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NXP Semiconductors MC9S12XDT256MAL

Part No.:
MC9S12XDT256MAL
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-LQFP
Datasheet:
AetrixMC9S12XDT256MAL.pdf
Description:
IC MCU 16BIT 256KB FLASH 112LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:217

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Product details

Overview

MC9S12XDT256MAL from NXP (formerly Freescale) is a 16-bit HCS12X microcontroller featuring a dual-core architecture with S12X CPU and XGATE coprocessor, 256 KB on-chip Flash, 14 KB RAM, and integrated CAN 2.0B, SPI, SCI, I²C, PWM, and 10-bit ADC with 16 channels. It operates at up to 50 MHz core frequency and targets automotive body control modules requiring deterministic real-time response.

For engineers reviewing the MC9S12XDT256MAL datasheet, MC9S12XDT256MAL pinout, MC9S12XDT256MAL application, or MC9S12XDT256MAL equivalent, key selection criteria include its 112-pin LQFP package, 5V-tolerant I/O, 3.3 V core supply, CAN interface compliance, and XGATE offloading capability for time-critical ISR handling in safety-critical embedded systems.

Technical Context

The MC9S12XDT256MAL implements the S12X CPU core with enhanced addressing modes and instruction set, paired with an independent XGATE RISC coprocessor supporting up to 8 concurrent threads. Its memory subsystem includes 256 KB Flash organized in 2-KB sectors, 14 KB RAM (8 KB general-purpose + 6 KB XGATE-only), and 2 KB EEPROM with 100K write cycles.

Peripheral integration includes two CAN 2.0B controllers, six SCI modules, three SPI interfaces, two I²C buses, 8-channel 8-bit PWM with center-aligned mode, and dual 10-bit ATD converters (ATD0: 16-channel, ATD1: 8-channel), all accessible via configurable port pins and supported by background debug module (BDM) for in-circuit emulation.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureS12X 16-bit CPU + XGATE 16-bit RISC coprocessor for parallel interrupt handling
Flash Memory256 KB on-chip Flash with 2-KB sector erase, 100K endurance, and 10 µs typical byte write
RAM14 KB total: 8 KB general-purpose RAM + 6 KB XGATE-exclusive RAM
CAN InterfacesTwo independent CAN 2.0B controllers supporting 1 Mbit/s baud rate and message buffering
ADC Resolution & ChannelsDual 10-bit ATD converters: ATD0 (16-channel, 8 µs conversion) and ATD1 (8-channel)
Operating Voltage5.0 V ±10% for I/O; 3.3 V ±5% for core/VDDA; supports 3.15–3.6 V analog reference range
Package112-pin LQFP (20 × 20 mm, 0.65 mm pitch), RoHS-compliant, industrial temperature grade (−40°C to +125°C)

Pinout & Package

MC9S12XDT256MAL is housed in a 112-pin Low-Profile Quad Flat Package (LQFP) with 0.65 mm lead pitch, designed for surface-mount reflow assembly and thermal performance in automotive under-hood environments.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDedicated digital power/ground pairs per quadrant; decoupling required within 10 mm of each pair
VDDA, VSSAAnalog power and groundIsolated analog supply domain for ATD converters; must be filtered separately from digital rails
EXTAL / XTALCrystal oscillator input/outputSupports 4–32 MHz crystal; internal load capacitors configurable via register; enables precision clock source
CAN0TX / CAN0RXCAN controller channel 0 differential I/ODirect connection to external CAN transceiver; compliant with ISO 11898-2 physical layer requirements
SCI0TX / SCI0RXSerial communication interface channel 0Asynchronous full-duplex UART interface; supports LIN 2.1 protocol via software configuration
PWM0–PWM7Pulse-width modulation outputsEight independent PWM channels with programmable period, duty cycle, and dead-time insertion

Key Features

FeatureDesign Value
XGATE coprocessorOffloads time-critical ISRs (e.g., CAN message handling, PWM updates) from main CPU, reducing latency to <1 µs
Background Debug Module (BDM)Single-wire debug interface enabling non-intrusive flash programming and real-time variable monitoring without halting CPU
Dual ATD convertersSimultaneous sampling across ATD0 and ATD1 allows synchronized multi-sensor acquisition (e.g., motor current + temperature)
Memory protection unit (MPU)Configurable region-based access control prevents accidental writes to protected Flash or critical RAM sections during runtime
Enhanced capture timer (ECT)16-bit timer with 8 input-capture/output-compare channels supports quadrature decoding and precise edge timing for motor control

Applications

Body Control Module (BCM)Engine Control Unit (ECU) Subsystem

Use Scenario: Centralized management of lighting, door locks, window lifts, and wiper systems in modern vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing real-time control logic, CAN message routing, and sensor fusion from discrete inputs.

Use Value: Integrated dual CAN controllers enable seamless communication with instrument cluster and powertrain networks while XGATE handles periodic diagnostics without CPU overhead.

Use Scenario: Secondary control node for throttle actuator, idle air control valve, or fuel pump driver in distributed engine management architectures.

IC Role / Device Role / Timing Role: Deterministic timing engine managing PWM-driven actuators with sub-microsecond jitter tolerance.

Use Value: 8-channel PWM with dead-time insertion and synchronized ATD sampling ensures precise closed-loop current regulation in brushless DC motor drivers.

Advanced HVAC ControllerIndustrial Motor Drive Interface

Use Scenario: Climate control system coordinating blower speed, blend door position, and cabin temperature feedback.

IC Role / Device Role / Timing Role: Sensor hub aggregating thermistor, humidity, and pressure data via ATD0/ATD1 while driving stepper motors via ECT-generated waveforms.

Use Value: Dual 10-bit ADCs with hardware-triggered conversions eliminate software polling delays, improving thermal response accuracy by >15%.

Use Scenario: Field-oriented control (FOC) interface board linking DSP-based motion controller to 3-phase inverter stage.

IC Role / Device Role / Timing Role: Real-time I/O coordinator translating high-level torque commands into isolated gate-drive signals and fault feedback.

Use Value: CAN 2.0B interface provides robust command transmission over noisy factory floors; 112-pin LQFP accommodates isolation components and heatsinking for 5V I/O drive capability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12XDP512MAL512 KB Flash, 32 KB RAM, same pinout and peripheral set; higher memory density for complex firmwareRequired where bootloader, OTA update partitioning, or expanded diagnostic logging is neededSelect when future firmware growth headroom exceeds 256 KB or dual CAN buffers require extended message FIFO depth
S912XEQ512J2MAGNXP S12XE family; 512 KB Flash, 32 KB RAM, enhanced ECT with 16-bit resolution, but no XGATE coprocessorLacks hardware-accelerated ISR offload; relies on CPU for all interrupt servicingChoose for cost-sensitive designs where deterministic low-latency interrupt response is not mandatory

Compared with MC9S12XDT256MAL, the MC9S12XDP512MAL offers scalable memory for evolving feature sets without PCB redesign, while the S912XEQ512J2MAG trades XGATE acceleration for simplified toolchain support and lower licensing costs in non-safety-critical applications.

Availability

MC9S12XDT256MAL is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control interfaces, and HVAC system design requiring stable component supply across extended production lifecycles.

Supply support for MC9S12XDT256MAL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive microcontrollers dating to Motorola's original 68HC11.

The MC9S12XDT256MAL belongs to the HCS12X family, engineered specifically for automotive body electronics and chassis control systems demanding ASIL-B capable real-time performance, functional safety support, and long-term industrial temperature operation.

FAQ

What is the maximum operating frequency of the MC9S12XDT256MAL?

The MC9S12XDT256MAL supports a maximum core clock frequency of 50 MHz when driven by its internal PLL, derived from an external crystal (4–32 MHz) or external clock source. This frequency enables deterministic execution of real-time control loops with sub-10 µs interrupt latency, critical for automotive body control applications where MC9S12XDT256MAL is commonly deployed.

Does the MC9S12XDT256MAL include built-in CAN controllers?

Yes, the MC9S12XDT256MAL integrates two fully compliant CAN 2.0B controllers supporting bit rates up to 1 Mbit/s, message filtering, and 16-message object buffers per controller. These controllers are used in vehicle networks for communication between body control modules and other ECUs, and MC9S12XDT256MAL leverages them without external transceivers - though physical layer drivers remain external.

What is the role of the XGATE coprocessor in the MC9S12XDT256MAL?

The XGATE coprocessor in MC9S12XDT256MAL is a dedicated 16-bit RISC engine that executes time-critical interrupt service routines independently of the main S12X CPU. It handles tasks like CAN message processing, PWM synchronization, and ATD result handling, reducing main CPU load and ensuring sub-microsecond response - a key capability distinguishing MC9S12XDT256MAL from standard HCS12 derivatives.

Can the MC9S12XDT256MAL operate with a single 5 V supply?

No - the MC9S12XDT256MAL requires separate 5.0 V ±10% for I/O and 3.3 V ±5% for the core and analog circuitry (VDDA). While I/O pins are 5 V tolerant, the internal regulator does not generate VDD from VDDIO; external 3.3 V regulation is mandatory. This dual-supply requirement ensures noise isolation and meets automotive voltage specification compliance for MC9S12XDT256MAL deployments.

Is the MC9S12XDT256MAL pin-compatible with other S12X derivatives?

MC9S12XDT256MAL is pin-compatible with other 112-pin LQFP S12X derivatives sharing the DT/P/Q/DQ suffix families (e.g., MC9S12XDP512MAL, MC9S12XDG128MAL), provided identical maskset revisions and peripheral enable configurations are used. However, memory size, XGATE allocation, and certain peripheral features vary - so firmware and layout validation against the specific MC9S12XDT256MAL datasheet remains essential.

MC9S12XDT256MAL Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-LQFP
Series:
HCS12X
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12XDT256MAL FAQ

1.How can I place an order for MC9S12XDT256MAL through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12XDT256MAL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12XDT256MAL reliable?

The price and inventory of MC9S12XDT256MAL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XDT256MAL is usually 5 days.

3.What payment methods are accepted for MC9S12XDT256MAL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XDT256MAL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S12XDT256MAL?

MC9S12XDT256MAL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12XDT256MAL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12XDT256MAL?

For technical support, including MC9S12XDT256MAL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XDT256MAL requirements.

6.How does Aetrix verify that MC9S12XDT256MAL is sourced from the original manufacturer or authorized distributors?

All MC9S12XDT256MAL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XDT256MAL meets industry standards.

7.What is the process for return or replacement of MC9S12XDT256MAL?

All MC9S12XDT256MAL units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XDT256MAL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12XDT256MAL part is unused and in its original packaging.

Return procedure for MC9S12XDT256MAL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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