Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MC9S12XDP512VAL

Part No.:
MC9S12XDP512VAL
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-LQFP
Datasheet:
AetrixMC9S12XDP512VAL.pdf
Description:
IC MCU 16BIT 512KB FLASH 112LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:718

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MC9S12XDP512VAL from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12X microcontroller featuring a dual-core architecture with S12X CPU and XGATE co-processor, 512 KB on-chip Flash memory, 32 KB RAM, and integrated peripherals including dual ATD converters (10-bit, 16-channel + 8-channel), 8-channel PWM, 6x SCI, 3x SPI, I²C, MSCAN, and ECT timer. It targets automotive body control modules requiring deterministic real-time response and functional safety support.

For engineers reviewing the MC9S12XDP512VAL datasheet, MC9S12XDP512VAL pinout, MC9S12XDP512VAL application, or MC9S12XDP512VAL equivalent, key selection criteria include its 112-pin LQFP package, 50 MHz core clock capability, dual-voltage operation (VDD = 4.5–5.5 V, VDDA = 3.15–3.6 V), XGATE offloading for interrupt-intensive tasks, and AEC-Q100 qualification suitability for under-hood applications.

Technical Context

The MC9S12XDP512VAL implements a pipelined S12X CPU core with 5-stage instruction execution and enhanced addressing modes, coupled with an independent 32-bit RISC XGATE co-processor that handles peripheral interrupts and DMA-like data movement without CPU intervention. Its memory subsystem includes 512 KB of single-cycle Flash with EEPROM emulation, 32 KB of SRAM, and configurable XGATE-accessible memory partitions.

Peripherals are tightly integrated via a crossbar switch: two 10-bit ATD converters support simultaneous sampling with external trigger synchronization; six serial communication interfaces (SCI) enable multi-node diagnostics and gateway functions; and the MSCAN module complies with ISO 11898-1 (CAN 2.0B) for robust vehicle network communication.

Key Specifications

Parameter Value and Actual Design Meaning
Core ArchitectureS12X 16-bit CPU + XGATE 32-bit RISC co-processor for parallel peripheral handling
Flash Memory512 KB on-chip Flash with 100k-cycle endurance and 10-year data retention at 85°C
RAM32 KB on-chip SRAM, with 8 KB XGATE-dedicated space and ECC-capable regions
ADC Resolution & ChannelsDual ATD: ATD0 (10-bit, 16-channel), ATD1 (10-bit, 8-channel), both with hardware-triggered sequencing
PWM Outputs8-channel 8-bit PWM with center-aligned/edge-aligned modes, dead-time insertion, and fault protection input
CAN InterfaceOne MSCAN module compliant with ISO 11898-1, supporting CAN 2.0B protocol with 32 message objects
Package112-pin LQFP (16 × 16 mm, 0.4 mm pitch), RoHS-compliant, moisture sensitivity level 3

Pinout & Package

MC9S12XDP512VAL is housed in a 112-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, optimized for automotive PCB thermal management and reflow compatibility. Pin assignments follow the DP512 derivative-specific signal mapping defined in Chapter 22 of the datasheet.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS (x12)Power supply and ground distributionDedicated analog/digital power pairs minimize noise coupling; VDDA/VSSA isolated for ATD reference stability
EXTAL / XTALClock oscillator input/outputDrives Pierce oscillator circuit for primary system clock; supports crystal (4–33 MHz) or external clock source
RESETActive-low reset inputAsynchronous reset assertion clears CPU registers, disables peripherals, and forces boot vector fetch
PORTA[7:0]General-purpose I/O with interrupt capability8-bit bidirectional port with configurable pull-up, used for wake-up inputs or discrete control signals
MSCAN_TX / MSCAN_RXCAN bus physical layer interfaceDifferential transmit/receive pins connected to external CAN transceiver (e.g., TJA1042)
SCI0_TX / SCI0_RXAsynchronous serial communication channel 0Full-duplex UART interface for bootloader communication or diagnostic port (ISO 9141/KWP2000 compatible)

Key Features

Feature Design Value
XGATE Co-ProcessorOffloads time-critical ISR execution (e.g., ATD conversion completion, PWM reload) from main CPU, reducing latency by up to 70% vs. software-only handling
Dual ATD ConvertersSimultaneous sampling across 24 analog channels with synchronized start triggers enables precise motor phase current measurement
Background Debug Module (BDM)Single-wire debug interface supporting full-speed execution control, register inspection, and Flash programming without dedicated JTAG pins
Memory Protection Unit (MPU)Configurable region-based access control prevents accidental writes to protected Flash sectors or critical RAM areas during runtime
Low-Power ModesFour selectable stop modes (STOP1–STOP4) with wake-up on CAN message, SCI activity, or external interrupt - typical current < 50 µA in STOP3

Applications

Body Control Module (BCM) Engine Control Unit (ECU) Subsystem

Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in modern passenger vehicles.

IC Role / Device Role / Timing Role: Primary MCU managing discrete I/O, PWM fan speed control, LIN gateway functions, and CAN message routing between sub-nodes.

Use Value: Integrated 8-channel PWM eliminates external driver ICs for blower motors; dual ATD enables simultaneous cabin temperature and humidity sensing.

Use Scenario: Secondary controller for throttle actuator positioning, fuel pump monitoring, or exhaust gas recirculation (EGR) valve control within Tier 1 powertrain systems.

IC Role / Device Role / Timing Role: Safety-relevant node executing ASIL-B level diagnostics, sensor signal conditioning, and closed-loop position control using ECT timer capture inputs.

Use Value: XGATE handles high-frequency PWM updates and ATD sampling independently, ensuring deterministic 100 µs control loop timing even under heavy CAN traffic.

Advanced Driver Assistance Systems (ADAS) Sensor Hub Commercial Vehicle Telematics Gateway

Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before forwarding to central ADAS domain controller.

IC Role / Device Role / Timing Role: Real-time data fusion engine performing timestamp alignment, basic filtering, and CAN FD message packaging.

Use Value: Dual SCI interfaces support simultaneous connection to radar (UART) and camera (RS-232), while MSCAN routes fused data to vehicle backbone.

Use Scenario: Fleet management gateway collecting GPS, engine diagnostics (J1939), and driver behavior data for cloud transmission via cellular modem.

IC Role / Device Role / Timing Role: Protocol translator bridging J1939 CAN, LIN, and RS-485 telemetry buses with internal Flash-based logging buffer.

Use Value: 512 KB Flash stores >72 hours of J1939 parameter group history; BDM interface enables field firmware updates without disassembly.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S912XDP512F0MLHSame silicon maskset (1L15Y), identical peripheral set and memory map, but rated for -40°C to +125°C industrial temp range vs. VAL's -40°C to +105°CPreferred for under-hood engine bay placement where ambient exceeds 105°CSelect S912XDP512F0MLH when extended temperature operation is required; pinout and software are identical.
MC9S12XEP100MAL100-pin LQFP variant with reduced Flash (1 MB vs. 512 KB), no XGATE, and fewer SCI/SPI modules; shares same S12X core and toolchainSuitable for cost-sensitive entry-level ECUs where XGATE offload and dual ATD are not neededChoose MC9S12XEP100MAL only if design can accommodate reduced peripheral count and lacks XGATE dependency.

Compared with MC9S12XDP512VAL, S912XDP512F0MLH offers extended temperature tolerance without architectural trade-offs, while MC9S12XEP100MAL sacrifices XGATE acceleration and analog channel density to reduce footprint and BOM cost - making the VAL variant optimal for balanced performance, integration, and thermal margin in mid-tier automotive modules.

Availability

MC9S12XDP512VAL is available at Aetrix Electronics and suitable for automotive body electronics, powertrain subsystems, and commercial vehicle telematics requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant traceability.

Supply support for MC9S12XDP512VAL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade microcontrollers and functional safety certification.

The MC9S12XDP512VAL belongs to the HCS12X family, designed specifically for cost-sensitive yet performance-demanding automotive electronic control units where real-time determinism, peripheral integration, and ASIL-ready features are essential.

FAQ

What is the maximum operating frequency of the MC9S12XDP512VAL?

The MC9S12XDP512VAL supports a maximum core clock frequency of 50 MHz, achieved via its internal PLL with programmable multiplication factor (×1 to ×32) and external crystal or oscillator input ranging from 4 to 33 MHz. This allows flexible clock tree configuration while maintaining timing compliance for all on-chip peripherals including ATD, PWM, and CAN modules.

Does the MC9S12XDP512VAL include hardware security features?

Yes, the MC9S12XDP512VAL integrates a Security Module (S12X9SECV2) supporting flash memory protection via block locking, backdoor key access prevention, and secure boot verification. It also provides write-protection for critical registers and supports user-defined security states to prevent unauthorized firmware modification or debugging access.

Can the XGATE co-processor in the MC9S12XDP512VAL execute code from external memory?

No, the XGATE co-processor in the MC9S12XDP512VAL can only execute code from on-chip RAM or designated XGATE-accessible Flash regions - it has no external bus interface. All XGATE program code must be loaded into internal memory during initialization, and its 32 KB address space is strictly limited to internal S12X memory map segments.

What is the purpose of the VDDA and VSSA pins on the MC9S12XDP512VAL?

The VDDA and VSSA pins on the MC9S12XDP512VAL supply dedicated analog power (3.15–3.6 V) and ground to the ATD converters and internal voltage references. Separating analog and digital supplies minimizes switching noise coupling into sensitive analog circuits, ensuring 10-bit ADC accuracy remains within ±1 LSB integral nonlinearity over temperature and supply variations.

Is the MC9S12XDP512VAL pin-compatible with other S12XD derivatives like the MC9S12XDP256?

No, the MC9S12XDP512VAL is not pin-compatible with MC9S12XDP256 despite sharing the same 112-pin LQFP package. Differences in peripheral mapping - particularly the number of available ATD channels, SCI modules, and XGATE memory partitioning - result in distinct pin functions for several signals, requiring PCB redesign for substitution.

MC9S12XDP512VAL Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-LQFP
Series:
HCS12X
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12XDP512VAL FAQ

1.How can I place an order for MC9S12XDP512VAL through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12XDP512VAL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12XDP512VAL reliable?

The price and inventory of MC9S12XDP512VAL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XDP512VAL is usually 5 days.

3.What payment methods are accepted for MC9S12XDP512VAL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XDP512VAL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S12XDP512VAL?

MC9S12XDP512VAL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12XDP512VAL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12XDP512VAL?

For technical support, including MC9S12XDP512VAL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XDP512VAL requirements.

6.How does Aetrix verify that MC9S12XDP512VAL is sourced from the original manufacturer or authorized distributors?

All MC9S12XDP512VAL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XDP512VAL meets industry standards.

7.What is the process for return or replacement of MC9S12XDP512VAL?

All MC9S12XDP512VAL units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XDP512VAL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12XDP512VAL part is unused and in its original packaging.

Return procedure for MC9S12XDP512VAL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S12XDP512VAL Tags

  • MC9S12XDP512VAL
  • MC9S12XDP512VAL PDF
  • MC9S12XDP512VAL Datasheet
  • MC9S12XDP512VAL Specifications
  • MC9S12XDP512VAL Images
  • NXP Semiconductors
  • NXP Semiconductors MC9S12XDP512VAL
  • Buy MC9S12XDP512VAL
  • MC9S12XDP512VAL Price
  • MC9S12XDP512VAL Distributor
  • MC9S12XDP512VAL Supplier
  • MC9S12XDP512VAL Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER