Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MC9S12XDP512CAG

Part No.:
MC9S12XDP512CAG
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixMC9S12XDP512CAG.pdf
Description:
IC MCU 16BIT 512KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:809

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MC9S12XDP512CAG from NXP (formerly Freescale) is a 16-bit HCS12X microcontroller featuring a 50 MHz S12X CPU core, 512 KB on-chip Flash memory, 32 KB RAM, and integrated XGATE co-processor for offloading real-time tasks. It includes dual 10-bit ATD converters (16-channel + 8-channel), 8-channel PWM, 6 SCI/UART interfaces, 3 SPI modules, I²C, CAN 2.0B controller, and enhanced ECT timer - deployed in automotive engine control units and industrial motor drives.

For engineers reviewing the MC9S12XDP512CAG datasheet, MC9S12XDP512CAG pinout, MC9S12XDP512CAG application, or MC9S12XDP512CAG equivalent, key selection criteria include its 112-pin LQFP package, 5V-tolerant I/O, 3.13–5.5 V operating range, CAN+SCI+PWM concurrency, and maskset-specific XGATE memory allocation (30 KB shared with CPU).

Technical Context

The MC9S12XDP512CAG implements a dual-core architecture: the main S12X CPU executes application firmware while the XGATE RISC co-processor handles time-critical peripheral servicing (e.g., ATD conversions, CAN message framing, PWM updates) via interrupt-driven threads. Its clock system supports multiple sources - external crystal (1–8 MHz), internal RC oscillator, or PLL-synthesized up to 50 MHz - with configurable dividers and fail-safe clock monitor.

Peripheral integration follows a modular port-based design: DP512 derivative includes dedicated PIM (Port Integration Module) supporting 91 digital I/O pins, 16 analog inputs, 8 PWM outputs, and 6 independent SCI modules - all mapped into a unified 64 KB linear register space with bank-switched memory expansion.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreS12X 16-bit CISC core, 50 MHz max frequency - enables deterministic real-time execution with 1–3 cycle instruction timing.
Flash Memory512 KB on-chip Flash (S12XFTX512K4V2 module) - supports in-application programming (IAP) and EEPROM emulation.
RAM32 KB on-chip RAM (including 2 KB XGATE-local RAM) - provides low-latency data storage for CPU and XGATE threads.
Analog InputsDual ATD: ATD0 (16-channel, 10-bit), ATD1 (8-channel, 10-bit) - supports simultaneous sampling and hardware-triggered conversion sequences.
Communication6 × SCI, 3 × SPI, 1 × I²C, 1 × MSCAN - enables multi-bus vehicle networking with concurrent UART diagnostics and CAN bus control.
PWM & Timers8-channel PWM (S12PWM8B8CV1), 8-channel ECT (S12ECT16B8CV2) - delivers precise motor phase control and capture of encoder/tachometer signals.
Operating Voltage3.13 V to 5.5 V - allows direct interface with 5 V sensors, actuators, and legacy automotive subsystems without level-shifting.
Package112-pin LQFP (16 × 16 mm, 0.4 mm pitch) - compatible with standard reflow processes and supports high I/O density for complex control applications.

Pinout & Package

MC9S12XDP512CAG is housed in a 112-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, rated for −40°C to +105°C operation. Pin functions are defined per the DP512 Port Integration Module (S12XDP512PIMV2), supporting multiplexed digital I/O, analog inputs, and dedicated peripheral signals.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSMain power supply and groundCore logic supply (VDD = 3.13–5.5 V); separate VDDA/VSSA pins provide noise-isolated analog domain for ATD reference stability.
EXTAL / XTALCrystal oscillator input/outputSupports fundamental-mode quartz crystals (1–8 MHz); internal load capacitors eliminate need for external caps in basic configurations.
RESETActive-low reset inputAsynchronous reset assertion clears CPU registers, disables peripherals, and forces boot vector fetch from Flash address 0xFFFE.
PORTA[7:0]General-purpose I/O / ATD0 inputsMultiplexed 8-bit port; default function as ATD0 analog inputs (AN0–AN7); software-configurable as digital I/O with pull-up enable.
PORTH[7:0]PWM output / SCI TX/RXProvides PWM0–PWM7 outputs and SCI0–SCI5 signal routing; pin direction and alternate function selected via PTHDDR and PTHSEL registers.
CANRX / CANTXCAN 2.0B physical layer interfaceDifferential receive/transmit lines connected to internal MSCAN controller - require external CAN transceiver (e.g., TJA1042) for bus coupling.

Key Features

FeatureDesign Value
XGATE co-processorIndependent 16-bit RISC engine with 30 KB shared RAM - executes up to 8 priority-based threads to offload CPU from ISR overhead in CAN/ATD/PWM contexts.
Dual ATD convertersATD0 (16 ch) and ATD1 (8 ch), each with 10-bit resolution, configurable sample-and-hold, and hardware trigger chaining - enables synchronized multi-sensor acquisition for closed-loop control.
6 SCI modulesFull-duplex UARTs with independent baud rate generators, LIN-break detection, and automatic wakeup - supports simultaneous OBD-II diagnostics, bootloader communication, and sensor telemetry streams.
MSCAN controllerFull CAN 2.0B compliance with 64-message object buffers, acceptance filtering, and time-triggered communication mode - meets ISO 11898-1 requirements for automotive networks.
Security moduleS12X9SECV2 block with flash protection, backdoor key access, and mass erase disable - prevents unauthorized firmware readout or modification in production ECUs.
Background DebugS12XBDMV2 interface with single-wire BDM protocol - enables non-intrusive debugging, flash programming, and real-time variable monitoring without halting CPU execution.

Applications

Engine Control Unit (ECU)Industrial Motor Drive

Use Scenario: Real-time management of fuel injection timing, spark advance, and air-fuel ratio feedback using crank/cam position sensors and oxygen sensors.

IC Role / Device Role / Timing Role: Primary controller executing PID loops at 10 ms intervals; XGATE handles ATD sampling, CAN message assembly, and PWM generation for injector drivers.

Use Value: 512 KB Flash stores calibration maps and diagnostic routines; dual ATD enables simultaneous wideband O2 and MAP sensor reads within one 100 µs window.

Use Scenario: Closed-loop speed and torque control of 3-phase AC induction motors in HVAC blowers and conveyor systems.

IC Role / Device Role / Timing Role: Central motion controller coordinating 8-channel PWM outputs, quadrature encoder capture, and RS-485 Modbus communication.

Use Value: ECT timer measures encoder edges with 25 ns resolution; 6 SCI ports allow daisy-chained drive configuration and remote HMI integration.

Body Control Module (BCM)Off-Highway Vehicle Telematics

Use Scenario: Consolidated control of lighting, door locks, window lifts, and climate actuators across distributed LIN/CAN subnets.

IC Role / Device Role / Timing Role: Network gateway and local actuator driver; MSCAN manages chassis CAN, while SCI0–SCI2 interface with LIN transceivers for body nodes.

Use Value: 91 GPIO pins support direct connection to relays, LEDs, and potentiometers; 5 V-tolerant I/O eliminates external buffer ICs for 12 V automotive signals.

Use Scenario: Remote monitoring and predictive maintenance of construction equipment using GPS, IMU, and engine health sensors.

IC Role / Device Role / Timing Role: Edge data aggregator running cellular modem control, CAN bus logging, and secure OTA update handler.

Use Value: XGATE threads manage CAN frame buffering and encryption; 32 KB RAM accommodates dual firmware images for safe field updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12XEP100MALSame S12X core, 1 MB Flash, 64 KB RAM, but 112-pin MAPBGA package and no XGATE co-processor.Lacks hardware-accelerated peripheral offload; requires CPU polling or higher-priority ISRs for ATD/CAN servicing.Select when larger Flash and RAM are needed but real-time thread isolation is not critical.
S912XEQ512J2MAANXP's later-generation S12XE derivative with identical pinout, 512 KB Flash, 32 KB RAM, and enhanced XGATE (32 KB local RAM).Improved XGATE memory map and debug features; backward-compatible register set but requires updated startup code.Select for new designs requiring extended lifecycle support and margin for future firmware growth.

Compared with MC9S12XDP512CAG, MC9S12XEP100MAL trades XGATE acceleration for doubled Flash/RAM capacity in a different package, while S912XEQ512J2MAA retains full functional equivalence with upgraded XGATE resources and long-term availability - making it the preferred drop-in upgrade path.

Availability

MC9S12XDP512CAG is available at Aetrix Electronics and suitable for automotive engine control, industrial motor drives, body control modules, and off-highway telematics requiring stable component supply across extended product lifecycles.

Supply support for MC9S12XDP512CAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S12XDP512CAG belongs to the HCS12X family - engineered for deterministic real-time control in harsh environments, with emphasis on automotive powertrain, chassis, and body electronics where functional safety and long-term supply stability are critical.

FAQ

What is the maximum operating frequency of the MC9S12XDP512CAG?

The MC9S12XDP512CAG supports a maximum CPU bus frequency of 50 MHz, achieved via its integrated PLL that multiplies an external crystal (1–8 MHz) or internal RC oscillator. This frequency is sustained across the full temperature range (−40°C to +105°C) and supply voltage (3.13–5.5 V), enabling consistent real-time performance in engine control and motor drive applications where timing predictability is essential. The MC9S12XDP512CAG achieves this without external clock conditioning circuitry.

Does the MC9S12XDP512CAG include a hardware co-processor?

Yes, the MC9S12XDP512CAG integrates the XGATE co-processor - a 16-bit RISC engine with dedicated instruction set and 30 KB of shared RAM. It operates independently of the main S12X CPU and handles time-critical peripheral tasks such as ATD conversion sequencing, CAN message transmission/reception, and PWM reload updates - reducing CPU ISR latency and improving deterministic response. This capability is confirmed in Chapter 6 of the MC9S12XDP512CAG datasheet (Rev. 2.21).

What communication interfaces are supported by the MC9S12XDP512CAG?

The MC9S12XDP512CAG supports six serial communication interfaces: six SCI modules (UART), three SPI modules, one I²C module, and one fully compliant CAN 2.0B controller (MSCAN). These are physically routed across PORTH, PORTJ, PORTK, and PORTL pins and share common register structures for initialization and status handling. The MC9S12XDP512CAG uses these interfaces concurrently - for example, CAN for vehicle bus communication, SCI0 for diagnostics, and SPI for external EEPROM or display driver interfacing.

What is the Flash memory size and endurance specification for the MC9S12XDP512CAG?

The MC9S12XDP512CAG contains 512 KB of on-chip Flash memory (S12XFTX512K4V2 module), rated for a minimum of 10,000 write/erase cycles and data retention of 10 years at 85°C. It supports in-application programming (IAP) via the Flash command interface, enabling field firmware updates and EEPROM emulation. This Flash capacity is verified in Appendix E (Derivative Differences) and Chapter 27 of the MC9S12XDP512CAG datasheet (Rev. 2.21).

Is the MC9S12XDP512CAG pin-compatible with other S12X derivatives?

The MC9S12XDP512CAG uses a 112-pin LQFP package with a defined pinout specified in Chapter 1 (Device Overview) and Appendix B (Package Information) of its datasheet. While several S12X derivatives (e.g., MC9S12XEP100, S912XEQ512) share the same 112-pin footprint, pin compatibility is not guaranteed across all signals due to differences in peripheral mapping and alternate function assignments. For example, PORTK pin usage varies between DP512 and EP100 derivatives - thus PCB layout must be validated against the specific MC9S12XDP512CAG signal list.

MC9S12XDP512CAG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
HCS12X
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 24x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12XDP512CAG FAQ

1.How can I place an order for MC9S12XDP512CAG through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12XDP512CAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12XDP512CAG reliable?

The price and inventory of MC9S12XDP512CAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XDP512CAG is usually 5 days.

3.What payment methods are accepted for MC9S12XDP512CAG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XDP512CAG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S12XDP512CAG?

MC9S12XDP512CAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12XDP512CAG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12XDP512CAG?

For technical support, including MC9S12XDP512CAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XDP512CAG requirements.

6.How does Aetrix verify that MC9S12XDP512CAG is sourced from the original manufacturer or authorized distributors?

All MC9S12XDP512CAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XDP512CAG meets industry standards.

7.What is the process for return or replacement of MC9S12XDP512CAG?

All MC9S12XDP512CAG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XDP512CAG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12XDP512CAG part is unused and in its original packaging.

Return procedure for MC9S12XDP512CAG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S12XDP512CAG Tags

  • MC9S12XDP512CAG
  • MC9S12XDP512CAG PDF
  • MC9S12XDP512CAG Datasheet
  • MC9S12XDP512CAG Specifications
  • MC9S12XDP512CAG Images
  • NXP Semiconductors
  • NXP Semiconductors MC9S12XDP512CAG
  • Buy MC9S12XDP512CAG
  • MC9S12XDP512CAG Price
  • MC9S12XDP512CAG Distributor
  • MC9S12XDP512CAG Supplier
  • MC9S12XDP512CAG Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER