPKE16 requirements.
6.How does Aetrix verify that MC9S12T64MPKE16 is sourced from the original manufacturer or authorized distributors?
All MC9S12T64MPKE16 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12T64MPKE16 meets industry standards.
7.What is the process for return or replacement of MC9S12T64MPKE16?
All MC9S12T64MPKE16 units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12T64MPKE16, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12T64MPKE16 part is unused and in its original packaging.
Return procedure for MC9S12T64MPKE16:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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