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NXP Semiconductors MC9S12XDT256CAL
- Part No.:
- MC9S12XDT256CAL
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12XDT256CAL.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 112LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:280
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Product details
Overview
MC9S12XDT256CAL from NXP (formerly Freescale) is a 16-bit HCS12X microcontroller featuring a dual-core architecture with S12X CPU and XGATE co-processor, 256 KB on-chip flash memory, 14 KB RAM, and integrated peripherals including dual 10-bit ATD converters (16-channel + 8-channel), 8-channel PWM, 6x SCI, 3x SPI, I²C, CAN 2.0B, and ECT timer. It targets automotive body control modules requiring deterministic real-time response.
For engineers reviewing the MC9S12XDT256CAL datasheet, MC9S12XDT256CAL pinout, MC9S12XDT256CAL application, or MC9S12XDT256CAL equivalent, key selection criteria include XGATE offload capability for interrupt-intensive tasks, 5V-tolerant I/O for legacy automotive harness compatibility, maskset-specific EEPROM endurance (100k cycles), and qualification to AEC-Q100 Grade 2 (−40°C to +105°C).
Technical Context
The MC9S12XDT256CAL implements the S12X CPU core with 16-bit CISC architecture and 25 MHz maximum bus frequency, paired with an independent 32-bit RISC XGATE co-processor capable of handling up to 16 concurrent threads. Its memory subsystem includes 256 KB flash (organized in 2×128 KB banks), 14 KB RAM (8 KB general-purpose + 6 KB XGATE-only), and 2 KB EEPROM with configurable sector protection.
Peripheral integration follows the S12XD family specification: dual ATD converters support simultaneous sampling with hardware-triggered sequencing; the enhanced capture timer (ECT) provides 8 input-capture/output-compare channels with programmable prescalers; and the MSCAN module supports full CAN 2.0B protocol with 16 message buffers and flexible acceptance filtering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | S12X 16-bit CISC core with 25 MHz max bus frequency; enables deterministic real-time execution for safety-critical automotive functions. |
| XGATE Co-processor | 32-bit RISC engine with 16-thread scheduler; offloads time-critical ISR handling (e.g., CAN message processing) from main CPU. |
| Flash Memory | 256 KB on-chip flash (2×128 KB banks); supports in-application programming (IAP) and secure erase for OTA updates. |
| RAM | 14 KB total RAM (8 KB CPU-accessible + 6 KB XGATE-exclusive); enables low-latency data exchange between cores without bus contention. |
| Analog-to-Digital | Dual ATD: ATD0 (16-channel, 10-bit, 7 µs conversion) + ATD1 (8-channel, 10-bit); supports synchronized sampling for motor current sensing. |
| PWM Outputs | 8-channel PWM with center-aligned/edge-aligned modes, dead-time insertion, and fault protection; suitable for BLDC motor control. |
| Communication | 6× SCI, 3× SPI, 1× I²C, 1× MSCAN (CAN 2.0B); enables multi-bus vehicle network integration (LIN gateway, CAN node, sensor interface). |
Pinout & Package
MC9S12XDT256CAL is housed in a 112-pin LQFP (16×16 mm, 0.4 mm pitch) package with 91 general-purpose I/O pins, 5 dedicated power/ground pins (VDD, VSS, VDDA, VSSA, VREG), and 16 dedicated peripheral pins (XTAL/EXTAL, RESET, COP, CANH/CANL, etc.). Pin assignments follow S12XD family standard layout per Appendix B of Rev. 2.21 datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PORTA[7:0] | General-purpose I/O / ATD0 analog inputs | 8-bit port configurable as digital I/O or analog inputs AN0–AN7 for ATD1; supports internal pull-up and slew-rate control. |
| PORTB[7:0] | General-purpose I/O / ATD0 analog inputs | 8-bit port supporting AN8–AN15 for ATD0; includes hysteresis for noise immunity in automotive environments. |
| PORTC[7:0] | General-purpose I/O / SCI0/SCI1 signals | 8-bit port multiplexed with SCI0 TX/RX and SCI1 TX/RX; enables dual UART communication with software-selectable baud rates. |
| PORTD[7:0] | General-purpose I/O / PWM outputs | 8-bit port assigned to PWM0–PWM7; supports complementary output mode with programmable dead time for half-bridge drivers. |
| PORTK[7:0] | General-purpose I/O / CAN signals | 8-bit port including CANH/CANL differential pair; integrates termination resistors and ESD protection per ISO 11898-2. |
Key Features
| Feature | Design Value |
|---|---|
| XGATE co-processor | Offloads up to 16 concurrent ISRs (e.g., CAN receive, ATD completion) from main CPU, reducing worst-case interrupt latency by >60%. |
| Dual ATD converters | ATD0 (16-channel) and ATD1 (8-channel) operate independently with shared trigger sources, enabling synchronized sampling across two sensor domains. |
| MSCAN module | Full CAN 2.0B controller with 16 message buffers, hardware ID filtering, and automatic retransmission-meets ISO 11898-1 timing requirements. |
| Voltage regulator | On-chip 3.3 V regulator (S12VREG3V3V5) supplies internal logic; accepts 5 V ±10% input, eliminating need for external LDO in 5 V systems. |
| Security features | Flash security byte, backdoor key access, and COP watchdog with windowed timeout prevent unauthorized firmware access and ensure safe reset behavior. |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) Subsystem |
|---|---|
Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC in mid-tier passenger vehicles. IC Role / Device Role / Timing Role: Main controller executing body domain software stack with real-time scheduling of LIN slave nodes and CAN gateway functions. Use Value: XGATE handles LIN frame assembly/disassembly and CAN message routing concurrently, freeing S12X CPU for higher-layer diagnostics and feature logic. | Use Scenario: Secondary control node for throttle actuator, fuel pump driver, or turbocharger VGT control in distributed engine management systems. IC Role / Device Role / Timing Role: Safety-relevant subsystem controller interfacing with main ECU via CAN, performing closed-loop PWM control with <5 µs jitter tolerance. Use Value: Dual ATD converters sample current and voltage simultaneously for FOC motor control; 8-channel PWM with dead-time insertion ensures safe gate drive timing. |
| Advanced Lighting Control | Industrial Motor Drive Interface |
Use Scenario: Adaptive front-lighting system (AFS) with dynamic beam shaping using multiple LED arrays and stepper motors. IC Role / Device Role / Timing Role: Real-time motion controller coordinating PWM dimming, position feedback via quadrature encoder, and CAN-based configuration updates. Use Value: ECT timer captures encoder edges with 25 ns resolution; XGATE processes position interrupts while S12X runs PID loop at 1 kHz. | Use Scenario: Retrofit interface board connecting legacy 3-phase AC motors to modern PLC networks via Modbus RTU over RS-485. IC Role / Device Role / Timing Role: Protocol converter translating Modbus commands into PWM output and analog feedback signals (0–10 V, 4–20 mA). Use Value: Integrated 10-bit ATD measures motor current/voltage; SCI0/SCI1 support dual RS-485 transceivers for master/slave operation without external UART expansion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12XDP512MAL | 512 KB flash, 32 KB RAM, identical peripheral set and pinout; requires larger PCB footprint due to same 112-pin LQFP but higher memory density. | Targeted at complex gateway ECUs requiring larger bootloader and diagnostic stacks; not drop-in due to flash layout differences affecting linker scripts. | Select when future firmware growth exceeds 256 KB or when dual CAN channels are required (DP512 supports two MSCAN modules). |
| S912XDG128F0MLH | 128 KB flash, 8 KB RAM, same S12X core and XGATE; lacks second ATD converter and one SCI channel; uses 80-pin LQFP package. | Suitable for cost-sensitive entry-level modules where single ATD suffices and CAN+LIN combo is sufficient; reduced I/O count limits sensor expansion. | Choose for simplified designs with lower memory and peripheral requirements; verify pin mapping changes affect PCB layout and firmware I/O initialization. |
Compared with MC9S12XDT256CAL, MC9S12XDP512MAL offers scalable memory for evolving diagnostics, while S912XDG128F0MLH reduces BOM cost and board area at the expense of analog acquisition flexibility and communication bandwidth.
Availability
MC9S12XDT256CAL is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor interfaces, and advanced lighting control systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified silicon.
Supply support for MC9S12XDT256CAL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in MCU, RF, and analog technologies.
The S12X family-including MC9S12XDT256CAL-is designed for deterministic real-time control in harsh automotive environments, emphasizing functional safety, EMC robustness, and seamless integration with legacy 5 V vehicle electrical architectures.
FAQ
What is the maximum operating temperature range for the MC9S12XDT256CAL?
The MC9S12XDT256CAL is qualified to AEC-Q100 Grade 2, supporting continuous operation from −40°C to +105°C ambient temperature. This rating is verified per JEDEC JESD22-A108 and applies to the full 112-pin LQFP package variant, making it suitable for under-hood and cabin-mounted automotive modules where thermal cycling and extended temperature exposure occur.
Does the MC9S12XDT256CAL support in-system programming (ISP) via BDM?
Yes, the MC9S12XDT256CAL supports in-system programming through its Background Debug Module (BDM) interface using the standard 6-pin BDM connector. The BDM allows full read/write/erase access to flash and EEPROM, breakpoint insertion, and real-time register inspection without halting CPU execution-enabling field firmware updates and debug during development of MC9S12XDT256CAL-based systems.
How does the XGATE co-processor in the MC9S12XDT256CAL reduce interrupt latency?
The XGATE co-processor in the MC9S12XDT256CAL reduces interrupt latency by handling time-critical ISRs-such as CAN message reception, ATD conversion completion, or PWM fault detection-independently of the main S12X CPU. With dedicated 32-bit RISC execution and zero-wait-state local RAM, XGATE services interrupts in ≤1 µs, preventing CPU context-switch overhead and ensuring sub-microsecond response for safety-critical events in MC9S12XDT256CAL applications.
Can the MC9S12XDT256CAL operate with a single 5 V supply rail?
Yes, the MC9S12XDT256CAL operates from a single 5 V ±10% supply. Its integrated S12VREG3V3V5 voltage regulator generates a stable 3.3 V internal core voltage, eliminating the need for external regulators. All I/O pins are 5 V tolerant, allowing direct connection to legacy automotive sensors and actuators without level-shifting circuitry-simplifying design and reducing BOM cost for MC9S12XDT256CAL implementations.
What debugging interfaces are supported by the MC9S12XDT256CAL?
The MC9S12XDT256CAL supports two primary debugging interfaces: the Background Debug Module (BDM) for low-level hardware debugging, flash programming, and real-time register access via a 6-pin header; and the S12X Debug (S12XDBGV2/V3) module for advanced trace, instruction stepping, and memory inspection using Nexus Class 3+ compliant tools. Both interfaces are fully operational across all MC9S12XDT256CAL operating modes, including wait and stop.
MC9S12XDT256CAL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12X
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12X
- Core Size:
- 16-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12XDT256CAL FAQ
1.How can I place an order for MC9S12XDT256CAL through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12XDT256CAL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12XDT256CAL reliable?
The price and inventory of MC9S12XDT256CAL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XDT256CAL is usually 5 days.
3.What payment methods are accepted for MC9S12XDT256CAL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XDT256CAL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12XDT256CAL?
MC9S12XDT256CAL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12XDT256CAL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12XDT256CAL?
For technical support, including MC9S12XDT256CAL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XDT256CAL requirements.
6.How does Aetrix verify that MC9S12XDT256CAL is sourced from the original manufacturer or authorized distributors?
All MC9S12XDT256CAL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XDT256CAL meets industry standards.
7.What is the process for return or replacement of MC9S12XDT256CAL?
All MC9S12XDT256CAL units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XDT256CAL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12XDT256CAL part is unused and in its original packaging.
Return procedure for MC9S12XDT256CAL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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