NXP Semiconductors MC9S12XEP100CAG
- Part No.:
- MC9S12XEP100CAG
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MC9S12XEP100CAG.pdf
- Description:
- IC MCU 16BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:716
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Product details
Overview
MC9S12XEP100CAG from NXP (formerly Freescale) is a 16-bit automotive microcontroller featuring the CPU12X core, 1 MB Flash with ECC, 64 KB RAM, and 4 KB emulated EEPROM. It integrates five MSCAN modules, eight SCI interfaces, three SPI modules, dual 10-bit ATD converters (16-channel), and an enhanced XGATE co-processor running at 100 MHz. Designed for body control modules and gateway applications in vehicles operating from −40°C to 125°C.
For engineers reviewing the MC9S12XEP100CAG datasheet, MC9S12XEP100CAG pinout, MC9S12XEP100CAG application, or MC9S12XEP100CAG equivalent, key selection criteria include CAN mailbox scalability via XGATE, MPU-protected memory regions, IPLL spread-spectrum clocking for EMC compliance, and non-multiplexed external bus support in 208-pin MAPBGA packaging.
Technical Context
The MC9S12XEP100CAG implements a dual-processor architecture: the 50 MHz CPU12X core handles deterministic real-time tasks while the 100 MHz XGATE co-processor independently manages high-throughput peripheral servicing-including full CAN protocol stack execution, LIN frame generation, and DMA-like data movement-without CPU intervention or wait states.
System integrity is enforced through hardware-level mechanisms: an 8-region Memory Protection Unit (MPU) with 8-byte granularity, Flash ECC providing single-bit correction/double-bit detection, and a configurable windowed COP watchdog. Its IPLL supports frequency modulation to reduce electromagnetic emissions, and the on-chip voltage regulator enables stable 3.3 V/5.0 V operation across automotive temperature ranges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | CPU12X 16-bit core, instruction-compatible with S12 family (excluding five fuzzy instructions), enabling legacy code reuse. |
| Max Bus Frequency | 50 MHz CPU bus frequency; enables deterministic real-time response in safety-critical automotive control loops. |
| XGATE Performance | 100 MIPS RISC co-processor; offloads CAN/LIN/SCI interrupt handling and data movement from main CPU. |
| Flash Memory | 1 MB Flash with 64+8-bit ECC per word; ensures reliable firmware storage and runtime fault correction in harsh environments. |
| Operating Temp | −40°C to +125°C ambient range; qualified for under-hood and powertrain-adjacent automotive locations. |
| I/O Count | 152 general-purpose I/O pins; supports direct drive of power drivers, sensor inputs, and multi-bus communication interfaces. |
| Peripheral Set | 5 × MSCAN, 8 × SCI, 3 × SPI, 2 × ATD (16-channel), 8 × PWM channels; enables consolidated vehicle network gateway functionality. |
Pinout & Package
MC9S12XEP100CAG is housed in a 208-pin MAPBGA package (17 mm × 17 mm, case no. 1159A-01 issue B) with 0.8 mm ball pitch. The package supports non-multiplexed external bus interface, dedicated voltage regulator supply pins (VREGIN/VREGOUT), and separate analog/digital ground/power domains for noise isolation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Main digital power/ground | Supplies core logic; requires local decoupling for EMI suppression in automotive environments. |
| VREGIN, VREGOUT | On-chip voltage regulator input/output | Enables internal 3.3 V or 5.0 V regulation; separates I/O and core supply for optimized EMC filtering. |
| XTAL, EXTAL | Crystal oscillator connections | Supports 4–16 MHz Pierce crystal; feeds IPLL for precise, spread-spectrum clock generation. |
| RESET | Active-low reset input | Asynchronous reset with internal POR/LVD circuitry; initiates safe boot sequence after power-up or brownout. |
| BS, MODB, MODA | Boot mode selection | Determines startup source (internal Flash, external memory, or BDM); critical for production programming and field updates. |
| CAN0–CAN4_TX/RX | CAN transceiver I/O | Five independent differential CAN physical layer interfaces; each supports up to 1 Mbps and full CAN 2.0A/B protocol. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | 8 configurable address regions with 8-byte granularity; enforces no-write/no-execute policies and triggers NMI on violation. |
| Enhanced XGATE Coprocessor | Programmable in C; services all peripherals autonomously-enabling FULL-CAN with unlimited mailboxes and LIN master/slave operation. |
| ECC-Protected Flash | 64 data bits + 8 syndrome bits per word; corrects single-bit errors and detects double-bit faults during read/write cycles. |
| IPLL Spread Spectrum | Configurable frequency modulation of PLL output; reduces peak radiated emissions without external components. |
| Non-Multiplexed External Bus | Available only on 208-pin MAPBGA; supports glue-less interface to external RAM/Flash with programmable wait-state timing. |
Applications
| Body Control Module (BCM) | Vehicle Gateway |
|---|---|
|
Use Scenario: Centralized management of lighting, door locks, window lifts, and HVAC actuators in modern passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing real-time control logic, sensor polling, and driver output sequencing; synchronizes via internal RTI and API timers. Use Value: 152 GPIOs enable direct connection to power drivers and sensors; five CAN modules route messages between chassis, powertrain, and infotainment networks. |
Use Scenario: Protocol translation and message routing between CAN, LIN, and proprietary sub-buses in distributed automotive ECUs. IC Role / Device Role / Timing Role: Dual-role processor: CPU12X manages routing tables and diagnostics, while XGATE handles concurrent CAN/LIN frame processing. Use Value: FULL-CAN capability via XGATE eliminates CPU overhead; 8 SCI interfaces support legacy UART-based subsystems alongside LIN physical layer. |
| Chassis Domain Controller | Advanced Lighting Control |
|
Use Scenario: Integration point for brake-by-wire, steering assist, and suspension control signals requiring functional safety-aware data aggregation. IC Role / Device Role / Timing Role: Safety-monitoring node using MPU-protected memory partitions and windowed COP to isolate critical control tasks from diagnostics. Use Value: ECC Flash and MPU ensure ASIL-B compliant firmware integrity; −40°C to +125°C rating supports placement near engine compartments. |
Use Scenario: Adaptive LED headlight control with dynamic beam shaping, thermal monitoring, and PWM dimming across multiple zones. IC Role / Device Role / Timing Role: Real-time PWM generator with 8-channel 16-bit resolution and emergency shutdown input for fail-safe current limiting. Use Value: 8 × 16-bit PWM outputs drive high-side switches directly; dual ATD converters monitor LED junction temperature and supply voltage simultaneously. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XEP100J1M | Same die, but in 144-pin LQFP package with reduced I/O count (119 pins) and no external bus interface. | Limited to space-constrained gateways or body nodes where external memory expansion is unnecessary. | Select when board layout constraints prohibit 208-pin MAPBGA or external memory interfacing is not required. |
| MC9S12XDP512MAL | 512 KB Flash, 32 KB RAM, 4 CAN modules, no XGATE enhancement; older S12XD architecture without MPU or ECC. | Suitable for cost-sensitive legacy body modules lacking full CAN scalability or advanced memory protection. | Choose only for backward compatibility in existing designs where XGATE offload and MPU are not required. |
Compared with MC9S12XEP100CAG, S912XEP100J1M sacrifices external bus capability and I/O count for smaller footprint, while MC9S12XDP512MAL lacks both XGATE acceleration and hardware memory protection-making it unsuitable for new ASIL-B designs requiring runtime fault containment.
Availability
MC9S12XEP100CAG is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateway systems, and chassis domain controllers requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MC9S12XEP100CAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S12XEP100CAG belongs to the S12XE family-designed specifically for automotive multiplexing and body electronics, extending the S12X platform with enhanced system integrity features including MPU, ECC, and XGATE acceleration.
FAQ
What is the maximum operating temperature specification for the MC9S12XEP100CAG?
The MC9S12XEP100CAG is rated for operation from −40°C to +125°C ambient temperature. This specification is validated per AEC-Q100 Grade 1 requirements and applies to the 208-pin MAPBGA variant. The device maintains full functionality-including Flash ECC, XGATE operation, and CAN timing accuracy-across this full range, making it suitable for under-hood and power distribution module applications where thermal stress is critical.
Does the MC9S12XEP100CAG support full CAN protocol handling without CPU intervention?
Yes, the MC9S12XEP100CAG supports FULL-CAN capability when the XGATE co-processor is used in conjunction with its five integrated MSCAN modules. XGATE executes CAN message filtering, buffering, and protocol state management autonomously-freeing the CPU12X core for higher-layer diagnostics and control tasks. This configuration enables virtually unlimited mailbox counts and deterministic latency below 1 µs for critical frames.
How does the Memory Protection Unit (MPU) function in the MC9S12XEP100CAG?
The MC9S12XEP100CAG features an 8-region MPU with address granularity as low as 8 bytes. Each region can be configured with no-write, no-execute, or supervisor-only access attributes. On violation, the MPU triggers a non-maskable interrupt (NMI), allowing immediate fault containment. This hardware enforcement supports ISO 26262 ASIL-B software partitioning by isolating safety-critical tasks from non-critical firmware modules within the same chip.
What external memory interfaces does the MC9S12XEP100CAG support?
The MC9S12XEP100CAG supports a non-multiplexed external bus interface-but only in the 208-pin MAPBGA package. This interface provides glue-less connectivity to asynchronous SRAM, NOR Flash, and EPROM devices using programmable chip select timing and two independent wait-state generators. It is not available in LQFP or QFP variants, and requires proper PCB layout with controlled impedance traces and termination for reliable 50 MHz operation.
Is the MC9S12XEP100CAG pin-compatible with earlier S12X devices?
The MC9S12XEP100CAG is pin-compatible with other members of the S12XE family and maintains high-level compatibility with the S12XD family-but not with legacy S12D or S12G devices. Pin mapping matches the 208-pin MAPBGA footprint across S12XE derivatives (e.g., MC9S12XEP768), though signal assignments for unused peripherals may differ. Migration from S12XD requires validation of XGATE initialization and MPU configuration due to architectural enhancements.
MC9S12XEP100CAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- HCS12X
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12X
- Core Size:
- 16-Bit
- Speed:
- 50MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 119
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.72V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12XEP100CAG FAQ
1.How can I place an order for MC9S12XEP100CAG through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12XEP100CAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12XEP100CAG reliable?
The price and inventory of MC9S12XEP100CAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XEP100CAG is usually 5 days.
3.What payment methods are accepted for MC9S12XEP100CAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XEP100CAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12XEP100CAG?
MC9S12XEP100CAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12XEP100CAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12XEP100CAG?
For technical support, including MC9S12XEP100CAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XEP100CAG requirements.
6.How does Aetrix verify that MC9S12XEP100CAG is sourced from the original manufacturer or authorized distributors?
All MC9S12XEP100CAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XEP100CAG meets industry standards.
7.What is the process for return or replacement of MC9S12XEP100CAG?
All MC9S12XEP100CAG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XEP100CAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12XEP100CAG part is unused and in its original packaging.
Return procedure for MC9S12XEP100CAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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